KR19990072074A - 웨이퍼평활도를유지하는동안웨이퍼물질의금속오염세척 - Google Patents
웨이퍼평활도를유지하는동안웨이퍼물질의금속오염세척 Download PDFInfo
- Publication number
- KR19990072074A KR19990072074A KR1019980704380A KR19980704380A KR19990072074A KR 19990072074 A KR19990072074 A KR 19990072074A KR 1019980704380 A KR1019980704380 A KR 1019980704380A KR 19980704380 A KR19980704380 A KR 19980704380A KR 19990072074 A KR19990072074 A KR 19990072074A
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning
- glycol
- weight
- wafer
- composition
- Prior art date
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- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 100
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- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- RKTGAWJWCNLSFX-UHFFFAOYSA-M bis(2-hydroxyethyl)-dimethylazanium;hydroxide Chemical compound [OH-].OCC[N+](C)(C)CCO RKTGAWJWCNLSFX-UHFFFAOYSA-M 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- KFJNCGCKGILQMF-UHFFFAOYSA-M dibutyl(dimethyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](C)(C)CCCC KFJNCGCKGILQMF-UHFFFAOYSA-M 0.000 description 1
- JQDCIBMGKCMHQV-UHFFFAOYSA-M diethyl(dimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)CC JQDCIBMGKCMHQV-UHFFFAOYSA-M 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- MHUWZNTUIIFHAS-CLFAGFIQSA-N dioleoyl phosphatidic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(COP(O)(O)=O)OC(=O)CCCCCCC\C=C/CCCCCCCC MHUWZNTUIIFHAS-CLFAGFIQSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- PZZHMLOHNYWKIK-UHFFFAOYSA-N eddha Chemical compound C=1C=CC=C(O)C=1C(C(=O)O)NCCNC(C(O)=O)C1=CC=CC=C1O PZZHMLOHNYWKIK-UHFFFAOYSA-N 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 229940093915 gynecological organic acid Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229960004502 levodopa Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- KTDMLSMSWDJKGA-UHFFFAOYSA-M methyl(tripropyl)azanium;hydroxide Chemical compound [OH-].CCC[N+](C)(CCC)CCC KTDMLSMSWDJKGA-UHFFFAOYSA-M 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- 229950006389 thiodiglycol Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- HPWUYZIJILJHNG-UHFFFAOYSA-M tributyl(2-hydroxyethyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](CCO)(CCCC)CCCC HPWUYZIJILJHNG-UHFFFAOYSA-M 0.000 description 1
- FYFNFZLMMGXBMT-UHFFFAOYSA-M tributyl(ethyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](CC)(CCCC)CCCC FYFNFZLMMGXBMT-UHFFFAOYSA-M 0.000 description 1
