DE60140093D1 - Halbleiter mit kohlenfaserverstärkter Harz-Kühlplatte mit konkavem Teil - Google Patents

Halbleiter mit kohlenfaserverstärkter Harz-Kühlplatte mit konkavem Teil

Info

Publication number
DE60140093D1
DE60140093D1 DE60140093T DE60140093T DE60140093D1 DE 60140093 D1 DE60140093 D1 DE 60140093D1 DE 60140093 T DE60140093 T DE 60140093T DE 60140093 T DE60140093 T DE 60140093T DE 60140093 D1 DE60140093 D1 DE 60140093D1
Authority
DE
Germany
Prior art keywords
semiconductor
carbon fiber
fiber reinforced
cooling plate
concave part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140093T
Other languages
German (de)
English (en)
Inventor
Kei Murayama
Mitsutoshi Higashi
Hideaki Sakaguchi
Hiroko Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Application granted granted Critical
Publication of DE60140093D1 publication Critical patent/DE60140093D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
DE60140093T 2000-01-24 2001-01-18 Halbleiter mit kohlenfaserverstärkter Harz-Kühlplatte mit konkavem Teil Expired - Lifetime DE60140093D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000014809A JP2001210761A (ja) 2000-01-24 2000-01-24 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
DE60140093D1 true DE60140093D1 (de) 2009-11-19

Family

ID=18542206

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140093T Expired - Lifetime DE60140093D1 (de) 2000-01-24 2001-01-18 Halbleiter mit kohlenfaserverstärkter Harz-Kühlplatte mit konkavem Teil

Country Status (5)

Country Link
US (2) US6713863B2 (https=)
EP (1) EP1120830B1 (https=)
JP (1) JP2001210761A (https=)
KR (1) KR20010076329A (https=)
DE (1) DE60140093D1 (https=)

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JP2003309228A (ja) * 2002-04-18 2003-10-31 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
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JP4641423B2 (ja) 2004-02-18 2011-03-02 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
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JP2008153305A (ja) * 2006-12-14 2008-07-03 Nec Electronics Corp 半導体装置
TWI379363B (en) * 2007-04-24 2012-12-11 United Test & Assembly Ct Lt Bump on via-packaging and methodologies
US7906857B1 (en) 2008-03-13 2011-03-15 Xilinx, Inc. Molded integrated circuit package and method of forming a molded integrated circuit package
JP2009290118A (ja) * 2008-05-30 2009-12-10 Toshiba Corp 電子機器
US20100052156A1 (en) * 2008-08-27 2010-03-04 Advanced Semiconductor Engineering, Inc. Chip scale package structure and fabrication method thereof
US8097944B2 (en) * 2009-04-30 2012-01-17 Infineon Technologies Ag Semiconductor device
US8362607B2 (en) * 2009-06-03 2013-01-29 Honeywell International Inc. Integrated circuit package including a thermally and electrically conductive package lid
US8362609B1 (en) 2009-10-27 2013-01-29 Xilinx, Inc. Integrated circuit package and method of forming an integrated circuit package
FR2957192B1 (fr) * 2010-03-03 2013-10-25 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
JP5572890B2 (ja) * 2010-06-08 2014-08-20 ミヨシ電子株式会社 半導体モジュールおよび半導体装置
US8810028B1 (en) 2010-06-30 2014-08-19 Xilinx, Inc. Integrated circuit packaging devices and methods
JP2012033559A (ja) 2010-07-28 2012-02-16 J Devices:Kk 半導体装置
JP5955500B2 (ja) * 2010-10-25 2016-07-20 稔之 新井 放熱構造
US9072199B2 (en) 2010-12-27 2015-06-30 Src, Inc. Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plug
JP2012164846A (ja) * 2011-02-08 2012-08-30 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、及び表示装置
US10109591B1 (en) * 2011-06-27 2018-10-23 Amkor Technology, Inc. Integrated shield package and method
JP6119950B2 (ja) * 2011-12-02 2017-04-26 ナガセケムテックス株式会社 中空構造電子部品
JP5987358B2 (ja) * 2012-03-01 2016-09-07 株式会社ソシオネクスト 半導体装置及び半導体装置の製造方法
JP6008582B2 (ja) * 2012-05-28 2016-10-19 新光電気工業株式会社 半導体パッケージ、放熱板及びその製造方法
KR101989516B1 (ko) 2012-09-24 2019-06-14 삼성전자주식회사 반도체 패키지
CN104576568A (zh) * 2013-10-15 2015-04-29 日月光半导体制造股份有限公司 半导体封装件及其制造方法
US9559064B2 (en) * 2013-12-04 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in package-on-package structures
KR102186203B1 (ko) 2014-01-23 2020-12-04 삼성전자주식회사 패키지 온 패키지 장치 및 이의 제조 방법
JP2016092300A (ja) * 2014-11-07 2016-05-23 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
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JP7265321B2 (ja) * 2018-06-21 2023-04-26 デクセリアルズ株式会社 半導体装置及び半導体装置の製造方法
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Also Published As

Publication number Publication date
US6713863B2 (en) 2004-03-30
EP1120830A3 (en) 2002-05-22
US20010009302A1 (en) 2001-07-26
US6864120B2 (en) 2005-03-08
JP2001210761A (ja) 2001-08-03
EP1120830B1 (en) 2009-10-07
KR20010076329A (ko) 2001-08-11
US20040166609A1 (en) 2004-08-26
EP1120830A2 (en) 2001-08-01

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