KR102640712B1 - 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 - Google Patents

베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 Download PDF

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KR102640712B1
KR102640712B1 KR1020217024168A KR20217024168A KR102640712B1 KR 102640712 B1 KR102640712 B1 KR 102640712B1 KR 1020217024168 A KR1020217024168 A KR 1020217024168A KR 20217024168 A KR20217024168 A KR 20217024168A KR 102640712 B1 KR102640712 B1 KR 102640712B1
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Prior art keywords
flow path
sheet
liquid
vapor chamber
vapor
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Korean (ko)
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KR20210135220A (ko
Inventor
도시히코 다케다
가즈노리 오다
다카유키 오타
기요타카 다케마츠
신이치로 다카하시
데루토시 모모세
요헤이 즈가네자와
요코 나카무라
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다이니폰 인사츠 가부시키가이샤
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Priority to KR1020247005733A priority Critical patent/KR102763334B1/ko
Publication of KR20210135220A publication Critical patent/KR20210135220A/ko
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H01L23/36—
    • H01L23/427—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Push-Button Switches (AREA)
KR1020217024168A 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 Active KR102640712B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020247005733A KR102763334B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JPJP-P-2019-043928 2019-03-11
JP2019043928 2019-03-11
JP2019045156 2019-03-12
JP2019045167 2019-03-12
JPJP-P-2019-045167 2019-03-12
JPJP-P-2019-045156 2019-03-12
JPJP-P-2019-046510 2019-03-13
JPJP-P-2019-046509 2019-03-13
JP2019046510 2019-03-13
JP2019046509 2019-03-13
JP2019054517 2019-03-22
JPJP-P-2019-054517 2019-03-22
PCT/JP2020/010587 WO2020184620A1 (ja) 2019-03-11 2020-03-11 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート

Related Child Applications (1)

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KR1020247005733A Division KR102763334B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트

Publications (2)

Publication Number Publication Date
KR20210135220A KR20210135220A (ko) 2021-11-12
KR102640712B1 true KR102640712B1 (ko) 2024-02-27

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Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020217024168A Active KR102640712B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트
KR1020247005733A Active KR102763334B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트
KR1020257003234A Pending KR20250020736A (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020247005733A Active KR102763334B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트
KR1020257003234A Pending KR20250020736A (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트

Country Status (6)

Country Link
US (1) US12578150B2 (https=)
JP (4) JP6888751B2 (https=)
KR (3) KR102640712B1 (https=)
CN (2) CN119812143A (https=)
TW (3) TWI897457B (https=)
WO (1) WO2020184620A1 (https=)

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JP7243457B2 (ja) * 2019-05-31 2023-03-22 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート
WO2021045211A1 (ja) * 2019-09-06 2021-03-11 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体
WO2021070544A1 (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
WO2022097417A1 (ja) * 2020-11-04 2022-05-12 株式会社村田製作所 熱拡散デバイス
WO2022168801A1 (ja) * 2021-02-03 2022-08-11 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器
US20240130081A1 (en) * 2021-02-18 2024-04-18 Dai Nippon Printing Co., Ltd. Main body sheet for vapor chamber, vapor chamber, and electronic apparatus
KR20230156088A (ko) * 2021-03-10 2023-11-13 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 베이퍼 챔버용 윅 시트 및 전자 기기
JP2022142665A (ja) * 2021-03-16 2022-09-30 富士通株式会社 冷却装置
CN220853247U (zh) * 2021-03-23 2024-04-26 株式会社村田制作所 热扩散器件以及电子设备
CN116182608A (zh) * 2021-11-26 2023-05-30 华为技术有限公司 具有微细结构层的均温板
CN118401802A (zh) * 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备
KR102698446B1 (ko) * 2022-10-12 2024-09-02 주세현 기체 확산로를 형성하는 다공 필러부를 갖는 베이퍼 챔버
US20240240874A1 (en) * 2023-01-18 2024-07-18 Cisco Technology, Inc. Multiple wick section heatpipe for effective heat transfer
EP4734682A1 (en) * 2023-06-30 2026-04-29 Samsung Electronics Co., Ltd. Heat dissipation structure and electronic device comprising same
CN222263421U (zh) * 2024-03-18 2024-12-27 台达电子工业股份有限公司 均温板

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JP2004028557A (ja) 2002-05-08 2004-01-29 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
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JP2002039693A (ja) 2000-07-21 2002-02-06 Toufuji Denki Kk フラット型ヒートパイプ
JP2004028557A (ja) 2002-05-08 2004-01-29 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
US20180156545A1 (en) 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
JP2018096669A (ja) 2016-12-14 2018-06-21 新光電気工業株式会社 ヒートパイプ及びその製造方法

Also Published As

Publication number Publication date
KR20240028552A (ko) 2024-03-05
CN119812143A (zh) 2025-04-11
JPWO2020184620A1 (ja) 2021-04-30
CN113366631B (zh) 2025-01-14
US20220120509A1 (en) 2022-04-21
JP2021119328A (ja) 2021-08-12
JP7567653B2 (ja) 2024-10-16
KR20210135220A (ko) 2021-11-12
US12578150B2 (en) 2026-03-17
KR102763334B1 (ko) 2025-02-07
JP7700945B2 (ja) 2025-07-01
TW202040085A (zh) 2020-11-01
KR20250020736A (ko) 2025-02-11
TWI897457B (zh) 2025-09-11
TWI846840B (zh) 2024-07-01
WO2020184620A1 (ja) 2020-09-17
JP6888751B2 (ja) 2021-06-16
CN113366631A (zh) 2021-09-07
TW202436821A (zh) 2024-09-16
TW202548193A (zh) 2025-12-16
JP2025129173A (ja) 2025-09-04
JP2024177386A (ja) 2024-12-19

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