KR20060076694A - 압전 소자, 압전 액츄에이터, 압전 펌프, 잉크젯식 기록헤드, 잉크젯 프린터, 표면 탄성파 소자, 박막 압전공진자, 주파수 필터, 발진기, 전자 회로 및 전자 기기 - Google Patents
압전 소자, 압전 액츄에이터, 압전 펌프, 잉크젯식 기록헤드, 잉크젯 프린터, 표면 탄성파 소자, 박막 압전공진자, 주파수 필터, 발진기, 전자 회로 및 전자 기기 Download PDFInfo
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- KR20060076694A KR20060076694A KR20050130155A KR20050130155A KR20060076694A KR 20060076694 A KR20060076694 A KR 20060076694A KR 20050130155 A KR20050130155 A KR 20050130155A KR 20050130155 A KR20050130155 A KR 20050130155A KR 20060076694 A KR20060076694 A KR 20060076694A
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- 239000010409 thin film Substances 0.000 title claims description 37
- 238000010897 surface acoustic wave method Methods 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 150000001875 compounds Chemical class 0.000 claims abstract description 23
- 239000013078 crystal Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 15
- 241000877463 Lanio Species 0.000 claims description 12
- 229910052746 lanthanum Inorganic materials 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052726 zirconium Inorganic materials 0.000 claims description 8
- 239000006104 solid solution Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910016062 BaRuO Inorganic materials 0.000 claims description 3
- 229910018921 CoO 3 Inorganic materials 0.000 claims description 3
- 229910004121 SrRuO Inorganic materials 0.000 claims description 3
- 229910003114 SrVO Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 387
- 239000002585 base Substances 0.000 description 25
- 230000005540 biological transmission Effects 0.000 description 21
- 238000010586 diagram Methods 0.000 description 16
- 238000012545 processing Methods 0.000 description 14
- 238000007639 printing Methods 0.000 description 13
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052758 niobium Inorganic materials 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 229910052745 lead Inorganic materials 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000001902 propagating effect Effects 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000003980 solgel method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910018575 Al—Ti Inorganic materials 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 229910002835 Pt–Ir Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- RPEUFVJJAJYJSS-UHFFFAOYSA-N zinc;oxido(dioxo)niobium Chemical compound [Zn+2].[O-][Nb](=O)=O.[O-][Nb](=O)=O RPEUFVJJAJYJSS-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
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- H10N30/708—
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
Abstract
Description
Claims (23)
- 기판과,상기 기판의 상방에 형성된 제1 도전층과,상기 제1 도전층의 상방에 형성된 페로브스카이트 구조를 갖는 압전체로 이루어지는 압전체층과,상기 압전체층에 전기적으로 접속된 제2 도전층을 포함하고,상기 제1 도전층은 (001)에 우선 배향하고 있는 랜턴계층 형상 페로브스카이트 화합물로 이루어지는 버퍼층을 1층 이상 포함하는 압전 소자.
- 제1항에 있어서, 상기 랜턴계층 형상 페로브스카이트 화합물은 La2NiO4, La3Ni2O7, La4Ni3O10 및 La2CuO4, 및 이들 중 적어도 2종류로 이루어지는 고용체 중 적어도 1종류를 포함하는 압전 소자.
- 제1항에 있어서, 상기 제1 도전층은 상기 랜턴계층 형상 페로브스카이트 화합물에 비해 비저항이 낮은 도전재로 이루어지는 저저항층을 1층 이상 포함하는 압전 소자.
- 제3항에 있어서, 상기 도전재는 금속, 상기 금속의 산화물 및 상기 금속으로 이루어지는 합금 중 적어도 1종류를 포함하고,상기 금속은 Pt, Ir, Ru, Ag, Au, Cu, Al 및 Ni 중 적어도 1종류인 압전 소자.
- 제3항에 있어서, 상기 제1 도전층은,상기 저저항층과,상기 저저항층의 상방에 형성된 상기 버퍼층을 포함하는 압전 소자.
- 제1항에 있어서, 상기 제1 도전층은,페로브스카이트 구조를 갖는 도전성 산화물로 이루어지는 도전성 산화층을 1층 이상 포함하고,상기 도전성 산화물은 (001)에 우선 배향하고 있는 압전 소자.
