TWI897457B - 蒸氣腔、電子機器及蒸氣腔用片材 - Google Patents

蒸氣腔、電子機器及蒸氣腔用片材

Info

Publication number
TWI897457B
TWI897457B TW113120596A TW113120596A TWI897457B TW I897457 B TWI897457 B TW I897457B TW 113120596 A TW113120596 A TW 113120596A TW 113120596 A TW113120596 A TW 113120596A TW I897457 B TWI897457 B TW I897457B
Authority
TW
Taiwan
Prior art keywords
flow path
sheet
liquid flow
steam chamber
flow
Prior art date
Application number
TW113120596A
Other languages
English (en)
Chinese (zh)
Other versions
TW202436821A (zh
Inventor
武田利彦
小田和範
太田貴之
竹松清隆
高橋伸一郎
百瀬輝寿
津金澤洋平
中村陽子
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202436821A publication Critical patent/TW202436821A/zh
Application granted granted Critical
Publication of TWI897457B publication Critical patent/TWI897457B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Push-Button Switches (AREA)
TW113120596A 2019-03-11 2020-03-11 蒸氣腔、電子機器及蒸氣腔用片材 TWI897457B (zh)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2019-043928 2019-03-11
JP2019043928 2019-03-11
JP2019-045167 2019-03-12
JP2019-045156 2019-03-12
JP2019045156 2019-03-12
JP2019045167 2019-03-12
JP2019-046509 2019-03-13
JP2019046510 2019-03-13
JP2019-046510 2019-03-13
JP2019046509 2019-03-13
JP2019-054517 2019-03-22
JP2019054517 2019-03-22

Publications (2)

Publication Number Publication Date
TW202436821A TW202436821A (zh) 2024-09-16
TWI897457B true TWI897457B (zh) 2025-09-11

Family

ID=72426635

Family Applications (3)

Application Number Title Priority Date Filing Date
TW113120596A TWI897457B (zh) 2019-03-11 2020-03-11 蒸氣腔、電子機器及蒸氣腔用片材
TW114133160A TW202548193A (zh) 2019-03-11 2020-03-11 蒸氣腔、電子機器及蒸氣腔用之片材
TW109107938A TWI846840B (zh) 2019-03-11 2020-03-11 蒸氣腔、電子機器及蒸氣腔用片材

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW114133160A TW202548193A (zh) 2019-03-11 2020-03-11 蒸氣腔、電子機器及蒸氣腔用之片材
TW109107938A TWI846840B (zh) 2019-03-11 2020-03-11 蒸氣腔、電子機器及蒸氣腔用片材

Country Status (6)

Country Link
US (1) US12578150B2 (https=)
JP (4) JP6888751B2 (https=)
KR (3) KR102640712B1 (https=)
CN (2) CN119812143A (https=)
TW (3) TWI897457B (https=)
WO (1) WO2020184620A1 (https=)

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JP7243457B2 (ja) * 2019-05-31 2023-03-22 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート
WO2021045211A1 (ja) * 2019-09-06 2021-03-11 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体
WO2021070544A1 (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
WO2022097417A1 (ja) * 2020-11-04 2022-05-12 株式会社村田製作所 熱拡散デバイス
WO2022168801A1 (ja) * 2021-02-03 2022-08-11 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器
US20240130081A1 (en) * 2021-02-18 2024-04-18 Dai Nippon Printing Co., Ltd. Main body sheet for vapor chamber, vapor chamber, and electronic apparatus
KR20230156088A (ko) * 2021-03-10 2023-11-13 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 베이퍼 챔버용 윅 시트 및 전자 기기
JP2022142665A (ja) * 2021-03-16 2022-09-30 富士通株式会社 冷却装置
CN220853247U (zh) * 2021-03-23 2024-04-26 株式会社村田制作所 热扩散器件以及电子设备
CN116182608A (zh) * 2021-11-26 2023-05-30 华为技术有限公司 具有微细结构层的均温板
CN118401802A (zh) * 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备
KR102698446B1 (ko) * 2022-10-12 2024-09-02 주세현 기체 확산로를 형성하는 다공 필러부를 갖는 베이퍼 챔버
US20240240874A1 (en) * 2023-01-18 2024-07-18 Cisco Technology, Inc. Multiple wick section heatpipe for effective heat transfer
EP4734682A1 (en) * 2023-06-30 2026-04-29 Samsung Electronics Co., Ltd. Heat dissipation structure and electronic device comprising same
CN222263421U (zh) * 2024-03-18 2024-12-27 台达电子工业股份有限公司 均温板

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JP2004028557A (ja) * 2002-05-08 2004-01-29 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
CN1192202C (zh) * 2001-09-06 2005-03-09 李嘉豪 平板式环路型热管(一)
TW201014512A (en) * 2008-09-18 2010-04-01 Pegarton Corportation Vapor chamber
TWI409424B (zh) * 2006-07-28 2013-09-21 Fuchigami Micro Co Heat pipe and its manufacturing method

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CN1192202C (zh) * 2001-09-06 2005-03-09 李嘉豪 平板式环路型热管(一)
JP2004028557A (ja) * 2002-05-08 2004-01-29 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
TWI409424B (zh) * 2006-07-28 2013-09-21 Fuchigami Micro Co Heat pipe and its manufacturing method
TW201014512A (en) * 2008-09-18 2010-04-01 Pegarton Corportation Vapor chamber

Also Published As

Publication number Publication date
KR20240028552A (ko) 2024-03-05
CN119812143A (zh) 2025-04-11
JPWO2020184620A1 (ja) 2021-04-30
CN113366631B (zh) 2025-01-14
US20220120509A1 (en) 2022-04-21
JP2021119328A (ja) 2021-08-12
JP7567653B2 (ja) 2024-10-16
KR20210135220A (ko) 2021-11-12
US12578150B2 (en) 2026-03-17
KR102763334B1 (ko) 2025-02-07
JP7700945B2 (ja) 2025-07-01
TW202040085A (zh) 2020-11-01
KR20250020736A (ko) 2025-02-11
KR102640712B1 (ko) 2024-02-27
TWI846840B (zh) 2024-07-01
WO2020184620A1 (ja) 2020-09-17
JP6888751B2 (ja) 2021-06-16
CN113366631A (zh) 2021-09-07
TW202436821A (zh) 2024-09-16
TW202548193A (zh) 2025-12-16
JP2025129173A (ja) 2025-09-04
JP2024177386A (ja) 2024-12-19

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