KR20010015440A - 하이브리드 적층체 및 이의 제조방법 - Google Patents
하이브리드 적층체 및 이의 제조방법 Download PDFInfo
- Publication number
- KR20010015440A KR20010015440A KR1020000043057A KR20000043057A KR20010015440A KR 20010015440 A KR20010015440 A KR 20010015440A KR 1020000043057 A KR1020000043057 A KR 1020000043057A KR 20000043057 A KR20000043057 A KR 20000043057A KR 20010015440 A KR20010015440 A KR 20010015440A
- Authority
- KR
- South Korea
- Prior art keywords
- powder
- functional material
- material layer
- layer
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000463 material Substances 0.000 claims abstract description 203
- 239000000843 powder Substances 0.000 claims abstract description 135
- 239000000758 substrate Substances 0.000 claims abstract description 119
- 239000011521 glass Substances 0.000 claims abstract description 62
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 27
- 230000008569 process Effects 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000005388 borosilicate glass Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052878 cordierite Inorganic materials 0.000 claims description 3
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052661 anorthite Inorganic materials 0.000 claims description 2
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 55
- 239000003990 capacitor Substances 0.000 description 23
- 239000002002 slurry Substances 0.000 description 20
- 238000007639 printing Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 7
- 239000002270 dispersing agent Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000002241 glass-ceramic Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000007606 doctor blade method Methods 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 229910001952 rubidium oxide Inorganic materials 0.000 description 3
- CWBWCLMMHLCMAM-UHFFFAOYSA-M rubidium(1+);hydroxide Chemical compound [OH-].[Rb+].[Rb+] CWBWCLMMHLCMAM-UHFFFAOYSA-M 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- -1 and as a result Substances 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910018134 Al-Mg Inorganic materials 0.000 description 1
- 229910018467 Al—Mg Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/30—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being formed of particles, e.g. chips, granules, powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/0026—Multilayer LC-filter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Glass Compositions (AREA)
- Laminated Bodies (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
실시예 | 비교예 1 | 비교예 2 | |
글래스 첨가량 | 0체적% | 40체적% | 50체적% |
흡수율 | 0% | 0% | 0% |
수축율 | 1.2% | 11.2% | 11.3% |
ε | 170 | 47 | 34 |
Claims (13)
- 제 1 분말의 압축체(compact)를 함유하고 있는 기판층; 및상기 기판층과 접촉해 있고, 제 2 분말의 압축체를 함유하고 있는 기능 재료층을 포함하고 있는 하이브리드 적층체로서,상기 제 1 분말의 압축체는 글래스 재료를 포함하고 있고;상기 제 2 분말의 압축체는 유전성, 자성, 저항성 및 절연성으로부터 선택된 적어도 1개의 특정한 전기적 특성을 가지고 있는 세라믹 재료를 포함하고 있으며;상기 제 1 분말의 적어도 일부는 소결 상태에 있고;상기 제 2 분말은 미소결 상태에 있으며, 상기 기판층의 재료의 일부가 상기 기능 재료층에 분산되거나 또는 유동됨으로써 함께 접착되는 것을 특징으로 하는 하이브리드 적층체.
- 제 1 항에 있어서, 상기 기판층의 재료의 일부는 상기 기능 재료층의 전 영역에 걸쳐서 분산되거나 또는 유동되며, 상기 제 2 분말의 실질적인 모든 분말은 상기 기판층의 재료에 의해 함께 접착되는 것을 특징으로 하는 하이브리드 적층체.
- 제 1 항 또는 제 2 항에 있어서, 상기 제 1 분말의 적어도 일부는 상기 제 2 분말의 소결 온도보다 낮은 융점을 가지고 있는 것을 특징으로 하는 하이브리드 적층체.
- 제 1 항 또는 제 2 항에 있어서, 상기 글래스 재료는 소결에 의해 일어나는 용해를 통해서 글래스화되는 재료를 포함하고 있는 것을 특징으로 하는 하이브리드 적층체.
- 제 1 항 또는 제 2 항에 있어서, 상기 제 1 분말의 압축체는 세라믹 재료를 더 포함하고 있는 것을 특징으로 하는 하이브리드 적층체.