- 제6항에 있어서, 상기 제1 도전층은,상기 버퍼층과,상기 버퍼층의 상방에 형성된 상기 도전성 산화층을 포함하는 압전 소자.
- 제3항에 있어서,상기 제1 도전층은,상기 저저항층과,상기 저저항층의 상방에 형성된 상기 버퍼층과,상기 버퍼층의 상방에 형성된 페로브스카이트 구조를 갖는 도전성 산화물로 이루어지는 도전성 산화층을 포함하고,상기 도전성 산화물은 (001)에 우선 배향하고 있는 압전 소자.
- 제6항 내지 제8항 중 어느 한 항에 있어서, 상기 도전성 산화물은 CaRuO3, SrRuO3, BaRuO3, SrVO3, (La, Sr)MnO3, (La, Sr)CrO3, (La, Sr)CoO3 및 LaNiO3, 및 이들 중 적어도 2종류로 이루어지는 고용체 중 적어도 1종류를 포함하는 압전 소자.
- 제1항 내지 제8항 중 어느 한 항에 있어서, 상기 압전체는 ABO3의 일반식으로 나타내고,A는 Pb를 포함하고,B는 Zr 및 Ti 중 적어도 한쪽을 포함하는 압전 소자.
- 제10항에 있어서, 상기 B는 Nb를 더 포함하는 압전 소자.
- 제1항 내지 제8항 중 어느 한 항에 있어서, 상기 압전체는 능면체정, 또는 정방정과 능면체정의 혼정이고, 또한 (001)에 우선 배향하고 있는 압전 소자.
- 기판과,상기 기판의 상방에 형성된 제1 도전층과,상기 제1 도전층의 상방에 형성된 페로브스카이트 구조를 갖는 압전체층과,상기 압전체층에 전기적으로 접속된 제2 도전층을 포함하고,상기 제1 도전층은,페로브스카이트 구조를 갖는 도전성 산화물로 이루어지는 1층 이상의 도전성 산화층과,상기 도전성 산화물에 비해 비저항이 낮은 도전재로 이루어지는 1층 이상의 저저항층을 포함하고,상기 도전성 산화물은 (001)에 우선 배향하고 있는 압전 소자.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 압전 액츄에이터.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 압전 펌프.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 잉크젯식 기록 헤드.
- 제16항에 기재된 잉크젯식 기록 헤드를 갖는 잉크젯 프린터.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 표면 탄성파 소자.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 박막 압전 공진자.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 주파수 필터.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 발진기.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 전자 회로.
- 제1항 또는 제13항에 기재된 압전 소자를 갖는 전자 기기.
Applications Claiming Priority (2)
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JP2004380988A JP4431891B2 (ja) | 2004-12-28 | 2004-12-28 | 圧電素子、圧電アクチュエーター、圧電ポンプ、インクジェット式記録ヘッド、インクジェットプリンター、表面弾性波素子、薄膜圧電共振子、周波数フィルタ、発振器、電子回路、および電子機器 |
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US (1) | US7622850B2 (ko) |
EP (1) | EP1677368B1 (ko) |
JP (1) | JP4431891B2 (ko) |
KR (1) | KR100682432B1 (ko) |
CN (1) | CN100511744C (ko) |
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- 2004-12-28 JP JP2004380988A patent/JP4431891B2/ja not_active Expired - Fee Related
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- 2005-12-15 US US11/304,937 patent/US7622850B2/en active Active
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KR100844432B1 (ko) * | 2006-07-05 | 2008-07-08 | 한국과학기술연구원 | 압전 액츄에이터를 이용한 유체 제어 밸브 |
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CN1805164A (zh) | 2006-07-19 |
JP2006186258A (ja) | 2006-07-13 |
CN100511744C (zh) | 2009-07-08 |
EP1677368A3 (en) | 2007-07-11 |
EP1677368B1 (en) | 2011-06-22 |
US20060139414A1 (en) | 2006-06-29 |
EP1677368A2 (en) | 2006-07-05 |
US7622850B2 (en) | 2009-11-24 |
JP4431891B2 (ja) | 2010-03-17 |
KR100682432B1 (ko) | 2007-02-15 |
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