- QVOFCQBZXGLNAA-UHFFFAOYSA-M tributyl(methyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](C)(CCCC)CCCC QVOFCQBZXGLNAA-UHFFFAOYSA-M 0.000 description 1
- JAJRRCSBKZOLPA-UHFFFAOYSA-M triethyl(methyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(CC)CC JAJRRCSBKZOLPA-UHFFFAOYSA-M 0.000 description 1
- IJGSGCGKAAXRSC-UHFFFAOYSA-M tris(2-hydroxyethyl)-methylazanium;hydroxide Chemical compound [OH-].OCC[N+](C)(CCO)CCO IJGSGCGKAAXRSC-UHFFFAOYSA-M 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/268—Carbohydrates or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Molecular Biology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
테이블 170℃에서 TMAH 세척제하의 글리콜의 효과 | ||||
글리콜없는 비교TMAH 용액 | 글리콜을 함유하는 TMAH 조성식 | |||
TMAH 중량% | 평균Rz거칠기(Å) | 글리콜 | 글리콜 중량% | 평균Rz거칠기(Å) |
0.10 | 675 | 디에틸렌글리콜 | 36 | <25 |
0.50 | 750 | 디에틸렌글리콜 | 36 | <25 |
1.0 | 650 | 디에틸렌글리콜 | 36 | <25 |
2.0 | 2,550 | 디에틸렌글리콜 | 36 | <25 |
3.0 | 1,250 | 디에틸렌글리콜 | 36 | 375 |
3.0 | 1,250 | 트리에틸렌글리콜 | 36 | <25 |
4.0 | 1,175 | 디에틸렌글리콜 | 36 | <25 |
4.0 | 1,175 | 트리에틸렌글리콜 | 36 | <25 |
테이블 260℃에서 TMAH 세척제하의 글리콜의 효과 | ||||
글리콜없는 비교TMAH 용액 | 글리콜을 함유하는 TMAH 조성식 | |||
TMAH 중량% | 평균Rz거칠기(Å) | 글리콜 | 글리콜 중량% | 평균Rz거칠기(Å) |
0.10 | 4,250 | 디에틸렌글리콜 | 36 | <25 |
0.50 | 5,700 | 디에틸렌글리콜 | 36 | 50 |
테이블 380℃에서 TMAH 세척제하의 글리콜의 효과 | ||||
글리콜없는 비교TMAH 용액 | 글리콜을 함유하는 TMAH 조성식 | |||
TMAH 중량% | 평균Rz거칠기(Å) | 글리콜 | 글리콜 중량% | 평균Rz거칠기(Å) |
0.01 | 825 | 디에틸렌글리콜 | 36 | <25 |
0.05 | 5,200 | 디에틸렌글리콜 | 36 | <25 |
0.10 | 10,000 | 디에틸렌글리콜 | 36 | 375 |
0.50 | 18,000 | 디에틸렌글리콜 | 36 | 175 |
테이블 490℃에서 TMAH 세척제하의 글리콜의 효과 | ||||
글리콜없는 비교TMAH 용액 | 글리콜을 함유하는 TMAH 조성식 | |||
TMAH 중량% | 평균Rz거칠기(Å) | 글리콜 | 글리콜 중량% | 평균Rz거칠기(Å) |
0.10 | 10,750 | 디에틸렌글리콜 | 36 | <25 |
0.50 | 2,250 | 디에틸렌글리콜 | 36 | 375 |
테이블 570℃에서 TMAH 세척제하의 글리콜의 효과 | ||||
글리콜없는 비교TMAH 용액 | 글리콜을 함유하는 TMAH 조성식 | |||
TMAH 중량% | 평균Rz거칠기(Å) | 글리콜 | 글리콜 중량% | 평균Rz거칠기(Å) |
0.30 | 4,250 | 디에틸렌글리콜 | 36 | <25 |
0.30 | 3,500 | 디에틸렌글리콜 | 22 | 300 |
0.30 | 3,500 | 디에틸렌글리콜 | 12 | 575 |
0.30 | 3,500 | 디에틸렌글리콜 | 6.5 | 1100 |
0.30 | 6,600 | 트리에틸렌글리콜 | 12 | <25 |
0.30 | 6,600 | 2-메틸-2,4-펜탄디올 | 10 | 125 |
0.30 | 6,600 | 트리프로필렌글리콜 | 11 | <25 |
테이블 660℃에서 알칼리 세척제하의 글리콜의 효과 | ||||
글리콜없는 알칼리성분(1.3 Wt.%) | 글리콜을 함유하는 알칼리 조성식 | |||
알칼리성분 | 평균Rz거칠기(Å) | 글리콜 | 글리콜 중량% | 평균Rz거칠기(Å) |
TEAH | 750 | 디에틸렌글리콜 | 36 | <25 |
콜린 | 375 | 디에틸렌글리콜 | 36 | <25 |
수산화암모늄 | 3,000 | 디에틸렌글리콜 | 36 | <25 |
MEA | 375 | 디에틸렌글리콜 | 36 | <25 |
테이블 780℃에서 알칼리 세척제하의 글리콜의 효과 | ||||
