KR20250020736A - 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 - Google Patents

베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 Download PDF

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Publication number
KR20250020736A
KR20250020736A KR1020257003234A KR20257003234A KR20250020736A KR 20250020736 A KR20250020736 A KR 20250020736A KR 1020257003234 A KR1020257003234 A KR 1020257003234A KR 20257003234 A KR20257003234 A KR 20257003234A KR 20250020736 A KR20250020736 A KR 20250020736A
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KR
South Korea
Prior art keywords
sheet
flow path
groove
vapor chamber
liquid flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257003234A
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English (en)
Korean (ko)
Inventor
도시히코 다케다
가즈노리 오다
다카유키 오타
기요타카 다케마츠
신이치로 다카하시
데루토시 모모세
요헤이 즈가네자와
요코 나카무라
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20250020736A publication Critical patent/KR20250020736A/ko
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H01L23/36—
    • H01L23/427—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Push-Button Switches (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
KR1020257003234A 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 Pending KR20250020736A (ko)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
JP2019043928 2019-03-11
JPJP-P-2019-043928 2019-03-11
JP2019045156 2019-03-12
JPJP-P-2019-045156 2019-03-12
JPJP-P-2019-045167 2019-03-12
JP2019045167 2019-03-12
JP2019046509 2019-03-13
JP2019046510 2019-03-13
JPJP-P-2019-046509 2019-03-13
JPJP-P-2019-046510 2019-03-13
JP2019054517 2019-03-22
JPJP-P-2019-054517 2019-03-22
PCT/JP2020/010587 WO2020184620A1 (ja) 2019-03-11 2020-03-11 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート
KR1020247005733A KR102763334B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020247005733A Division KR102763334B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트

Publications (1)

Publication Number Publication Date
KR20250020736A true KR20250020736A (ko) 2025-02-11

Family

ID=72426635

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020257003234A Pending KR20250020736A (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트
KR1020217024168A Active KR102640712B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트
KR1020247005733A Active KR102763334B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020217024168A Active KR102640712B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트
KR1020247005733A Active KR102763334B1 (ko) 2019-03-11 2020-03-11 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트

Country Status (6)

Country Link
US (1) US12578150B2 (https=)
JP (4) JP6888751B2 (https=)
KR (3) KR20250020736A (https=)
CN (2) CN119812143A (https=)
TW (3) TWI897457B (https=)
WO (1) WO2020184620A1 (https=)

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JP7243457B2 (ja) * 2019-05-31 2023-03-22 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート
US12520457B2 (en) * 2019-09-06 2026-01-06 Dai Nippon Printing Co., Ltd. Vapor chamber having condensate flow paths and vapor flow paths with varying cross-sectional areas in linear parts and a curved part, electronic device, and sheet for such vapor chamber
WO2021070544A1 (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
WO2022097417A1 (ja) * 2020-11-04 2022-05-12 株式会社村田製作所 熱拡散デバイス
JP7769918B2 (ja) * 2021-02-03 2025-11-14 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器
WO2022176985A1 (ja) * 2021-02-18 2022-08-25 大日本印刷株式会社 ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器
WO2022191240A1 (ja) * 2021-03-10 2022-09-15 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器
JP2022142665A (ja) * 2021-03-16 2022-09-30 富士通株式会社 冷却装置
JP7352220B2 (ja) * 2021-03-23 2023-09-28 株式会社村田製作所 熱拡散デバイスおよび電子機器
CN116182608A (zh) * 2021-11-26 2023-05-30 华为技术有限公司 具有微细结构层的均温板
CN118401802A (zh) * 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备
KR102698446B1 (ko) * 2022-10-12 2024-09-02 주세현 기체 확산로를 형성하는 다공 필러부를 갖는 베이퍼 챔버
US20240240874A1 (en) * 2023-01-18 2024-07-18 Cisco Technology, Inc. Multiple wick section heatpipe for effective heat transfer
EP4734682A1 (en) * 2023-06-30 2026-04-29 Samsung Electronics Co., Ltd. Heat dissipation structure and electronic device comprising same
CN222263421U (zh) * 2024-03-18 2024-12-27 台达电子工业股份有限公司 均温板

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JP2007212028A (ja) 2006-02-08 2007-08-23 Fujikura Ltd ヒートパイプ

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Also Published As

Publication number Publication date
TWI846840B (zh) 2024-07-01
KR102640712B1 (ko) 2024-02-27
KR102763334B1 (ko) 2025-02-07
CN113366631B (zh) 2025-01-14
JP2025129173A (ja) 2025-09-04
JP7567653B2 (ja) 2024-10-16
TW202436821A (zh) 2024-09-16
CN113366631A (zh) 2021-09-07
JPWO2020184620A1 (ja) 2021-04-30
KR20210135220A (ko) 2021-11-12
WO2020184620A1 (ja) 2020-09-17
TW202548193A (zh) 2025-12-16
JP2021119328A (ja) 2021-08-12
US12578150B2 (en) 2026-03-17
TWI897457B (zh) 2025-09-11
KR20240028552A (ko) 2024-03-05
CN119812143A (zh) 2025-04-11
TW202040085A (zh) 2020-11-01
JP6888751B2 (ja) 2021-06-16
JP7700945B2 (ja) 2025-07-01
JP2024177386A (ja) 2024-12-19
US20220120509A1 (en) 2022-04-21

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