KR20010078774A - 도전성 페이스트 및 세라믹 전자 부품 - Google Patents
도전성 페이스트 및 세라믹 전자 부품 Download PDFInfo
- Publication number
- KR20010078774A KR20010078774A KR1020010005606A KR20010005606A KR20010078774A KR 20010078774 A KR20010078774 A KR 20010078774A KR 1020010005606 A KR1020010005606 A KR 1020010005606A KR 20010005606 A KR20010005606 A KR 20010005606A KR 20010078774 A KR20010078774 A KR 20010078774A
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic
- conductive paste
- glass
- ceramic electronic
- electronic component
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 60
- 239000011521 glass Substances 0.000 claims abstract description 48
- 239000000843 powder Substances 0.000 claims abstract description 23
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 8
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 8
- 239000003985 ceramic capacitor Substances 0.000 claims description 12
- 150000001342 alkaline earth metals Chemical group 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 6
- 229910052788 barium Inorganic materials 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Chemical group 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 abstract description 5
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 abstract 4
- 230000000694 effects Effects 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000011575 calcium Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000004017 vitrification Methods 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 229910007541 Zn O Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- SXSVTGQIXJXKJR-UHFFFAOYSA-N [Mg].[Ti] Chemical compound [Mg].[Ti] SXSVTGQIXJXKJR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
- Ceramic Capacitors (AREA)
- Ceramic Products (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
Description
Claims (7)
- 실질적으로 비-Pb계 유리를 포함하고 세라믹 전자 부품의 후막 전극을 형성하는데 사용되는 도전성 페이스트(conductive paste)는,Ag를 포함하는 도전성 분말,Ca, Sr, 및 Ba으로 이루어진 군으로 선택된 적어도 하나의 알칼리 토금속, 비스무트(bismuth), 및 붕소(boron)를 함유하는 유리 분말, 및비히클(vehicle)을 포함하고 있으며,알칼리-토금속, 비스무트, 및 붕소가 각각 산화물 MO, Bi2O3, 및 B2O3으로 표현될 때에, 상기 산화물들의 함량은 유리 조성물의 100몰%에 대해서 몰%를 기준으로하여 하기 범위:30<MO40(여기에서 M은 Ca, Sr, 및 Ba로 이루어진 군으로 선택된 적어도 하나의 알칼리-토금속을 표시한다.),10Bi2O3 60, 및10B2O3 60 내에 있는 것을 특징으로 하는 도전성 페이스트.
- 제 1항에 있어서, 상기 유리 분말의 첨가량이 도전성 분말의 100체적%에 대해서 1~15체적%인 것을 특징으로 하는 도전성 페이스트.
- 제 1항에 있어서, 실질적으로 비-산화 실리콘을 함유하는 것을 특징으로 하는 도전성 페이스트.
- 적어도 2개의 단면을 갖는 세라믹 소결체; 및상기 세라믹 소결체의 2개의 단면 위에 형성된 제 1항 내지 제 3항 중 어느 한 항에 기재된 도전성 페이스트로 구성된 후막 전극을 포함하는 것을 특징으로 하는 세라믹 전자 부품.
- 제 4항에 있어서, 상기 후막 전극에 리드선이 점속되어 있는 것을 특징으로 하는 세라믹 전자 부품.
- 제 5항에 있어서, 상기 후막 전극이 수지로 피복되는 것을 특징으로 하는 세라믹 전자 부품.
- 제 4항에 있어서, 250V 이상의 정격 전압(rated voltage)를 갖는 중고 전압(medium and high voltage) 세라믹 캐패시터를 구성하는 것을 특징으로 하는 세라믹 전자 부품.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000031737A JP3799933B2 (ja) | 2000-02-09 | 2000-02-09 | 導電性ペーストおよびセラミック電子部品 |
JP2000-031737 | 2000-02-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010078774A true KR20010078774A (ko) | 2001-08-21 |
KR100366928B1 KR100366928B1 (ko) | 2003-01-09 |
Family
ID=18556448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0005606A KR100366928B1 (ko) | 2000-02-09 | 2001-02-06 | 도전성 페이스트 및 세라믹 전자 부품 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6500362B2 (ko) |
JP (1) | JP3799933B2 (ko) |
KR (1) | KR100366928B1 (ko) |
CN (1) | CN1178238C (ko) |
TW (1) | TW495765B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100506034B1 (ko) * | 2001-10-23 | 2005-08-04 | 가부시키가이샤 무라타 세이사쿠쇼 | 도전성 페이스트 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3666371B2 (ja) * | 2000-08-08 | 2005-06-29 | 株式会社村田製作所 | 導電性ペーストおよび積層セラミック電子部品 |
