KR102670101B1 - 열경화성 수지용 활성 에스테르 경화제 화합물, 이를 포함하는 난연제 조성물 및 이로부터 제조된 물품 - Google Patents
열경화성 수지용 활성 에스테르 경화제 화합물, 이를 포함하는 난연제 조성물 및 이로부터 제조된 물품 Download PDFInfo
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- KR102670101B1 KR102670101B1 KR1020187013470A KR20187013470A KR102670101B1 KR 102670101 B1 KR102670101 B1 KR 102670101B1 KR 1020187013470 A KR1020187013470 A KR 1020187013470A KR 20187013470 A KR20187013470 A KR 20187013470A KR 102670101 B1 KR102670101 B1 KR 102670101B1
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- epoxy
- phosphorus
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 27
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- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
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Classifications
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
- C08G59/4276—Polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/68—Polyesters containing atoms other than carbon, hydrogen and oxygen
- C08G63/692—Polyesters containing atoms other than carbon, hydrogen and oxygen containing phosphorus
- C08G63/6924—Polyesters containing atoms other than carbon, hydrogen and oxygen containing phosphorus derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/6926—Dicarboxylic acids and dihydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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- C—CHEMISTRY; METALLURGY
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- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/03—Use of materials for the substrate
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- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
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- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
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| PCT/US2016/059878 WO2017083136A1 (en) | 2015-11-13 | 2016-11-01 | Active ester curing agent compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom |
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| WO2018031103A1 (en) * | 2016-08-11 | 2018-02-15 | Icl-Ip America Inc. | Curable epoxy composition |
| TWI808064B (zh) * | 2016-11-30 | 2023-07-11 | 美商Ｉｃｌ－Ｉｐ美國股份有限公司 | 熱固性樹脂之活性酯硬化劑、含彼之阻燃組成物及由彼製成的物品 |
| KR102340799B1 (ko) * | 2018-09-20 | 2021-12-16 | 주식회사 엘지화학 | 금속 박막 코팅용 열경화성 수지 조성물, 이를 이용한 수지 코팅 금속 박막 및 금속박 적층판 |
| CN109851997B (zh) * | 2018-12-25 | 2020-10-27 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板 |
| US20220153920A1 (en) * | 2019-02-14 | 2022-05-19 | Nissan Chemical Corporation | Method for producing polymer |
| CN109929222B (zh) * | 2019-03-18 | 2021-07-30 | 广东生益科技股份有限公司 | 一种树脂组合物、包含其的预浸料以及层压板和印制电路板 |
| CN110016206B (zh) * | 2019-03-18 | 2020-10-27 | 广东生益科技股份有限公司 | 一种树脂组合物、包含其的预浸料以及层压板和印制电路板 |
| KR102371132B1 (ko) * | 2021-05-13 | 2022-03-11 | 주식회사 신아티앤씨 | 에폭시용 난연성 경화제 조성물 및 이를 포함하는 에폭시용 난연성 경화제 |
| CN120248304A (zh) * | 2025-06-05 | 2025-07-04 | 营口圣泉高科材料有限公司 | 含磷活性酯化合物的制备方法及应用 |
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| JP2004161805A (ja) * | 2002-11-08 | 2004-06-10 | Goo Chemical Co Ltd | 難燃性エポキシ樹脂組成物、並びにそれを含有するプリプレグ、積層板、銅張積層板およびプリント配線板 |
| WO2010114279A2 (en) | 2009-03-31 | 2010-10-07 | Kolon Industries, Inc. | Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition |
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| JPS6155115A (ja) * | 1984-08-27 | 1986-03-19 | Nippon Ester Co Ltd | ポリアリレ−トの製造方法 |
| JPS61118393A (ja) * | 1984-11-15 | 1986-06-05 | Nippon Ester Co Ltd | ホスフイン酸の低級脂肪族ジカルボン酸エステル及びその製造法 |
| JPS61136519A (ja) * | 1984-12-05 | 1986-06-24 | Nippon Ester Co Ltd | ポリアリレ−トの製造方法 |
| JPH0670285B2 (ja) * | 1985-12-04 | 1994-09-07 | 日本エステル株式会社 | 補強用ポリエステル繊維材料 |
| JPH06179756A (ja) * | 1992-12-15 | 1994-06-28 | Nippon Ester Co Ltd | ポリエステル系耐炎性熱硬化フィルム |
| JP3633163B2 (ja) * | 1995-12-27 | 2005-03-30 | 東レ株式会社 | 難燃性樹脂組成物 |
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| JP2003128784A (ja) * | 2001-10-19 | 2003-05-08 | Hitachi Chem Co Ltd | 難燃性熱硬化性樹脂組成物、プリプレグ、絶縁フィルム、積層板、樹脂付き金属箔及び多層配線板とその製造方法 |
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2016
- 2016-10-06 TW TW105132421A patent/TWI721024B/zh active
- 2016-11-01 CN CN201680065750.4A patent/CN108350157B/zh active Active
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- 2016-11-01 EP EP16791799.6A patent/EP3374414B1/en active Active
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| JP2004161805A (ja) * | 2002-11-08 | 2004-06-10 | Goo Chemical Co Ltd | 難燃性エポキシ樹脂組成物、並びにそれを含有するプリプレグ、積層板、銅張積層板およびプリント配線板 |
| WO2010114279A2 (en) | 2009-03-31 | 2010-10-07 | Kolon Industries, Inc. | Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20180326708A1 (en) | 2018-11-15 |
| TWI721024B (zh) | 2021-03-11 |
| TW201728613A (zh) | 2017-08-16 |
| US10500823B2 (en) | 2019-12-10 |
| JP6841839B2 (ja) | 2021-03-10 |
| CN108350157B (zh) | 2020-06-09 |
| EP3374414B1 (en) | 2020-04-22 |
| CN108350157A (zh) | 2018-07-31 |
| KR20180084778A (ko) | 2018-07-25 |
| EP3374414A1 (en) | 2018-09-19 |
| WO2017083136A1 (en) | 2017-05-18 |
| JP2019502011A (ja) | 2019-01-24 |
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