- 제 5 항에 있어서, 상기 제 1 분말의 압축체는 알루미나를 함유하고 있는 혼합물, 및 어놀싸이트계(anorthite) 결정화글래스, 붕규산글래스 및 코오디어라이트계(cordierite) 결정화글래스 중의 적어도 1종을 포함하고 있는 것을 특징으로 하는 하이브리드 적층체.
- 제 1 항 또는 제 2 항에 있어서, 복수개의 기판층을 더 구비하고 있고, 상기 복수개의 기판층이 그들 사이에 형성된 상기 기능 재료층과 함께 적층되는 것을 특징으로 하는 하이브리드 적층체.
- 제 1 항 또는 제 2 항에 있어서, 복수개의 기능 재료층을 더 구비하고 있고, 상기 복수개의 기능 재료층이 그들 사이에 형성된 상기 기판층과 함께 적층되는 것을 특징으로 하는 하이브리드 적층체.
- 제 8 항에 있어서, 상기 복수개의 기능 재료층은 제 1 기능 재료층 및 제 2 기능 재료층을 구비하고 있고, 상기 제 1 기능 재료층에 함유되어 있는 세라믹 재료와 상기 제 2 기능 재료층에 함유되어 있는 세라믹 재료는 전기적 특성이 서로 다른 것을 특징으로 하는 하이브리드 적층체.
- 제 1 항 또는 제 2 항에 있어서, 상기 하이브리드 적층체의 표면 및/또는 내부에 형성된 도전부재를 더 포함하고 있으며, 상기 기판층, 상기 기능 재료층 및 상기 도전부재는 전자부품을 구성하는 것을 특징으로 하는 하이브리드 적층체.
- 글래스 재료를 함유하고 있는 제 1 분말을 준비하는 제 1 공정;상기 제 1 분말의 적어도 일부를 소결시키기는 온도에서는 소결되지 않고, 유전성, 자성, 저항성 및 절연성으로부터 선택된 적어도 1개의 전기적 특성을 가지고 있는 제 2 분말을 준비하는 제 2 공정;상기 제 1 분말을 함유하고 있는 생 상태의 기판층과, 상기 기판층에 접촉해 있도록 형성되어 있고 상기 제 2 분말을 함유하고 있는 생 상태의 기능 재료층을 구비하고 있는 생 상태의 하이브리드 적층체를 제작하는 제 3 공정; 및상기 제 1 분말의 적어도 일부는 소결되고, 상기 기판층의 재료의 일부를 상기 기능 재료층에 분산시키거나 또는 유동시켜서 상기 제 2 분말을 소결시키지 않고 함께 접착시키는 소정의 온도에서, 생 상태의 적층체를 베이킹하는 제 4 공정을 포함하고 있는 것을 특징으로 하는 하이브리드 적층체의 제조방법.
- 제 11 항에 있어서, 상기 제 1 공정에서, 상기 기판층은 상기 제 1 분말을 함유하고 있는 제 1 그린시트 상태로 준비되는 것을 특징으로 하는 하이브리드 적층체의 제조방법.
