JPS5547382A - Chemical polishing fluid - Google Patents

Chemical polishing fluid

Info

Publication number
JPS5547382A
JPS5547382A JP11948978A JP11948978A JPS5547382A JP S5547382 A JPS5547382 A JP S5547382A JP 11948978 A JP11948978 A JP 11948978A JP 11948978 A JP11948978 A JP 11948978A JP S5547382 A JPS5547382 A JP S5547382A
Authority
JP
Japan
Prior art keywords
polishing fluid
fluid
polishing
pref
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11948978A
Other languages
Japanese (ja)
Other versions
JPS6212311B2 (en
Inventor
Moriyuki Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP11948978A priority Critical patent/JPS5547382A/en
Publication of JPS5547382A publication Critical patent/JPS5547382A/en
Publication of JPS6212311B2 publication Critical patent/JPS6212311B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/02—Light metals
    • C23F3/03—Light metals with acidic solutions

Abstract

PURPOSE:To provide a chemical polishing fluid which makes it possible to polish selectively burrs alone easily at a low cost, while restraining failure of a parts body when the parts made of Al or Al alloy to be polished have burrs, by using a fluid contg. an inorg. acid and an aromatic Al chelating agent as a chemical polishing fluid. CONSTITUTION:A polishing fluid is prepared which contains an inorg. acid such as phosphoric acid 50-90%, pref. 65-85% in concn., and an aromatic Al chelating agent, e.g., sodium catecholdisulfonate 0.05-15%, pref., 0.2-10% in concn. To the polishing fluid are further added at least 0.01%, pref., 0.1-5% a nonionic surface active agent, not more than 5% H2O2, about 5-20g Al<3+> as AlPO4. 31/2H2O per liter polishing fluid, and 1-20g Cu<2+> as CuSO4.5H2O per litter polishing fluid. Polishing treatment by use of this fluid produces excellent surface conditions after polishing, exerting no bad influence on the later steps even when anodizing treatment is conducted.
JP11948978A 1978-09-28 1978-09-28 Chemical polishing fluid Granted JPS5547382A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11948978A JPS5547382A (en) 1978-09-28 1978-09-28 Chemical polishing fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11948978A JPS5547382A (en) 1978-09-28 1978-09-28 Chemical polishing fluid

Publications (2)

Publication Number Publication Date
JPS5547382A true JPS5547382A (en) 1980-04-03
JPS6212311B2 JPS6212311B2 (en) 1987-03-18

Family

ID=14762525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11948978A Granted JPS5547382A (en) 1978-09-28 1978-09-28 Chemical polishing fluid

Country Status (1)

Country Link
JP (1) JPS5547382A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6562719B2 (en) 2000-08-04 2003-05-13 Hitachi, Ltd. Methods of polishing, interconnect-fabrication, and producing semiconductor devices
US6774041B1 (en) 1999-12-27 2004-08-10 Renesas Technology Corp. Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
US7445644B2 (en) 2005-10-28 2008-11-04 The Procter & Gamble Company Compositions containing anionically modified catechol and soil suspending polymers
US7585376B2 (en) 2005-10-28 2009-09-08 The Procter & Gamble Company Composition containing an esterified substituted benzene sulfonate
US7892362B2 (en) 2005-10-28 2011-02-22 The Procter & Gamble Company Composition containing an esterified substituted benzene sulfonate
CN102352511A (en) * 2011-09-26 2012-02-15 台山市金桥铝型材厂有限公司 Preparation method for surface polishing treatment liquid of aluminum sectional material
KR101208122B1 (en) 2010-03-26 2012-12-05 권유진 Composition for removing burr in aluminium processing and method of removing the burr using the composition
CN109179357A (en) * 2018-07-27 2019-01-11 佛山市三水雄鹰铝表面技术创新中心有限公司 The configuration of aluminium industry polished and cleaned Sewage treatment compound fertilizer's method and system

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6774041B1 (en) 1999-12-27 2004-08-10 Renesas Technology Corp. Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
US7183212B2 (en) 1999-12-27 2007-02-27 Renesas Technology Corp. Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
US6562719B2 (en) 2000-08-04 2003-05-13 Hitachi, Ltd. Methods of polishing, interconnect-fabrication, and producing semiconductor devices
US6750128B2 (en) 2000-08-04 2004-06-15 Renesas Technology Corporation Methods of polishing, interconnect-fabrication, and producing semiconductor devices
US7445644B2 (en) 2005-10-28 2008-11-04 The Procter & Gamble Company Compositions containing anionically modified catechol and soil suspending polymers
US7585376B2 (en) 2005-10-28 2009-09-08 The Procter & Gamble Company Composition containing an esterified substituted benzene sulfonate
US7892362B2 (en) 2005-10-28 2011-02-22 The Procter & Gamble Company Composition containing an esterified substituted benzene sulfonate
US8119586B2 (en) 2005-10-28 2012-02-21 The Procter And Gamble Company Composition containing an esterified substituted benzene sulfonate
KR101208122B1 (en) 2010-03-26 2012-12-05 권유진 Composition for removing burr in aluminium processing and method of removing the burr using the composition
CN102352511A (en) * 2011-09-26 2012-02-15 台山市金桥铝型材厂有限公司 Preparation method for surface polishing treatment liquid of aluminum sectional material
CN109179357A (en) * 2018-07-27 2019-01-11 佛山市三水雄鹰铝表面技术创新中心有限公司 The configuration of aluminium industry polished and cleaned Sewage treatment compound fertilizer's method and system
CN109179357B (en) * 2018-07-27 2020-03-24 佛山市三水雄鹰铝表面技术创新中心有限公司 Method and system configuration for recovering compound fertilizer from polishing and cleaning wastewater in aluminum industry

Also Published As

Publication number Publication date
JPS6212311B2 (en) 1987-03-18

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