글리콜없는 알칼리 성분(1.3Wt.%) | 글리콜을 함유하는 알칼리 조성식 | |||
알칼리성분 | 평균Rz거칠기 | 글리콜 | 글리콜중량% | 평균Rz거칠기(Å) |
MIPA | 2550 | 디에틸렌글리콜 | 36 | <25 |
DEGA | 9000 | 디에틸렌글리콜 | 36 | ≤25 |
AP | 13750 | 디에틸렌글리콜 | 36 | <25 |
MPA | 2400 | 디에틸렌글리콜 | 36 | <25 |
AEP | 100 | 디에틸렌글리콜 | 36 | <25 |
모르폴린 | 225 | 디에틸렌글리콜 | 36 | <50 |
테이블8알칼리 세척제하에서 글리콜의 효과 | ||
처치 | 하기물질로희석된 알칼리용액 | RMS(Å) |
피란하(단독) | ----- | 1.9 |
(1)피란하(2)알칼리용액 A | 탈이온화수와 DEG | 1.6 |
(1)피란하(2)알칼리용액 B | 탈이온화수(단독) | 445.0 |
테이블 9완충된 알칼리 세척제하에서 글리콜의 효과 | |||
처치 | 70℃에서 처치시간(분) | 하기물질로 희석된완충된 알칼리용액 | RMS(Å) |
피란하(단독) | ----- | ----- | 1.9 |
(1)피란하(2)알칼리용액 C | 5 | DEG(단독) | 2.0 |
(1)피란하(2)알칼리용액 D | 5 | 탈이온화수와 EG | 2.1 |
(1)피란하(2)알칼리용액 E | 5 | 탈이온화수와 TaEG | 73.2 |
(1)피란하(2)알칼리용액 F | 5 | 탈이온화수(단독) | 129.6 |
테이블 10완충된 알칼리 세척제하에서 글리콜의 효과 | |||
처치 | 70℃에서 처치시간(분) | 하기물질로 희석된완충된 알칼리용액 | RMS(Å) |
피란하(단독) | ----- | ----- | 1.9 |
(1)피란하(2)알칼리용액 G | 3 | 탈이온화수와 DEG | 2.5 |
(1)피란하(2)알칼리용액 F | 3 | 탈이온화수(단독) | 83.4 |
테이블 11완충된 알칼리 세척제하에서 글리콜의 효과 | |||
처치 | 70℃에서 처치시간(분) | 하기물질로 희석된완충된 알칼리용액 | RMS(Å) |
피란하(단독) | ----- | ----- | 1.9 |
(1)피란하(2)알칼리용액 H | 5 | 탈이온화수와 DEG | 1.9 |
(1)피란하(2)알칼리용액 I | 5 | 탈이온화수(단독) | 254.3 |
테이블 12완충된 알칼리 세척제하에서 글리콜의 효과 | |||
처치 | 70℃에서 처치시간(분) | 하기물질로 희석된완충된 알칼리용액 | RMS(Å) |
피란하(단독) | ----- | ----- | 1.9 |
(1)피란하(2)알칼리용액 J | 5 | 탈이온화수와 DEG | 1.4 |
(1)피란하(2)알칼리용액 K | 5 | 탈이온화수(단독) | 153.2 |
테이블 13알칼리 세척제를 포함하는 글리콜의 금속제거효과 | |||
처치 | 알루미늄을위한 표면오염농도(×1010원자/cm2) | 구리를 위한 표면오염농도(×1010원자/cm2) | 철을 위한 표면오염농도(×1010원자/cm2) |
"제조사에서 수용된것" | 150 | 11 | 720 |
용액 A | 97 | 1.8 | 9.0 |
테이블 14알칼리 세척제하에서 당알콜의 효과 | |||
처치 | 하기물질로 희석된 알칼리 용액 | 당알콜 중량% | RMS(Å) |
피란하(단독) | ---- | ----- | 1.9 |
(1)피란하(2)알칼리용액 B | 탈이온화수(단독) | ---- | 445.0 |
(1)피란하(2)알칼리용액 M | 탈이온화수와 D-만니톨 | 10 | 48.9 |
(1)피란하(2)알칼리용액 N | 탈이온화수와 메조-에리트리톨 | 20 | 3.1 |
(1)피란하(2)알칼리용액 O | 탈이온화수와 D-소비톨 | 20 | 174.0 |
(1)피란하(2)알칼리용액 P | 탈이온화수와 자일리톨 | 20 | 142.4 |
(1)피란하(2)알칼리용액 Q | 탈이온화수와 아도니톨 | 20 | 116.7 |
(1)피란하(2)알칼리용액 R | 탈이온화수와 글리세롤 | 20 | 216.2 |
(1)피란하(2)알칼리용액 S | 탈이온화수와 DL-트레이톨 | 20 | 5.8 |
Claims (30)
- 알칼리의 수용성용액과, 자유염기-금속이온 그리고 2 내지 10의 -OH그룹을 포함하는 폴리하이드록시 복합물로 구성되고 상기 폴리하이드록시 복합물은 다음식을 가지며:HO - Z - OH, 상기 식에서 -Z-는 -R-, -(-R1-O-)x-R2- 또는 -R3- 이며 상기│(OH)y-R-, -R1-, -R2- 그리고 -R3-는 알킬렌 라디칼이고, X는 전체 정수의 수가 1 내지 4, Y는 전체정수의 수가 1 내지 8, 복합물에서 탄소원자의 수는 10을 초과하지 않으며, 그리고 수용성용액내에 존재하는 물은 최소한 조성물 중량의 약 40%를 포함되도록 구성되는 세척조성물과, 상기 세척조성물내에서 웨이퍼 표면물질을 세척하기위해 충분한 온도와 시간동안 상기 웨이퍼표면물질이 상기 세척조성물과 접촉되도록 하는 과정과, 상기 웨이퍼물질 표면평활도를 유지하는 동안 금속오염을 제거하는 