- 제 12 항에 있어서, 상기 제 1 공정에서, 상기 기능 재료층은 상기 제 2 분말을 함유하고 있는 제 2 그린시트 상태로 준비되고, 상기 제 1 공정은 상기 제 1 그린시트와 상기 제 2 그린시트가 접촉해 있게 상기 제 2 그린시트를 적층시키는 공정을 포함하고 있는 것을 특징으로 하는 하이브리드 적층체의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21154699A JP3601679B2 (ja) | 1999-07-27 | 1999-07-27 | 複合積層体の製造方法 |
JP11-211546 | 1999-07-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010015440A true KR20010015440A (ko) | 2001-02-26 |
KR100344923B1 KR100344923B1 (ko) | 2002-07-20 |
Family
ID=16607623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000043057A KR100344923B1 (ko) | 1999-07-27 | 2000-07-26 | 하이브리드 적층체 및 이의 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6306511B1 (ko) |
JP (1) | JP3601679B2 (ko) |
KR (1) | KR100344923B1 (ko) |
DE (1) | DE10033984A1 (ko) |
GB (1) | GB2354483B (ko) |
TW (1) | TW495774B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100753231B1 (ko) * | 2004-11-22 | 2007-08-30 | 알프스 덴키 가부시키가이샤 | 회로 기판 및 그 제조방법 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3656484B2 (ja) * | 1999-03-03 | 2005-06-08 | 株式会社村田製作所 | セラミック多層基板の製造方法 |
JP2001047423A (ja) * | 1999-08-09 | 2001-02-20 | Murata Mfg Co Ltd | 複合積層体およびその製造方法 |
JP3554962B2 (ja) * | 1999-10-28 | 2004-08-18 | 株式会社村田製作所 | 複合積層体およびその製造方法 |
DE10106049A1 (de) * | 2001-02-09 | 2002-09-12 | Siemens Ag | Glaskeramische Zusammensetzung und Verfahren zum Herstellen einer Glaskeramik unter Verwendung der glaskeramischen Zusammensetzung |
US6759740B2 (en) * | 2001-03-30 | 2004-07-06 | Kyocera Corporation | Composite ceramic board, method of producing the same, optical/electronic-mounted circuit substrate using said board, and mounted board equipped with said circuit substrate |
JP2002368422A (ja) * | 2001-04-04 | 2002-12-20 | Murata Mfg Co Ltd | 多層セラミック基板及びその製造方法 |
DE10145363A1 (de) * | 2001-09-14 | 2003-04-10 | Epcos Ag | Verfahren zur Herstellung eines keramischen Substrats und keramisches Substrat |
US6835463B2 (en) * | 2002-04-18 | 2004-12-28 | Oakland University | Magnetoelectric multilayer composites for field conversion |
TW530377B (en) * | 2002-05-28 | 2003-05-01 | Via Tech Inc | Structure of laminated substrate with high integration and method of production thereof |
US6893710B2 (en) | 2003-04-18 | 2005-05-17 | Yageo Corporation | Multilayer ceramic composition |
US7128472B2 (en) * | 2003-07-31 | 2006-10-31 | International Business Machines Corporation | Method and apparatus for providing optoelectronic communication with an electronic device |
JP4396701B2 (ja) * | 2004-04-20 | 2010-01-13 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法ならびに圧電共振部品 |
JP4587758B2 (ja) * | 2004-09-22 | 2010-11-24 | 京セラ株式会社 | ガラスセラミック基板 |
JP4583121B2 (ja) * | 2004-09-27 | 2010-11-17 | 京セラ株式会社 | ガラスセラミック基板 |
WO2007004415A1 (ja) | 2005-07-01 | 2007-01-11 | Murata Manufacturing Co., Ltd. | 多層セラミック基板およびその製造方法ならびに多層セラミック基板作製用複合グリーンシート |
US20070060969A1 (en) * | 2005-09-15 | 2007-03-15 | Burdon Jeremy W | Implantable co-fired electrical feedthroughs |
US7998561B2 (en) | 2008-10-23 | 2011-08-16 | Samsung Electro-Mechanics Co., Ltd. | Ceramic laminate and method of manufacturing ceramic sintered body |
JP2013051389A (ja) * | 2011-08-01 | 2013-03-14 | Ngk Spark Plug Co Ltd | 回路基板、半導体パワーモジュール、製造方法 |
