JP4371572B2 - 真空処理システムにおける２ピース式スリットバルブインサート - Google Patents

真空処理システムにおける２ピース式スリットバルブインサート Download PDF

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Publication number
JP4371572B2
JP4371572B2 JP2000502528A JP2000502528A JP4371572B2 JP 4371572 B2 JP4371572 B2 JP 4371572B2 JP 2000502528 A JP2000502528 A JP 2000502528A JP 2000502528 A JP2000502528 A JP 2000502528A JP 4371572 B2 JP4371572 B2 JP 4371572B2
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JP
Japan
Prior art keywords
chamber
adapter
vacuum
transfer chamber
outer portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2000502528A
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English (en)
Japanese (ja)
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JP2001509647A5 (https=
JP2001509647A (ja
Inventor
アヴィ テップマン，
ロバート， ビー． ロウランス，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2001509647A publication Critical patent/JP2001509647A/ja
Publication of JP2001509647A5 publication Critical patent/JP2001509647A5/ja
Application granted granted Critical
Publication of JP4371572B2 publication Critical patent/JP4371572B2/ja
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Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49716—Converting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Valve Housings (AREA)
  • Physical Vapour Deposition (AREA)
JP2000502528A 1997-07-11 1998-07-09 真空処理システムにおける２ピース式スリットバルブインサート Expired - Lifetime JP4371572B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/893,813 1997-07-11
US08/893,813 US6045620A (en) 1997-07-11 1997-07-11 Two-piece slit valve insert for vacuum processing system
PCT/US1998/014281 WO1999003136A1 (en) 1997-07-11 1998-07-09 Two-piece slit valve insert for vacuum processing system

Publications (3)

Publication Number Publication Date
JP2001509647A JP2001509647A (ja) 2001-07-24
JP2001509647A5 JP2001509647A5 (https=) 2009-09-17
JP4371572B2 true JP4371572B2 (ja) 2009-11-25

Family

ID=25402145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000502528A Expired - Lifetime JP4371572B2 (ja) 1997-07-11 1998-07-09 真空処理システムにおける２ピース式スリットバルブインサート

Country Status (5)

Country Link
US (1) US6045620A (https=)
EP (1) EP1002332A1 (https=)
JP (1) JP4371572B2 (https=)
KR (1) KR20010021746A (https=)
WO (1) WO1999003136A1 (https=)

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US6821347B2 (en) 2002-07-08 2004-11-23 Micron Technology, Inc. Apparatus and method for depositing materials onto microelectronic workpieces
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US6926775B2 (en) 2003-02-11 2005-08-09 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US7335396B2 (en) 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7086638B2 (en) * 2003-05-13 2006-08-08 Applied Materials, Inc. Methods and apparatus for sealing an opening of a processing chamber
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
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US7235138B2 (en) 2003-08-21 2007-06-26 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
US7422635B2 (en) 2003-08-28 2008-09-09 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7056806B2 (en) * 2003-09-17 2006-06-06 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
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US7323231B2 (en) * 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7647886B2 (en) * 2003-10-15 2010-01-19 Micron Technology, Inc. Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
US7258892B2 (en) * 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7906393B2 (en) * 2004-01-28 2011-03-15 Micron Technology, Inc. Methods for forming small-scale capacitor structures
US20050160992A1 (en) * 2004-01-28 2005-07-28 Applied Materials, Inc. Substrate gripping apparatus
US7584942B2 (en) * 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
TWD107405S1 (zh) * 2004-05-28 2005-11-01 東京威力科創股份有限公司 裝載鎖定處理室
CN2888643Y (zh) * 2004-06-02 2007-04-11 应用材料股份有限公司 电子装置制造室
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
CN103199039B (zh) * 2004-06-02 2016-01-13 应用材料公司 电子装置制造室及其形成方法
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
US7841582B2 (en) * 2004-06-02 2010-11-30 Applied Materials, Inc. Variable seal pressure slit valve doors for semiconductor manufacturing equipment
US20050268857A1 (en) * 2004-06-02 2005-12-08 Applied Materials, Inc. Uniformly compressed process chamber gate seal for semiconductor processing chamber
US7699932B2 (en) * 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
US7422653B2 (en) * 2004-07-13 2008-09-09 Applied Materials, Inc. Single-sided inflatable vertical slit valve
US20060165873A1 (en) * 2005-01-25 2006-07-27 Micron Technology, Inc. Plasma detection and associated systems and methods for controlling microfeature workpiece deposition processes
US20060162658A1 (en) * 2005-01-27 2006-07-27 Applied Materials, Inc. Ruthenium layer deposition apparatus and method
US20060237138A1 (en) * 2005-04-26 2006-10-26 Micron Technology, Inc. Apparatuses and methods for supporting microelectronic devices during plasma-based fabrication processes
TWI295816B (en) 2005-07-19 2008-04-11 Applied Materials Inc Hybrid pvd-cvd system
JP4821314B2 (ja) * 2005-12-26 2011-11-24 ダイキン工業株式会社 半導体製造装置用バルブの弁体およびその製造方法
JP4763786B2 (ja) * 2006-06-19 2011-08-31 日本バルカー工業株式会社 弁体部及びゲートバルブ装置
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US8272825B2 (en) 2007-05-18 2012-09-25 Brooks Automation, Inc. Load lock fast pump vent
US10541157B2 (en) 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
US8377213B2 (en) * 2008-05-05 2013-02-19 Applied Materials, Inc. Slit valve having increased flow uniformity
US20100127201A1 (en) * 2008-11-21 2010-05-27 Applied Materials, Inc. Interlocking valve chamber and lid
US20100304027A1 (en) * 2009-05-27 2010-12-02 Applied Materials, Inc. Substrate processing system and methods thereof
EP2293321A1 (en) * 2009-09-08 2011-03-09 Applied Materials, Inc. Mechanical modularity chambers
US20110180097A1 (en) * 2010-01-27 2011-07-28 Axcelis Technologies, Inc. Thermal isolation assemblies for wafer transport apparatus and methods of use thereof
JP2011035415A (ja) * 2010-10-18 2011-02-17 Hitachi High-Technologies Corp 真空処理装置
CN105580124B (zh) * 2013-09-26 2018-05-18 应用材料公司 用于基板处理的混合平台式设备、系统以及方法
US10090174B2 (en) 2016-03-01 2018-10-02 Lam Research Corporation Apparatus for purging semiconductor process chamber slit valve opening
KR102365815B1 (ko) * 2017-03-24 2022-02-21 도쿄엘렉트론가부시키가이샤 기판 처리 장치
JP6972852B2 (ja) * 2017-05-23 2021-11-24 東京エレクトロン株式会社 真空搬送モジュール及び基板処理装置
CN108933097B (zh) 2017-05-23 2023-06-23 东京毅力科创株式会社 真空输送组件和基片处理装置
WO2019027863A1 (en) * 2017-07-31 2019-02-07 Applied Materials, Inc. GAS SUPPLY ELEMENT WITH DEFLECTOR
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
US12400885B2 (en) * 2022-03-11 2025-08-26 Applied Materials, Inc. Modular multi-chamber processing tool having link chamber for ultra high vacuum processes

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Also Published As

Publication number Publication date
KR20010021746A (ko) 2001-03-15
JP2001509647A (ja) 2001-07-24
WO1999003136A1 (en) 1999-01-21
US6045620A (en) 2000-04-04
EP1002332A1 (en) 2000-05-24

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