것을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 1 항에 있어서,상기 알칼리와 자유염기-금속이온은 세척조성물에 있어 중량에 의해 25%의 양까지 존재하고, 상기 폴리하이드록시 복합물은 세척조성물에 있어 중량에 의해 약 50%의 양까지 존재함을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 2 항에 있어서,상기 알칼리와 자유염기-금속이온은 세척조성물에 있어 중량에 의해 약 0.05% 내지 약 10%의 양까지 존재하고, 상기 폴리하이드록시 복합물은 세척조성물에 있어 중량에 의해 약 5% 내지 약 40%의 양까지 존재함을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 3 항에 있어서,상기 세척조성물에는 금속 킬레이트복합물이 세척조성물 중량의 약 0.01 내지 약 5%의 양까지 더 포함함을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 2 항에 있어서,상기 알칼리와 자유염기-금속이온은, 수산화암모늄과, 또는 알킬그룹이 치환되지않는 알킬그룹이거나 수산기 또는 알콕시라디칼 그리고 이들의 혼합물로 치환되는 알킬그룹을 갖는 테트라알킬수산화암모늄으로 구성되는 그룹으로부터 선택됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 5 항에 있어서,상기 알칼리와 자유염기-금속이온은, 테트라메틸수산화암모늄, 테트라에틸수산화암모늄, 트리메틸-2-하이드록시에틸 수산화암모늄, 수산화암모늄 그리고 이들의 혼합물로 구성되는 그룹으로부터 선택됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 2 항에 있어서,상기 알칼리와 자유염기-금속이온은 알칸올아민임을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 2 항에 있어서,상기 알칼리와 자유염기-금속이온은 알칸 디아민임을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 1 항에 있어서,상기 폴리하이드록시복합물은, 한센 수소결합 용해성척도가 7.5cal1/2cm-3/2보다 더 큰 고도의 친수성인 알칸 디올과 그리고 비시날 알칸폴리올로 이루어지는 그룹으로 부터 선택됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 9 항에 있어서, 상기 폴리하이드록시복합물은, 에틸렌글리콜, 디에틸렌글리콜, 트리에틸렌글리콜, 테트라에틸렌글리콜, 프로필렌글리콜, 디프로필렌글리콜, 트리프로필렌글리콜, 테트라프로필렌글리콜, 2-메틸-2,4-펜탄디올 그리고 이들의 혼합물로 구성되는 그룹에서 선택되는 알칸디올임을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 9 항에 있어서, 상기 폴리하이드록시복합물은, 만니톨, 에리트리톨, 소비톨, 자일리톨, 아도니톨, 글리세롤 그리고 이들의 혼합물로 구성되는 그룹에서 그룹에서 선택되는 비시날 알칸 폴리올임을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 4 항에 있어서,상기 세척조성물은, 약 0.07중량%의 테트라메틸수산화암모늄, 약 0.50중량%의 수산화암모늄용액, 약 36중량%의 디에틸렌글리콜, 약 0.09중량%의 에틸렌디아민테트라 아세트산 그리고 물로 이루어지는 잔유물발란스를 포함하는 수용성용액으로 구성됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 4 항에 있어서,상기 세척조성물은, 약 0.07중량%의 테트라메틸수산화암모늄, 약 2.5중량%의 수산화암모늄, 에틸렌글리콜과 디에틸렌글리콜로 구성되는 그룹에서 선택된 약 35중량%의 글리콜, 약 0.08중량%의 빙초산, 약 0.09중량%의 에틸렌디아민테트라 아세트산 그리고 물로 이루어지는 잔유물발란스를 포함하는 수용성용액으로 구성됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 2 항에 있어서,상기 세척조성물은, 약 0.5중량%의 테트라메틸수산화암모늄, 약 4중량%의 1,3-펜탄디아민, 약 50중량%의 디에틸렌글리콜, 약 1중량%의 아세트산, 약 0.09중량%의 에틸렌디아민테트라 아세트산 그리고 물로 이루어지는 잔유물발란스를 포함하는 수용성용액으로 구성됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 제 2 항에 있어서,상기 세척조성물은, 약 0.5중량%의 테트라메틸수산화암모늄, 약 4중량%의 1,3-펜탄디아민, 약 50중량%의 디에틸렌글리콜, 약 0.6중량%의 염산, 약 0.09중량%의 에틸렌디아민테트라 아세트산 그리고 물로 이루어지는 잔유물발란스를 포함하는 수용성용액으로 구성됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척을 위한 프로세스.
