CN119812143A - 蒸发室、电子设备以及蒸发室用片 - Google Patents

蒸发室、电子设备以及蒸发室用片 Download PDF

Info

Publication number
CN119812143A
CN119812143A CN202411936865.9A CN202411936865A CN119812143A CN 119812143 A CN119812143 A CN 119812143A CN 202411936865 A CN202411936865 A CN 202411936865A CN 119812143 A CN119812143 A CN 119812143A
Authority
CN
China
Prior art keywords
flow path
sheet
liquid flow
liquid
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202411936865.9A
Other languages
English (en)
Chinese (zh)
Inventor
武田利彦
小田和范
太田贵之
竹松清隆
高桥伸一郎
百濑辉寿
津金泽洋平
中村阳子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of CN119812143A publication Critical patent/CN119812143A/zh
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Push-Button Switches (AREA)
CN202411936865.9A 2019-03-11 2020-03-11 蒸发室、电子设备以及蒸发室用片 Pending CN119812143A (zh)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
JP2019043928 2019-03-11
JP2019-043928 2019-03-11
JP2019-045156 2019-03-12
JP2019-045167 2019-03-12
JP2019045167 2019-03-12
JP2019045156 2019-03-12
JP2019046510 2019-03-13
JP2019-046509 2019-03-13
JP2019-046510 2019-03-13
JP2019046509 2019-03-13
JP2019054517 2019-03-22
JP2019-054517 2019-03-22
PCT/JP2020/010587 WO2020184620A1 (ja) 2019-03-11 2020-03-11 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート
CN202080010217.4A CN113366631B (zh) 2019-03-11 2020-03-11 蒸发室、电子设备以及蒸发室用片

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202080010217.4A Division CN113366631B (zh) 2019-03-11 2020-03-11 蒸发室、电子设备以及蒸发室用片

Publications (1)

Publication Number Publication Date
CN119812143A true CN119812143A (zh) 2025-04-11

Family

ID=72426635

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202411936865.9A Pending CN119812143A (zh) 2019-03-11 2020-03-11 蒸发室、电子设备以及蒸发室用片
CN202080010217.4A Active CN113366631B (zh) 2019-03-11 2020-03-11 蒸发室、电子设备以及蒸发室用片

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202080010217.4A Active CN113366631B (zh) 2019-03-11 2020-03-11 蒸发室、电子设备以及蒸发室用片

Country Status (6)

Country Link
US (1) US12578150B2 (https=)
JP (4) JP6888751B2 (https=)
KR (3) KR102640712B1 (https=)
CN (2) CN119812143A (https=)
TW (3) TWI897457B (https=)
WO (1) WO2020184620A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7243457B2 (ja) * 2019-05-31 2023-03-22 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート
WO2021045211A1 (ja) * 2019-09-06 2021-03-11 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体
WO2021070544A1 (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
WO2022097417A1 (ja) * 2020-11-04 2022-05-12 株式会社村田製作所 熱拡散デバイス
WO2022168801A1 (ja) * 2021-02-03 2022-08-11 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器
US20240130081A1 (en) * 2021-02-18 2024-04-18 Dai Nippon Printing Co., Ltd. Main body sheet for vapor chamber, vapor chamber, and electronic apparatus
KR20230156088A (ko) * 2021-03-10 2023-11-13 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 베이퍼 챔버용 윅 시트 및 전자 기기
JP2022142665A (ja) * 2021-03-16 2022-09-30 富士通株式会社 冷却装置
CN220853247U (zh) * 2021-03-23 2024-04-26 株式会社村田制作所 热扩散器件以及电子设备
CN116182608A (zh) * 2021-11-26 2023-05-30 华为技术有限公司 具有微细结构层的均温板
CN118401802A (zh) * 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备
KR102698446B1 (ko) * 2022-10-12 2024-09-02 주세현 기체 확산로를 형성하는 다공 필러부를 갖는 베이퍼 챔버
US20240240874A1 (en) * 2023-01-18 2024-07-18 Cisco Technology, Inc. Multiple wick section heatpipe for effective heat transfer
EP4734682A1 (en) * 2023-06-30 2026-04-29 Samsung Electronics Co., Ltd. Heat dissipation structure and electronic device comprising same
CN222263421U (zh) * 2024-03-18 2024-12-27 台达电子工业股份有限公司 均温板