CN109819585A (zh) * | 2017-11-20 | 2019-05-28 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5563900A (en) * | 1978-11-08 | 1980-05-14 | Fujitsu Ltd | Multilyaer ceramic circuit board |
JPS6014494A (ja) * | 1983-07-04 | 1985-01-25 | 株式会社日立製作所 | セラミツク多層配線基板およびその製造方法 |
US5254191A (en) * | 1990-10-04 | 1993-10-19 | E. I. Du Pont De Nemours And Company | Method for reducing shrinkage during firing of ceramic bodies |
JPH0811696B2 (ja) * | 1993-04-22 | 1996-02-07 | 日本電気株式会社 | 多層ガラスセラミック基板とその製造方法 |
JPH08181443A (ja) * | 1994-12-21 | 1996-07-12 | Murata Mfg Co Ltd | セラミック多層基板およびその製造方法 |
WO1996039298A1 (en) * | 1995-06-06 | 1996-12-12 | Sarnoff Corporation | Method for the reduction of lateral shrinkage in multilayer circuit boards on a support |
-
1999
- 1999-07-27 JP JP21154699A patent/JP3601679B2/ja not_active Expired - Lifetime
-
2000
- 2000-06-09 TW TW089111263A patent/TW495774B/zh not_active IP Right Cessation
- 2000-06-09 GB GB0014182A patent/GB2354483B/en not_active Expired - Lifetime
- 2000-07-13 DE DE10033984A patent/DE10033984A1/de not_active Ceased
- 2000-07-21 US US09/620,856 patent/US6306511B1/en not_active Expired - Lifetime
- 2000-07-26 KR KR1020000043057A patent/KR100344923B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100753231B1 (ko) * | 2004-11-22 | 2007-08-30 | 알프스 덴키 가부시키가이샤 | 회로 기판 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
GB0014182D0 (en) | 2000-08-02 |
DE10033984A1 (de) | 2001-03-08 |
JP3601679B2 (ja) | 2004-12-15 |
TW495774B (en) | 2002-07-21 |
JP2001030419A (ja) | 2001-02-06 |
GB2354483B (en) | 2001-08-08 |
US6306511B1 (en) | 2001-10-23 |
GB2354483A (en) | 2001-03-28 |
KR100344923B1 (ko) | 2002-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100344923B1 (ko) | 하이브리드 적층체 및 이의 제조방법 | |
KR100352780B1 (ko) | 다층 세라믹 기판 및 그의 제조방법 | |
JP3407716B2 (ja) | 複合積層電子部品 | |
US7243424B2 (en) | Production method for a multilayer ceramic substrate | |
US6588097B2 (en) | Method of manufacturing multilayered ceramic substrate and green ceramic laminate | |
JP2001060767A (ja) | セラミック基板の製造方法および未焼成セラミック基板 | |
JP2008273817A (ja) | 絶縁体セラミック組成物およびそれを用いた絶縁体セラミック | |
WO1992014275A1 (en) | Dielectric filter | |
JP2851966B2 (ja) | 積層型誘電体フィルター | |
JP2000264724A (ja) | 誘電体セラミック組成物及びセラミック多層基板 | |
JPS5917232A (ja) | 複合積層セラミツク部品およびその製造方法 | |
JP2001244140A (ja) | セラミック積層体およびその製造方法、ならびに電子部品、電子装置 | |
JP2004186395A (ja) | セラミック基板の製造方法 | |
JP4077625B2 (ja) | 低温焼成磁器組成物および低温焼成磁器の製造方法 | |
JP5114141B2 (ja) | 電子部品およびその製造方法 | |
JP2003026472A (ja) | 積層セラミック電子部品の製造方法、積層セラミック電子部品および積層セラミック電子部品製造用の生の複合積層体 | |
JP4817855B2 (ja) | コンデンサ内蔵配線基板およびその製造方法 | |
JPH1155058A (ja) | 積層セラミック複合部品 | |
JPH11340634A (ja) | 積層体およびその製造方法 | |
KR20000045202A (ko) | 저온동시소성세라믹의 내장 커패시터 제조방법 | |
KR100233464B1 (ko) | 고밀도 다기능의 적층형 전자세라믹 부품의 제조 방법 | |
KR100582641B1 (ko) | 저온 동시소성 페라이트-세라믹 복합체 및 그 제조방법 | |
JP2000264722A (ja) | 誘電体セラミック組成物及びセラミック多層基板 | |
JP2006066743A (ja) | コンデンサ内蔵ガラスセラミック多層配線基板およびその製造方法 | |
JPH0653717A (ja) | 誘電体共振器及び誘電体フィルタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130603 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20140630 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20150619 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20160628 Year of fee payment: 15 |
|
FPAY | Annual fee payment |
Payment date: 20170623 Year of fee payment: 16 |
|
FPAY | Annual fee payment |
Payment date: 20190620 Year of fee payment: 18 |