- 알칼리의 수용성용액과, 자유염기-금속이온 그리고 2 내지 10의 -OH그룹을 포함하는 폴리하이드록시 복합물로 구성되고 상기 폴리하이드록시 복합물은 다음식을 가지며:HO - Z - OH, 상기 식에서 -Z-는 -R-, -(-R1-O-)x-R2- 또는 -R3- 이며 상기│(OH)y-R-, -R1-, -R2- 그리고 -R3-는 알킬렌 라디칼이고, X는 전체 정수의 수가 1 내지 4, Y는 전체정수의 수가 1 내지 8, 복합물에서 탄소원자의 수는 10을 초과하지 않으며, 그리고 수용성용액내에 존재하는 물은 최소한 조성물 중량의 약 40%를 포함되도록 구성되어, 상기 웨이퍼물질 표면평활도를 유지하는 동안 금속오염을 제거하기 위한 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 16 항에 있어서,상기 알칼리와 자유염기-금속이온은 상기 세척조성물내에서 25중량%의 양까지이고, 상기 폴리하이드록시복합물은 세척조성물의 약 50중량% 양까지 존재함을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면세척용 세척조성물.
- 제 17 항에 있어서,상기 알칼리와 자유염기-금속이온은 약 0.05중량% 내지 10중량%의 양까지이고, 상기 폴리하이드록시복합물은 약 5중량% 내지 약 40중량%까지의 양으로 존재함을 특징으로 하는 마이트로일렉트로닉스 웨이퍼물질 표면세척용 세척조성물.
- 제 18 항에 있어서,상기 세척조성물에는 금속 킬레이트복합물이 세척조성물 중량의 약 0.01 내지 약 5%의 양까지 더 포함함을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 17 항에 있어서,상기 알칼리와 자유염기-금속이온은, 수산화암모늄과, 또는 알킬그룹이 치환되지않는 알킬그룹이거나 수산기 또는 알콕시라디칼 그리고 이들의 혼합물로 치환되는 알킬그룹을 갖는 테트라알킬수산화암모늄으로 구성되는 그룹으로부터 선택됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 20 항에 있어서,상기 알칼리와 자유염기-금속이온은, 테트라메틸수산화암모늄, 테트라에틸수산화암모늄, 트리메틸-2-하이드록시에틸 수산화암모늄, 수산화암모늄 그리고 이들의 혼합물로 구성되는 그룹으로부터 선택됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 17 항에 있어서,상기 알칼리와 자유염기-금속이온은 알칸올아민임을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 16 항에 있어서,상기 알칼리와 자유염기-금속이온은 알칸 디아민임을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 16 항에 있어서,상기 폴리하이드록시복합물은, 한센 수소결합 용해성척도가 7.5cal1/2cm-3/2보다 더 큰 고도의 친수성인 알칸 디올과 그리고 비시날 알칸폴리올로 이루어지는 그룹으로 부터 선택됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 24 항에 있어서,상기 폴리하이드록시복합물은, 에틸렌글리콜, 디에틸렌글리콜, 트리에틸렌글리콜, 테트라에틸렌글리콜, 프로필렌글리콜, 디프로필렌글리콜, 트리프로필렌글리콜, 테트라프로필렌글리콜, 2-메틸-2,4-펜탄디올 그리고 이들의 혼합물로 구성되는 그룹에서 선택되는 알칸디올임을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 24 항에 있어서,상기 폴리하이드록시복합물은, 만니톨, 에리트리톨, 소비톨, 자일리톨, 아도니톨, 글리세롤 그리고 이들의 혼합물로 구성되는 그룹에서 그룹에서 선택되는 비시날 알칸 폴리올임을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물
- 제 19 항에 있어서,상기 세척조성물은, 약 0.07중량%의 테트라메틸수산화암모늄, 약 0.50중량%의 수산화암모늄, 약 36중량%의 디에틸렌글리콜, 약 0.09중량%의 에틸렌디아민테트라 아세트산 그리고 물로 이루어지는 잔유물발란스를 포함하는 수용성용액으로 구성됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 19 항에 있어서,상기 세척조성물은, 약 0.07중량%의 테트라메틸수산화암모늄, 약 2.5중량%의 수산화암모늄, 에틸렌글리콜과 디에틸렌글리콜로 구성되는 그룹에서 선택된 약 35중량%의 글리콜, 약 0.08중량%의 빙초산, 약 0.09중량%의 에틸렌디아민테트라 아세트산 그리고 물로 이루어지는 잔유물발란스를 포함하는 수용성용액으로 구성됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 17 항에 있어서,상기 세척조성물은, 약 0.5중량%의 테트라메틸수산화암모늄, 약 4중량%의 1,3-펜탄디아민, 약 50중량%의 디에틸렌글리콜, 약 1중량%의 아세트산, 약 0.09중량%의 에틸렌디아민테트라 아세트산 그리고 물로 이루어지는 잔유물발란스를 포함하는 수용성용액으로 구성됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