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918631B2 (ja) * 1977-02-28 1984-04-28 日本特殊陶業株式会社 セラミックヒ−トパイプの製造方法
JPS5729318Y2 (https=) * 1977-04-19 1982-06-26
JPH11304381A (ja) 1998-04-23 1999-11-05 Fujikura Ltd ヒートパイプ
JP3552553B2 (ja) * 1998-10-08 2004-08-11 日立電線株式会社 平面状ヒートパイプ及びその製造方法
JP2002039693A (ja) 2000-07-21 2002-02-06 Toufuji Denki Kk フラット型ヒートパイプ
WO2002058879A1 (en) * 2001-01-25 2002-08-01 Toyo Kohan Co., Ltd. Plate stacked body, hollow stacked body using plate stacked body, and plate heat pipe using hollow stacked body
CN1192202C (zh) * 2001-09-06 2005-03-09 李嘉豪 平板式环路型热管(一)
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
JP4823994B2 (ja) * 2002-05-08 2011-11-24 古河電気工業株式会社 薄型シート状ヒートパイプ
JP4057455B2 (ja) 2002-05-08 2008-03-05 古河電気工業株式会社 薄型シート状ヒートパイプ
JP4305068B2 (ja) * 2003-06-19 2009-07-29 富士電機ホールディングス株式会社 偏平型ヒートパイプ
US7002247B2 (en) * 2004-06-18 2006-02-21 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
JP2007113864A (ja) * 2005-10-21 2007-05-10 Sony Corp 熱輸送装置及び電子機器
JP4874664B2 (ja) 2006-02-08 2012-02-15 株式会社フジクラ ヒートパイプ
US20210310745A1 (en) * 2006-07-28 2021-10-07 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
JP4683080B2 (ja) * 2008-07-10 2011-05-11 ソニー株式会社 熱輸送デバイス、電子機器、封入装置及び熱輸送デバイスの製造方法
JP5449801B2 (ja) * 2008-09-04 2014-03-19 日本モレックス株式会社 熱輸送ユニットおよび電子機器
TWI459889B (zh) * 2008-09-18 2014-11-01 Pegatron Corp 均溫板
JP5413735B2 (ja) * 2010-01-18 2014-02-12 日本モレックス株式会社 熱輸送ユニット、電子機器
CN201726639U (zh) * 2010-06-29 2011-01-26 昆山巨仲电子有限公司 热板结构
CN102095323A (zh) * 2010-11-04 2011-06-15 华中科技大学 一种平板均热板
JP5180385B1 (ja) * 2012-03-08 2013-04-10 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
JP2014142143A (ja) * 2013-01-24 2014-08-07 Ntec Co Ltd ヒートパイプ
JP6121854B2 (ja) * 2013-09-18 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプまたは携帯情報端末
JP6509680B2 (ja) * 2015-08-24 2019-05-08 東芝ホームテクノ株式会社 シート状ヒートパイプ
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
JP6799503B2 (ja) * 2016-12-14 2020-12-16 新光電気工業株式会社 ヒートパイプ及びその製造方法
TWI736745B (zh) * 2017-02-24 2021-08-21 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法
JP7123527B2 (ja) * 2017-04-11 2022-08-23 大日本印刷株式会社 ベーパーチャンバおよびベーパーチャンバ用金属シート
US10820454B2 (en) * 2018-01-31 2020-10-27 Toyota Motor Engineering & Manufacturing North America, Inc. Vapor chamber heat spreaders with engineered vapor and liquid flow paths
WO2019230911A1 (ja) 2018-05-30 2019-12-05 大日本印刷株式会社 ベーパーチャンバー、及び電子機器

Also Published As

Publication number Publication date
KR20240028552A (ko) 2024-03-05
JPWO2020184620A1 (ja) 2021-04-30
CN113366631B (zh) 2025-01-14
US20220120509A1 (en) 2022-04-21
JP2021119328A (ja) 2021-08-12
JP7567653B2 (ja) 2024-10-16
KR20210135220A (ko) 2021-11-12
US12578150B2 (en) 2026-03-17
KR102763334B1 (ko) 2025-02-07
JP7700945B2 (ja) 2025-07-01
TW202040085A (zh) 2020-11-01
KR20250020736A (ko) 2025-02-11
KR102640712B1 (ko) 2024-02-27
TWI897457B (zh) 2025-09-11
TWI846840B (zh) 2024-07-01
WO2020184620A1 (ja) 2020-09-17
JP6888751B2 (ja) 2021-06-16
CN113366631A (zh) 2021-09-07
TW202436821A (zh) 2024-09-16
TW202548193A (zh) 2025-12-16
JP2025129173A (ja) 2025-09-04
JP2024177386A (ja) 2024-12-19

Similar Documents

Publication Publication Date Title
CN113366631B (zh) 蒸发室、电子设备以及蒸发室用片
JP7788093B2 (ja) ベーパーチャンバおよび電子機器
CN112902717B (zh) 蒸发室用片、蒸发室和电子设备
CN114341586B (zh) 蒸发室、电子设备、蒸发室用片、布置有多个蒸发室用中间体的片、卷绕布置有多个蒸发室用中间体的片而成的卷、以及蒸发室用中间体
WO2019088301A1 (ja) ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバ用シート及びベーパーチャンバの製造方法
JP2019132574A (ja) ベーパーチャンバ、電子機器、及びベーパーチャンバ用シート
JP2021042952A (ja) ベーパーチャンバ用の中間体が多面付けされたシートの製造方法、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロールの製造方法、ベーパーチャンバ用の中間体の製造方法、及び、ベーパーチャンバの製造方法
JP2021188799A (ja) ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination