KR20010076329A - 탄소섬유가 보강된 수지체를 오목부가 있는 방열판으로서구비하는 반도체 장치 - Google Patents

탄소섬유가 보강된 수지체를 오목부가 있는 방열판으로서구비하는 반도체 장치 Download PDF

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Publication number
KR20010076329A
KR20010076329A KR1020010002822A KR20010002822A KR20010076329A KR 20010076329 A KR20010076329 A KR 20010076329A KR 1020010002822 A KR1020010002822 A KR 1020010002822A KR 20010002822 A KR20010002822 A KR 20010002822A KR 20010076329 A KR20010076329 A KR 20010076329A
Authority
KR
South Korea
Prior art keywords
wiring board
flat wiring
substantially flat
wiring pattern
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020010002822A
Other languages
English (en)
Korean (ko)
Inventor
무라야마케이
히가시미츠토시
사카구치히데아키
코이케히로코
Original Assignee
모기 준이치
신코 덴키 코교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모기 준이치, 신코 덴키 코교 가부시키가이샤 filed Critical 모기 준이치
Publication of KR20010076329A publication Critical patent/KR20010076329A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020010002822A 2000-01-24 2001-01-18 탄소섬유가 보강된 수지체를 오목부가 있는 방열판으로서구비하는 반도체 장치 Ceased KR20010076329A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-14809 2000-01-24
JP2000014809A JP2001210761A (ja) 2000-01-24 2000-01-24 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
KR20010076329A true KR20010076329A (ko) 2001-08-11

Family

ID=18542206

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010002822A Ceased KR20010076329A (ko) 2000-01-24 2001-01-18 탄소섬유가 보강된 수지체를 오목부가 있는 방열판으로서구비하는 반도체 장치

Country Status (5)

Country Link
US (2) US6713863B2 (https=)
EP (1) EP1120830B1 (https=)
JP (1) JP2001210761A (https=)
KR (1) KR20010076329A (https=)
DE (1) DE60140093D1 (https=)

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KR100765478B1 (ko) * 2005-08-12 2007-10-09 삼성전자주식회사 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치
KR100824250B1 (ko) * 2005-08-01 2008-04-24 엔이씨 일렉트로닉스 가부시키가이샤 금속 리드 부재를 피쳐링하는 반도체 패키지

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DE10215654A1 (de) * 2002-04-09 2003-11-06 Infineon Technologies Ag Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung
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US8097944B2 (en) * 2009-04-30 2012-01-17 Infineon Technologies Ag Semiconductor device
US8362607B2 (en) * 2009-06-03 2013-01-29 Honeywell International Inc. Integrated circuit package including a thermally and electrically conductive package lid
US8362609B1 (en) 2009-10-27 2013-01-29 Xilinx, Inc. Integrated circuit package and method of forming an integrated circuit package
FR2957192B1 (fr) * 2010-03-03 2013-10-25 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
JP5572890B2 (ja) * 2010-06-08 2014-08-20 ミヨシ電子株式会社 半導体モジュールおよび半導体装置
US8810028B1 (en) 2010-06-30 2014-08-19 Xilinx, Inc. Integrated circuit packaging devices and methods
JP2012033559A (ja) 2010-07-28 2012-02-16 J Devices:Kk 半導体装置
JP5955500B2 (ja) * 2010-10-25 2016-07-20 稔之 新井 放熱構造
US9072199B2 (en) 2010-12-27 2015-06-30 Src, Inc. Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plug
JP2012164846A (ja) * 2011-02-08 2012-08-30 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、及び表示装置
US10109591B1 (en) * 2011-06-27 2018-10-23 Amkor Technology, Inc. Integrated shield package and method
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JP5987358B2 (ja) * 2012-03-01 2016-09-07 株式会社ソシオネクスト 半導体装置及び半導体装置の製造方法
JP6008582B2 (ja) * 2012-05-28 2016-10-19 新光電気工業株式会社 半導体パッケージ、放熱板及びその製造方法
KR101989516B1 (ko) 2012-09-24 2019-06-14 삼성전자주식회사 반도체 패키지
CN104576568A (zh) * 2013-10-15 2015-04-29 日月光半导体制造股份有限公司 半导体封装件及其制造方法
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KR100765478B1 (ko) * 2005-08-12 2007-10-09 삼성전자주식회사 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치
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Also Published As

Publication number Publication date
US6713863B2 (en) 2004-03-30
EP1120830A3 (en) 2002-05-22
US20010009302A1 (en) 2001-07-26
US6864120B2 (en) 2005-03-08
JP2001210761A (ja) 2001-08-03
EP1120830B1 (en) 2009-10-07
DE60140093D1 (de) 2009-11-19
US20040166609A1 (en) 2004-08-26
EP1120830A2 (en) 2001-08-01

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