- 제 17 항에 있어서,상기 세척조성물은, 약 0.5중량%의 테트라메틸수산화암모늄, 약 4중량%의 1,3-펜탄디아민, 약 50중량%의 디에틸렌글리콜, 약 0.6중량%의 염산, 약 0.09중량%의 에틸렌디아민테트라 아세트산 그리고 물로 이루어지는 잔유물발란스를 포함하는 수용성용액으로 구성됨을 특징으로 하는 마이크로일렉트로닉스 웨이퍼물질 표면 세척용 세척조성물.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/729,565 US5989353A (en) | 1996-10-11 | 1996-10-11 | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
US8/729565 | 1996-10-11 | ||
US08/729565 | 1996-10-11 | ||
PCT/US1997/018052 WO1998016330A1 (en) | 1996-10-11 | 1997-10-07 | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
Publications (2)
Publication Number | Publication Date |
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KR19990072074A true KR19990072074A (ko) | 1999-09-27 |
KR100305314B1 KR100305314B1 (ko) | 2001-11-30 |
Family
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Family Applications (1)
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KR1019980704380A KR100305314B1 (ko) | 1996-10-11 | 1997-10-07 | 마이크로일렉트로닉스웨이퍼물질표면세척방법 |
Country Status (11)
Country | Link |
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US (1) | US5989353A (ko) |
EP (1) | EP0886547B1 (ko) |
JP (1) | JP4282093B2 (ko) |
KR (1) | KR100305314B1 (ko) |
CN (1) | CN1107343C (ko) |
AT (1) | ATE315965T1 (ko) |
DE (1) | DE69735126T2 (ko) |
DK (1) | DK0886547T3 (ko) |
ES (1) | ES2252776T3 (ko) |
TW (1) | TW467954B (ko) |
WO (1) | WO1998016330A1 (ko) |
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- 1997-10-07 JP JP51841798A patent/JP4282093B2/ja not_active Expired - Fee Related
- 1997-10-07 ES ES97910817T patent/ES2252776T3/es not_active Expired - Lifetime
- 1997-10-07 WO PCT/US1997/018052 patent/WO1998016330A1/en active IP Right Grant
- 1997-10-07 EP EP97910817A patent/EP0886547B1/en not_active Expired - Lifetime
- 1997-10-07 AT AT97910817T patent/ATE315965T1/de active
- 1997-10-07 DE DE69735126T patent/DE69735126T2/de not_active Expired - Lifetime
- 1997-10-07 DK DK97910817T patent/DK0886547T3/da active
- 1997-10-11 CN CN97122584A patent/CN1107343C/zh not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
US5989353A (en) | 1999-11-23 |
WO1998016330A1 (en) | 1998-04-23 |
JP2000503342A (ja) | 2000-03-21 |
EP0886547A1 (en) | 1998-12-30 |
KR100305314B1 (ko) | 2001-11-30 |
DE69735126D1 (de) | 2006-04-06 |
CN1107343C (zh) | 2003-04-30 |
TW467954B (en) | 2001-12-11 |
EP0886547A4 (en) | 2002-05-08 |
DE69735126T2 (de) | 2006-08-03 |
ATE315965T1 (de) | 2006-02-15 |
ES2252776T3 (es) | 2006-05-16 |
JP4282093B2 (ja) | 2009-06-17 |
EP0886547B1 (en) | 2006-01-18 |
DK0886547T3 (da) | 2006-05-22 |
CN1187689A (zh) | 1998-07-15 |
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