KR102840340B1 - 반도체 다이의 픽업 장치 및 픽업 방법 - Google Patents

반도체 다이의 픽업 장치 및 픽업 방법

Info

Publication number
KR102840340B1
KR102840340B1 KR1020227022193A KR20227022193A KR102840340B1 KR 102840340 B1 KR102840340 B1 KR 102840340B1 KR 1020227022193 A KR1020227022193 A KR 1020227022193A KR 20227022193 A KR20227022193 A KR 20227022193A KR 102840340 B1 KR102840340 B1 KR 102840340B1
Authority
KR
South Korea
Prior art keywords
stage
wafer sheet
semiconductor die
suction
peripheral portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227022193A
Other languages
English (en)
Korean (ko)
Other versions
KR20220119395A (ko
Inventor
토루 마에다
히로시 오마타
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20220119395A publication Critical patent/KR20220119395A/ko
Application granted granted Critical
Publication of KR102840340B1 publication Critical patent/KR102840340B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L21/67132—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H01L21/67721—
    • H01L21/6836—
    • H01L21/6838—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H01L2221/6839—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1020227022193A 2021-02-17 2021-02-17 반도체 다이의 픽업 장치 및 픽업 방법 Active KR102840340B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/005985 WO2022176076A1 (ja) 2021-02-17 2021-02-17 半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number Publication Date
KR20220119395A KR20220119395A (ko) 2022-08-29
KR102840340B1 true KR102840340B1 (ko) 2025-07-31

Family

ID=82930356

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227022193A Active KR102840340B1 (ko) 2021-02-17 2021-02-17 반도체 다이의 픽업 장치 및 픽업 방법

Country Status (6)

Country Link
US (1) US20230129417A1 (https=)
JP (1) JP7145557B1 (https=)
KR (1) KR102840340B1 (https=)
CN (1) CN115226411B (https=)
TW (1) TWI796950B (https=)
WO (1) WO2022176076A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102761336B1 (ko) * 2021-03-23 2025-02-04 가부시키가이샤 신가와 웨이퍼 시트의 초기 박리 발생 방법 및 반도체 다이의 픽업 장치
US20240170442A1 (en) * 2022-11-18 2024-05-23 Asmpt Singapore Pte. Ltd. Hybrid bonding of a thin semiconductor die

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010177340A (ja) 2009-01-28 2010-08-12 Panasonic Electric Works Co Ltd ダイシング方法およびエキスパンド装置
KR101244482B1 (ko) * 2003-09-17 2013-03-18 가부시키가이샤 르네사스 히가시 니혼 세미콘덕터 반도체 장치의 제조 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62170637U (https=) * 1986-04-17 1987-10-29
JPH02312258A (ja) * 1989-05-26 1990-12-27 Sumitomo Electric Ind Ltd チップ実装装置
JPH04177860A (ja) * 1990-11-13 1992-06-25 Hitachi Ltd ピックアップ装置
JPH06140497A (ja) * 1992-10-27 1994-05-20 Hitachi Ltd ピックアップ装置
JPH1092907A (ja) 1996-09-13 1998-04-10 Nec Corp 半導体チップのピックアップユニット及びそのピックア ップ方法
JP3945632B2 (ja) * 2002-02-06 2007-07-18 シャープ株式会社 チップのピックアップ装置、その製造方法、及び半導体製造装置
JP2010129588A (ja) * 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法
JP5287276B2 (ja) * 2009-01-15 2013-09-11 Ｔｄｋ株式会社 電子部品のピックアップ方法及びピックアップ装置
JP2012059829A (ja) * 2010-09-07 2012-03-22 Elpida Memory Inc 半導体チップの剥離装置、ダイボンディング装置、半導体チップの剥離方法、半導体装置の製造方法
US9079318B2 (en) * 2012-12-20 2015-07-14 Infineon Technologies Ag Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
JP6366223B2 (ja) * 2013-02-25 2018-08-01 東レエンジニアリング株式会社 半導体チップのピックアップ装置
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
SG10201403372SA (en) * 2014-06-18 2016-01-28 Mfg Integration Technology Ltd System and method for peeling a semiconductor chip from a tape using a multistage ejector
JP6653273B2 (ja) * 2017-01-26 2020-02-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
TWI745710B (zh) * 2018-07-06 2021-11-11 日商新川股份有限公司 半導體晶粒的拾取系統

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101244482B1 (ko) * 2003-09-17 2013-03-18 가부시키가이샤 르네사스 히가시 니혼 세미콘덕터 반도체 장치의 제조 방법
JP2010177340A (ja) 2009-01-28 2010-08-12 Panasonic Electric Works Co Ltd ダイシング方法およびエキスパンド装置

Also Published As

Publication number Publication date
US20230129417A1 (en) 2023-04-27
KR20220119395A (ko) 2022-08-29
TW202234567A (zh) 2022-09-01
JPWO2022176076A1 (https=) 2022-08-25
JP7145557B1 (ja) 2022-10-03
WO2022176076A1 (ja) 2022-08-25
TWI796950B (zh) 2023-03-21
CN115226411A (zh) 2022-10-21
CN115226411B (zh) 2025-08-08

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