US20050214457A1 (en) * | 2004-03-29 | 2005-09-29 | Applied Materials, Inc. | Deposition of low dielectric constant films by N2O addition |
GB0515088D0 (en) * | 2005-07-22 | 2005-08-31 | Imerys Minerals Ltd | Particulate glass compositions and methods of production |
TW200721210A (en) * | 2005-11-28 | 2007-06-01 | Murata Manufacturing Co | Ceramic electronic part |
JP4591478B2 (ja) * | 2007-05-28 | 2010-12-01 | パナソニック株式会社 | プラズマディスプレイパネル |
WO2010026952A1 (ja) * | 2008-09-04 | 2010-03-11 | 日本電気硝子株式会社 | 電極形成用ガラス組成物および電極形成材料 |
JP5717043B2 (ja) * | 2008-09-04 | 2015-05-13 | 日本電気硝子株式会社 | 電極形成用ガラス組成物および電極形成材料 |
CN102317227A (zh) * | 2009-02-24 | 2012-01-11 | 日本电气硝子株式会社 | 电极形成用玻璃组合物和电极形成材料 |
JP5165629B2 (ja) * | 2009-04-03 | 2013-03-21 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板およびそれに用いるろう材 |
CN102123961A (zh) * | 2009-08-07 | 2011-07-13 | Lg化学株式会社 | 制备硅太阳能电池的无铅玻璃料粉末、其制备方法、包含其的金属膏组合物和硅太阳能电池 |
KR101311098B1 (ko) * | 2010-04-07 | 2013-09-25 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 도전 페이스트 및 도전 패턴 |
JP5668429B2 (ja) * | 2010-11-19 | 2015-02-12 | 株式会社村田製作所 | 積層セラミック電子部品 |
EP2750141B1 (en) | 2012-12-28 | 2018-02-07 | Heraeus Deutschland GmbH & Co. KG | An electro-conductive paste comprising coarse inorganic oxide particles in the preparation of electrodes in MWT solar cells |
US9761742B2 (en) * | 2013-12-03 | 2017-09-12 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
KR101931108B1 (ko) * | 2014-07-09 | 2018-12-20 | 페로 코포레이션 | 미드-k ltcc 조성물 및 디바이스 |
JP2019220678A (ja) * | 2018-06-19 | 2019-12-26 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4859465A (en) * | 1984-04-20 | 1989-08-22 | The Regents Of The University Of California | Vaccine capable of eliciting multivalent antibodies |
US5143726A (en) * | 1986-12-09 | 1992-09-01 | The Scripps Research Institute | T cell epitopes of the hepatitis B virus nucleocapsid protein |
US4818527A (en) * | 1986-12-09 | 1989-04-04 | Scripps Clinic And Research Foundation | T cell epitopes of the hepatitis B virus nucleocapsid protein |
US5162062A (en) * | 1991-06-17 | 1992-11-10 | E. I. Du Pont De Nemours And Company | Method for making multilayer electronic circuits |
JP3223199B2 (ja) * | 1991-10-25 | 2001-10-29 | ティーディーケイ株式会社 | 多層セラミック部品の製造方法および多層セラミック部品 |
US5698015A (en) * | 1995-05-19 | 1997-12-16 | Nikko Company | Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste |
JP3206496B2 (ja) * | 1997-06-02 | 2001-09-10 | 昭栄化学工業株式会社 | 金属粉末及びその製造方法 |
JP3039426B2 (ja) * | 1997-03-04 | 2000-05-08 | 株式会社村田製作所 | 積層セラミックコンデンサ |
US6217821B1 (en) * | 1999-06-02 | 2001-04-17 | E. I. Du Pont De Nemours And Company | Method of forming distortion-free circuits |
-
2000
- 2000-02-09 JP JP2000031737A patent/JP3799933B2/ja not_active Expired - Lifetime
-
2001
- 2001-02-06 KR KR10-2001-0005606A patent/KR100366928B1/ko active IP Right Grant
- 2001-02-07 TW TW090102643A patent/TW495765B/zh not_active IP Right Cessation
- 2001-02-08 US US09/779,270 patent/US6500362B2/en not_active Expired - Lifetime
- 2001-02-09 CN CNB01102965XA patent/CN1178238C/zh not_active Expired - Lifetime
-
2002
- 2002-09-23 US US10/252,002 patent/US6592974B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100506034B1 (ko) * | 2001-10-23 | 2005-08-04 | 가부시키가이샤 무라타 세이사쿠쇼 | 도전성 페이스트 |
Also Published As
Publication number | Publication date |
---|---|
US20030064213A1 (en) | 2003-04-03 |
CN1308345A (zh) | 2001-08-15 |
KR100366928B1 (ko) | 2003-01-09 |
US20010015603A1 (en) | 2001-08-23 |
TW495765B (en) | 2002-07-21 |
JP2001222912A (ja) | 2001-08-17 |
US6592974B2 (en) | 2003-07-15 |
JP3799933B2 (ja) | 2006-07-19 |
US6500362B2 (en) | 2002-12-31 |
CN1178238C (zh) | 2004-12-01 |
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