KR20020012113A - 연마방법, 배선형성방법 및 반도체 장치의 제조방법 - Google Patents

연마방법, 배선형성방법 및 반도체 장치의 제조방법 Download PDF

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Publication number
KR20020012113A
KR20020012113A KR1020010021948A KR20010021948A KR20020012113A KR 20020012113 A KR20020012113 A KR 20020012113A KR 1020010021948 A KR1020010021948 A KR 1020010021948A KR 20010021948 A KR20010021948 A KR 20010021948A KR 20020012113 A KR20020012113 A KR 20020012113A
Authority
KR
South Korea
Prior art keywords
polishing
film
polishing liquid
acid
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020010021948A
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English (en)
Korean (ko)
Inventor
콘도세이이치
사쿠마노리유키
혼마요시오
Original Assignee
가나이 쓰토무
가부시키가이샤 히타치세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쓰토무, 가부시키가이샤 히타치세이사쿠쇼 filed Critical 가나이 쓰토무
Publication of KR20020012113A publication Critical patent/KR20020012113A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Drying Of Semiconductors (AREA)
KR1020010021948A 2000-08-04 2001-04-24 연마방법, 배선형성방법 및 반도체 장치의 제조방법 Withdrawn KR20020012113A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000242750A JP2002050595A (ja) 2000-08-04 2000-08-04 研磨方法、配線形成方法及び半導体装置の製造方法
JP2000-242750 2000-08-04

Publications (1)

Publication Number Publication Date
KR20020012113A true KR20020012113A (ko) 2002-02-15

Family

ID=18733721

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010021948A Withdrawn KR20020012113A (ko) 2000-08-04 2001-04-24 연마방법, 배선형성방법 및 반도체 장치의 제조방법

Country Status (4)

Country Link
US (3) US6562719B2 (https=)
JP (1) JP2002050595A (https=)
KR (1) KR20020012113A (https=)
TW (1) TW503476B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070107242A (ko) * 2006-05-02 2007-11-07 주식회사 엘지화학 구리 몰리브덴 배선용 세정제

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Also Published As

Publication number Publication date
US20020016073A1 (en) 2002-02-07
US20040171264A1 (en) 2004-09-02
JP2002050595A (ja) 2002-02-15
US6562719B2 (en) 2003-05-13
US20030186497A1 (en) 2003-10-02
US6750128B2 (en) 2004-06-15
TW503476B (en) 2002-09-21

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