KR200487657Y1 - 레지스트층의 박막화 장치 - Google Patents

레지스트층의 박막화 장치 Download PDF

Info

Publication number
KR200487657Y1
KR200487657Y1 KR2020140001320U KR20140001320U KR200487657Y1 KR 200487657 Y1 KR200487657 Y1 KR 200487657Y1 KR 2020140001320 U KR2020140001320 U KR 2020140001320U KR 20140001320 U KR20140001320 U KR 20140001320U KR 200487657 Y1 KR200487657 Y1 KR 200487657Y1
Authority
KR
South Korea
Prior art keywords
liquid
resist layer
micelle
thinning
micelle removal
Prior art date
Application number
KR2020140001320U
Other languages
English (en)
Korean (ko)
Other versions
KR20140004866U (ko
Inventor
유지 도요다
노리히코 고칸
노리유키 가와이
구니히로 나카가와
Original Assignee
미쓰비시 세이시 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시 세이시 가부시키가이샤 filed Critical 미쓰비시 세이시 가부시키가이샤
Publication of KR20140004866U publication Critical patent/KR20140004866U/ko
Application granted granted Critical
Publication of KR200487657Y1 publication Critical patent/KR200487657Y1/ko

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR2020140001320U 2013-02-22 2014-02-21 레지스트층의 박막화 장치 KR200487657Y1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013032915 2013-02-22
JPJP-P-2013-032915 2013-02-22
JP2013272594A JP2014187352A (ja) 2013-02-22 2013-12-27 レジスト層の薄膜化装置
JPJP-P-2013-272594 2013-12-27

Publications (2)

Publication Number Publication Date
KR20140004866U KR20140004866U (ko) 2014-09-01
KR200487657Y1 true KR200487657Y1 (ko) 2018-10-17

Family

ID=51834549

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020140001320U KR200487657Y1 (ko) 2013-02-22 2014-02-21 레지스트층의 박막화 장치

Country Status (3)

Country Link
JP (2) JP2014187352A (ja)
KR (1) KR200487657Y1 (ja)
TW (1) TWM490720U (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016119396A (ja) * 2014-12-22 2016-06-30 日立化成株式会社 レジストパターンの製造方法、配線パターンの製造方法及び配線基板
CN106900141B (zh) * 2015-10-08 2020-11-17 三菱制纸株式会社 抗蚀层的薄膜化装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059755A (ja) * 2010-09-06 2012-03-22 Mitsubishi Paper Mills Ltd ドライフィルムレジストの薄膜化処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3518676B2 (ja) * 2000-05-11 2004-04-12 東京化工機株式会社 プリント配線基板材の表面処理装置
US8546066B2 (en) 2008-01-30 2013-10-01 Mitsubishi Paper Mills Limited Method for electroconductive pattern formation
JP5444050B2 (ja) 2010-03-12 2014-03-19 三菱製紙株式会社 ソルダーレジストパターンの形成方法
JP5498886B2 (ja) 2010-07-26 2014-05-21 三菱製紙株式会社 ドライフィルムレジストの薄膜化処理方法
CN103109588B (zh) 2010-09-28 2016-09-07 三菱制纸株式会社 阻焊图案的形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059755A (ja) * 2010-09-06 2012-03-22 Mitsubishi Paper Mills Ltd ドライフィルムレジストの薄膜化処理方法

Also Published As

Publication number Publication date
JP2014187352A (ja) 2014-10-02
KR20140004866U (ko) 2014-09-01
JP3207408U (ja) 2016-11-10
TWM490720U (en) 2014-11-21

Similar Documents

Publication Publication Date Title
KR20100116585A (ko) 도전 패턴의 제조 방법
KR200487199Y1 (ko) 레지스트층의 박막화 장치
KR200482351Y1 (ko) 레지스트층의 박막화 처리 장치
KR200487657Y1 (ko) 레지스트층의 박막화 장치
KR200494122Y1 (ko) 레지스트층의 박막화 장치
JP3218350U (ja) レジスト層の薄膜化装置
JP3225660U (ja) レジスト層の薄膜化装置
KR200491908Y1 (ko) 레지스트층의 박막화 장치
KR20210018401A (ko) 레지스트층의 박막화 장치
KR200492081Y1 (ko) 레지스트층의 박막화 장치
KR20210002849U (ko) 솔더 레지스트층의 박막화 장치
JP3239541U (ja) ソルダーレジスト層の薄膜化装置
JP3202621U (ja) レジスト層の薄膜化装置
JP3218349U (ja) レジスト層の薄膜化装置
CN203587965U (zh) 抗蚀剂层的薄膜化装置
JP3208034U (ja) レジスト層の薄膜化装置
JP3201110U (ja) レジスト層の薄膜化装置
JP3224844U (ja) レジスト層の薄膜化装置
CN203825368U (zh) 抗蚀剂层的薄膜化装置
JP6076291B2 (ja) 樹脂層薄膜化処理液の管理方法
JP2018045116A (ja) レジスト層の薄膜化装置

Legal Events

Date Code Title Description
A201 Request for examination
AMND Amendment
E902 Notification of reason for refusal
E601 Decision to refuse application
X70R Decision of rejection after re-examination
AMND Amendment
GRNO Decision to grant (after opposition)
REGI Registration of establishment