KR20010021746A - 진공 처리 장치용 두 부품의 슬릿 밸브 삽입부재 - Google Patents

진공 처리 장치용 두 부품의 슬릿 밸브 삽입부재 Download PDF

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Publication number
KR20010021746A
KR20010021746A KR1020007000309A KR20007000309A KR20010021746A KR 20010021746 A KR20010021746 A KR 20010021746A KR 1020007000309 A KR1020007000309 A KR 1020007000309A KR 20007000309 A KR20007000309 A KR 20007000309A KR 20010021746 A KR20010021746 A KR 20010021746A
Authority
KR
South Korea
Prior art keywords
chamber
adapter
slit valve
transfer chamber
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020007000309A
Other languages
English (en)
Korean (ko)
Inventor
애비 테프만
로버트 비. 로렌스
Original Assignee
조셉 제이. 스위니
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조셉 제이. 스위니, 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 조셉 제이. 스위니
Publication of KR20010021746A publication Critical patent/KR20010021746A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49716—Converting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Valve Housings (AREA)
  • Physical Vapour Deposition (AREA)
KR1020007000309A 1997-07-11 1998-07-09 진공 처리 장치용 두 부품의 슬릿 밸브 삽입부재 Abandoned KR20010021746A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8/893,813 1997-07-11
US08/893,813 US6045620A (en) 1997-07-11 1997-07-11 Two-piece slit valve insert for vacuum processing system
PCT/US1998/014281 WO1999003136A1 (en) 1997-07-11 1998-07-09 Two-piece slit valve insert for vacuum processing system

Publications (1)

Publication Number Publication Date
KR20010021746A true KR20010021746A (ko) 2001-03-15

Family

ID=25402145

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007000309A Abandoned KR20010021746A (ko) 1997-07-11 1998-07-09 진공 처리 장치용 두 부품의 슬릿 밸브 삽입부재

Country Status (5)

Country Link
US (1) US6045620A (https=)
EP (1) EP1002332A1 (https=)
JP (1) JP4371572B2 (https=)
KR (1) KR20010021746A (https=)
WO (1) WO1999003136A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100727499B1 (ko) * 2004-06-02 2007-06-13 어플라이드 머티어리얼스, 인코포레이티드 전자 장치 제조 챔버 및 이의 형성 방법
KR101333233B1 (ko) * 2007-03-01 2013-11-26 어플라이드 머티어리얼스, 인코포레이티드 이송 챔버 인터페이스용 플로팅 슬릿 밸브
KR20170102430A (ko) * 2016-03-01 2017-09-11 램 리써치 코포레이션 반도체 프로세스 챔버 슬릿 밸브 개구를 퍼지하기 위한 장치
KR20190124803A (ko) * 2017-03-24 2019-11-05 도쿄엘렉트론가부시키가이샤 기판 처리 장치
KR20200024339A (ko) * 2017-07-31 2020-03-06 어플라이드 머티어리얼스, 인코포레이티드 배플을 갖는 가스 공급 부재
KR20210104933A (ko) * 2019-12-05 2021-08-25 어플라이드 머티어리얼스, 인코포레이티드 교체 가능 계면 플레이트를 갖는 재구성 가능 메인프레임

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US7647886B2 (en) * 2003-10-15 2010-01-19 Micron Technology, Inc. Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
US7258892B2 (en) * 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7906393B2 (en) * 2004-01-28 2011-03-15 Micron Technology, Inc. Methods for forming small-scale capacitor structures
US20050160992A1 (en) * 2004-01-28 2005-07-28 Applied Materials, Inc. Substrate gripping apparatus
US7584942B2 (en) * 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
TWD107405S1 (zh) * 2004-05-28 2005-11-01 東京威力科創股份有限公司 裝載鎖定處理室
CN2888643Y (zh) * 2004-06-02 2007-04-11 应用材料股份有限公司 电子装置制造室
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
US7841582B2 (en) * 2004-06-02 2010-11-30 Applied Materials, Inc. Variable seal pressure slit valve doors for semiconductor manufacturing equipment
US20050268857A1 (en) * 2004-06-02 2005-12-08 Applied Materials, Inc. Uniformly compressed process chamber gate seal for semiconductor processing chamber
US7699932B2 (en) * 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
US7422653B2 (en) * 2004-07-13 2008-09-09 Applied Materials, Inc. Single-sided inflatable vertical slit valve
US20060165873A1 (en) * 2005-01-25 2006-07-27 Micron Technology, Inc. Plasma detection and associated systems and methods for controlling microfeature workpiece deposition processes
US20060162658A1 (en) * 2005-01-27 2006-07-27 Applied Materials, Inc. Ruthenium layer deposition apparatus and method
US20060237138A1 (en) * 2005-04-26 2006-10-26 Micron Technology, Inc. Apparatuses and methods for supporting microelectronic devices during plasma-based fabrication processes
TWI295816B (en) 2005-07-19 2008-04-11 Applied Materials Inc Hybrid pvd-cvd system
JP4821314B2 (ja) * 2005-12-26 2011-11-24 ダイキン工業株式会社 半導体製造装置用バルブの弁体およびその製造方法
JP4763786B2 (ja) * 2006-06-19 2011-08-31 日本バルカー工業株式会社 弁体部及びゲートバルブ装置
US8272825B2 (en) 2007-05-18 2012-09-25 Brooks Automation, Inc. Load lock fast pump vent
US10541157B2 (en) 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
US8377213B2 (en) * 2008-05-05 2013-02-19 Applied Materials, Inc. Slit valve having increased flow uniformity
US20100127201A1 (en) * 2008-11-21 2010-05-27 Applied Materials, Inc. Interlocking valve chamber and lid
US20100304027A1 (en) * 2009-05-27 2010-12-02 Applied Materials, Inc. Substrate processing system and methods thereof
EP2293321A1 (en) * 2009-09-08 2011-03-09 Applied Materials, Inc. Mechanical modularity chambers
US20110180097A1 (en) * 2010-01-27 2011-07-28 Axcelis Technologies, Inc. Thermal isolation assemblies for wafer transport apparatus and methods of use thereof
JP2011035415A (ja) * 2010-10-18 2011-02-17 Hitachi High-Technologies Corp 真空処理装置
CN105580124B (zh) * 2013-09-26 2018-05-18 应用材料公司 用于基板处理的混合平台式设备、系统以及方法
JP6972852B2 (ja) * 2017-05-23 2021-11-24 東京エレクトロン株式会社 真空搬送モジュール及び基板処理装置
CN108933097B (zh) 2017-05-23 2023-06-23 东京毅力科创株式会社 真空输送组件和基片处理装置
US12400885B2 (en) * 2022-03-11 2025-08-26 Applied Materials, Inc. Modular multi-chamber processing tool having link chamber for ultra high vacuum processes

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Cited By (13)

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KR100727499B1 (ko) * 2004-06-02 2007-06-13 어플라이드 머티어리얼스, 인코포레이티드 전자 장치 제조 챔버 및 이의 형성 방법
KR101333233B1 (ko) * 2007-03-01 2013-11-26 어플라이드 머티어리얼스, 인코포레이티드 이송 챔버 인터페이스용 플로팅 슬릿 밸브
US8877553B2 (en) 2007-03-01 2014-11-04 Applied Materials, Inc. Floating slit valve for transfer chamber interface
KR20170102430A (ko) * 2016-03-01 2017-09-11 램 리써치 코포레이션 반도체 프로세스 챔버 슬릿 밸브 개구를 퍼지하기 위한 장치
US11527426B2 (en) 2017-03-24 2022-12-13 Tokyo Electron Limited Substrate processing device
KR20190124803A (ko) * 2017-03-24 2019-11-05 도쿄엘렉트론가부시키가이샤 기판 처리 장치
KR20200024339A (ko) * 2017-07-31 2020-03-06 어플라이드 머티어리얼스, 인코포레이티드 배플을 갖는 가스 공급 부재
US11124878B2 (en) 2017-07-31 2021-09-21 Applied Materials, Inc. Gas supply member with baffle
KR20210158872A (ko) * 2017-07-31 2021-12-31 어플라이드 머티어리얼스, 인코포레이티드 배플을 갖는 가스 공급 부재
US11885021B2 (en) 2017-07-31 2024-01-30 Applied Materials, Inc. Gas supply member with baffle
KR20220123146A (ko) * 2017-07-31 2022-09-05 어플라이드 머티어리얼스, 인코포레이티드 배플을 갖는 가스 공급 부재
KR20210104933A (ko) * 2019-12-05 2021-08-25 어플라이드 머티어리얼스, 인코포레이티드 교체 가능 계면 플레이트를 갖는 재구성 가능 메인프레임
KR20220049043A (ko) * 2019-12-05 2022-04-20 어플라이드 머티어리얼스, 인코포레이티드 교체 가능 계면 플레이트를 갖는 재구성 가능 메인프레임

Also Published As

Publication number Publication date
JP2001509647A (ja) 2001-07-24
JP4371572B2 (ja) 2009-11-25
WO1999003136A1 (en) 1999-01-21
US6045620A (en) 2000-04-04
EP1002332A1 (en) 2000-05-24

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St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000