JP7145557B1 - 半導体ダイのピックアップ装置及びピックアップ方法 - Google Patents

半導体ダイのピックアップ装置及びピックアップ方法 Download PDF

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Publication number
JP7145557B1
JP7145557B1 JP2022519698A JP2022519698A JP7145557B1 JP 7145557 B1 JP7145557 B1 JP 7145557B1 JP 2022519698 A JP2022519698 A JP 2022519698A JP 2022519698 A JP2022519698 A JP 2022519698A JP 7145557 B1 JP7145557 B1 JP 7145557B1
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Prior art keywords
stage
semiconductor die
wafer sheet
peripheral portion
suction
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JP2022519698A
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English (en)
Japanese (ja)
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JPWO2022176076A1 (https=
JPWO2022176076A5 (https=
Inventor
徹 前田
洋 尾又
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Shinkawa Ltd
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Shinkawa Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2022519698A 2021-02-17 2021-02-17 半導体ダイのピックアップ装置及びピックアップ方法 Active JP7145557B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/005985 WO2022176076A1 (ja) 2021-02-17 2021-02-17 半導体ダイのピックアップ装置及びピックアップ方法

Publications (3)

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JPWO2022176076A1 JPWO2022176076A1 (https=) 2022-08-25
JP7145557B1 true JP7145557B1 (ja) 2022-10-03
JPWO2022176076A5 JPWO2022176076A5 (https=) 2023-01-24

Family

ID=82930356

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JP2022519698A Active JP7145557B1 (ja) 2021-02-17 2021-02-17 半導体ダイのピックアップ装置及びピックアップ方法

Country Status (6)

Country Link
US (1) US20230129417A1 (https=)
JP (1) JP7145557B1 (https=)
KR (1) KR102840340B1 (https=)
CN (1) CN115226411B (https=)
TW (1) TWI796950B (https=)
WO (1) WO2022176076A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102761336B1 (ko) * 2021-03-23 2025-02-04 가부시키가이샤 신가와 웨이퍼 시트의 초기 박리 발생 방법 및 반도체 다이의 픽업 장치
US20240170442A1 (en) * 2022-11-18 2024-05-23 Asmpt Singapore Pte. Ltd. Hybrid bonding of a thin semiconductor die

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62170637U (https=) * 1986-04-17 1987-10-29
JPH02312258A (ja) * 1989-05-26 1990-12-27 Sumitomo Electric Ind Ltd チップ実装装置
JPH04177860A (ja) * 1990-11-13 1992-06-25 Hitachi Ltd ピックアップ装置
JP2003234396A (ja) * 2002-02-06 2003-08-22 Sharp Corp チップのピックアップ装置、その製造方法、及び半導体製造装置
JP2010129588A (ja) * 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2010165835A (ja) * 2009-01-15 2010-07-29 Tdk Corp 電子部品のピックアップ方法及びピックアップ装置
JP2012059829A (ja) * 2010-09-07 2012-03-22 Elpida Memory Inc 半導体チップの剥離装置、ダイボンディング装置、半導体チップの剥離方法、半導体装置の製造方法
JP2014165302A (ja) * 2013-02-25 2014-09-08 Toray Eng Co Ltd 半導体チップのピックアップ装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140497A (ja) * 1992-10-27 1994-05-20 Hitachi Ltd ピックアップ装置
JPH1092907A (ja) 1996-09-13 1998-04-10 Nec Corp 半導体チップのピックアップユニット及びそのピックア ップ方法
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5324942B2 (ja) * 2009-01-28 2013-10-23 パナソニック株式会社 ダイシング方法およびエキスパンド装置
US9079318B2 (en) * 2012-12-20 2015-07-14 Infineon Technologies Ag Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
SG10201403372SA (en) * 2014-06-18 2016-01-28 Mfg Integration Technology Ltd System and method for peeling a semiconductor chip from a tape using a multistage ejector
JP6653273B2 (ja) * 2017-01-26 2020-02-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
TWI745710B (zh) * 2018-07-06 2021-11-11 日商新川股份有限公司 半導體晶粒的拾取系統

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62170637U (https=) * 1986-04-17 1987-10-29
JPH02312258A (ja) * 1989-05-26 1990-12-27 Sumitomo Electric Ind Ltd チップ実装装置
JPH04177860A (ja) * 1990-11-13 1992-06-25 Hitachi Ltd ピックアップ装置
JP2003234396A (ja) * 2002-02-06 2003-08-22 Sharp Corp チップのピックアップ装置、その製造方法、及び半導体製造装置
JP2010129588A (ja) * 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2010165835A (ja) * 2009-01-15 2010-07-29 Tdk Corp 電子部品のピックアップ方法及びピックアップ装置
JP2012059829A (ja) * 2010-09-07 2012-03-22 Elpida Memory Inc 半導体チップの剥離装置、ダイボンディング装置、半導体チップの剥離方法、半導体装置の製造方法
JP2014165302A (ja) * 2013-02-25 2014-09-08 Toray Eng Co Ltd 半導体チップのピックアップ装置

Also Published As

Publication number Publication date
KR102840340B1 (ko) 2025-07-31
US20230129417A1 (en) 2023-04-27
KR20220119395A (ko) 2022-08-29
TW202234567A (zh) 2022-09-01
JPWO2022176076A1 (https=) 2022-08-25
WO2022176076A1 (ja) 2022-08-25
TWI796950B (zh) 2023-03-21
CN115226411A (zh) 2022-10-21
CN115226411B (zh) 2025-08-08

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