KR20030022375A - 양면 접속용 플렉시블 배선판 - Google Patents

양면 접속용 플렉시블 배선판 Download PDF

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Publication number
KR20030022375A
KR20030022375A KR10-2003-7001868A KR20037001868A KR20030022375A KR 20030022375 A KR20030022375 A KR 20030022375A KR 20037001868 A KR20037001868 A KR 20037001868A KR 20030022375 A KR20030022375 A KR 20030022375A
Authority
KR
South Korea
Prior art keywords
wiring board
flexible wiring
hole
insulating base
double
Prior art date
Application number
KR10-2003-7001868A
Other languages
English (en)
Korean (ko)
Inventor
소이찌로 기시모또
유끼오 안자이
오사무 게이노
Original Assignee
소니 케미카루 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 케미카루 가부시키가이샤 filed Critical 소니 케미카루 가부시키가이샤
Publication of KR20030022375A publication Critical patent/KR20030022375A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Liquid Crystal (AREA)
KR10-2003-7001868A 2000-08-10 2001-08-03 양면 접속용 플렉시블 배선판 KR20030022375A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00242578 2000-08-10
JP2000242578A JP3538371B2 (ja) 2000-08-10 2000-08-10 電気部品組立体及びその製造方法
PCT/JP2001/006693 WO2002015652A1 (fr) 2000-08-10 2001-08-03 Tableau de connexions souple pour connexion avant-arriere

Publications (1)

Publication Number Publication Date
KR20030022375A true KR20030022375A (ko) 2003-03-15

Family

ID=18733580

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7001868A KR20030022375A (ko) 2000-08-10 2001-08-03 양면 접속용 플렉시블 배선판

Country Status (7)

Country Link
US (1) US7285727B2 (zh)
JP (1) JP3538371B2 (zh)
KR (1) KR20030022375A (zh)
CN (1) CN1264389C (zh)
HK (1) HK1060684A1 (zh)
TW (1) TWI259745B (zh)
WO (1) WO2002015652A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643161B1 (ko) * 2004-08-31 2006-11-10 경천문 실내 도어 손잡이와 연동되는 보조 도어락 시스템
KR100972744B1 (ko) * 2008-08-11 2010-07-27 콘티넨탈 오토모티브 시스템 주식회사 차량의 포브키 탐지 방법

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JP2004031555A (ja) 2002-06-25 2004-01-29 Nec Corp 回路基板装置および基板間の接続方法
JP2004184805A (ja) * 2002-12-05 2004-07-02 Tohoku Pioneer Corp 導電配線の接続構造
CN100499287C (zh) * 2005-11-28 2009-06-10 中国电子科技集团公司第四十一研究所 一种新型宽带同轴连接器
JP4685614B2 (ja) * 2005-12-06 2011-05-18 富士通オプティカルコンポーネンツ株式会社 基板及び基板モジュール
US7696439B2 (en) * 2006-05-17 2010-04-13 Tessera, Inc. Layered metal structure for interconnect element
KR100744143B1 (ko) * 2006-07-27 2007-08-01 삼성전자주식회사 필름 배선 기판과 이를 이용한 반도체 칩 패키지 및 평판표시 장치
JP4443598B2 (ja) 2007-11-26 2010-03-31 シャープ株式会社 両面配線基板
JP2009200356A (ja) 2008-02-22 2009-09-03 Tdk Corp プリント配線板及びその製造方法
CN101594750B (zh) * 2008-05-27 2011-01-19 南亚电路板股份有限公司 高密度基板的结构与制法
KR100953116B1 (ko) * 2008-05-30 2010-04-19 엘지전자 주식회사 연성필름
KR100999515B1 (ko) 2008-11-14 2010-12-09 삼성전기주식회사 인쇄회로기판 제조방법
CN102904082A (zh) * 2011-07-25 2013-01-30 欣兴电子股份有限公司 连接器结构及其制作方法
TWI462244B (zh) * 2011-10-17 2014-11-21 Ind Tech Res Inst 異方向性導電膜片及其製作方法
CN104851892A (zh) * 2015-05-12 2015-08-19 深圳市华星光电技术有限公司 窄边框柔性显示装置及其制作方法
WO2017056082A1 (en) * 2015-10-02 2017-04-06 Solarpaint Ltd. Electrode arrangement and method of production thereof
KR20210111381A (ko) * 2020-03-02 2021-09-13 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

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US5029985A (en) * 1988-05-19 1991-07-09 Ricoh Company, Ltd. Multilayer liquid crystal display device
JP3026450B2 (ja) 1990-07-31 2000-03-27 株式会社東芝 紙葉類搬送装置
JPH0487673U (zh) * 1990-11-30 1992-07-30
JPH05259646A (ja) * 1992-03-10 1993-10-08 Toshiba Corp プリント配線板の製造方法
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JPH09148698A (ja) 1995-11-28 1997-06-06 Sharp Corp 両面プリント配線板およびその製造方法
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US6281450B1 (en) * 1997-06-26 2001-08-28 Hitachi Chemical Company, Ltd. Substrate for mounting semiconductor chips
JP4058773B2 (ja) 1997-06-26 2008-03-12 日立化成工業株式会社 半導体チップ搭載用基板
TW410534B (en) * 1997-07-16 2000-11-01 Matsushita Electric Ind Co Ltd Wiring board and production process for the same
JPH1140293A (ja) 1997-07-23 1999-02-12 Jsr Corp 積層型コネクターおよび回路基板検査用アダプター装置
JPH11195849A (ja) * 1997-12-26 1999-07-21 Fujikura Ltd フレキシブルプリント配線板とその製造方法
JP2000058158A (ja) 1998-08-05 2000-02-25 Jsr Corp コネクターおよびその製造方法並びに回路装置検査用アダプター装置
JP3139549B2 (ja) * 1999-01-29 2001-03-05 日本電気株式会社 アクティブマトリクス型液晶表示装置
JP2000243489A (ja) 1999-02-23 2000-09-08 Jsr Corp 配線板形成材料、板状コネクターおよびその製造方法並びに回路装置検査用アダプター装置
JP2001283996A (ja) 2000-04-03 2001-10-12 Jsr Corp シート状コネクターおよびその製造方法、電気装置接続装置並びに検査装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643161B1 (ko) * 2004-08-31 2006-11-10 경천문 실내 도어 손잡이와 연동되는 보조 도어락 시스템
KR100972744B1 (ko) * 2008-08-11 2010-07-27 콘티넨탈 오토모티브 시스템 주식회사 차량의 포브키 탐지 방법

Also Published As

Publication number Publication date
US20030136578A1 (en) 2003-07-24
CN1466861A (zh) 2004-01-07
JP2002057429A (ja) 2002-02-22
CN1264389C (zh) 2006-07-12
US7285727B2 (en) 2007-10-23
TWI259745B (en) 2006-08-01
WO2002015652A1 (fr) 2002-02-21
JP3538371B2 (ja) 2004-06-14
HK1060684A1 (en) 2004-08-13

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