KR102635786B1 - 액체 공급 유닛 - Google Patents
액체 공급 유닛 Download PDFInfo
- Publication number
- KR102635786B1 KR102635786B1 KR1020180139888A KR20180139888A KR102635786B1 KR 102635786 B1 KR102635786 B1 KR 102635786B1 KR 1020180139888 A KR1020180139888 A KR 1020180139888A KR 20180139888 A KR20180139888 A KR 20180139888A KR 102635786 B1 KR102635786 B1 KR 102635786B1
- Authority
- KR
- South Korea
- Prior art keywords
- chamber
- liquid
- nozzle
- pump
- sphere
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 101
- 230000001681 protective effect Effects 0.000 description 19
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K15/00—Check valves
- F16K15/02—Check valves with guided rigid valve members
- F16K15/04—Check valves with guided rigid valve members shaped as balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/02—Construction of housing; Use of materials therefor of lift valves
- F16K27/0209—Check valves or pivoted valves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Dicing (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Developers In Electrophotography (AREA)
- Fluid-Pressure Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017220728A JP7021913B2 (ja) | 2017-11-16 | 2017-11-16 | 液体供給ユニット |
JPJP-P-2017-220728 | 2017-11-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190056315A KR20190056315A (ko) | 2019-05-24 |
KR102635786B1 true KR102635786B1 (ko) | 2024-02-08 |
Family
ID=66556249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180139888A KR102635786B1 (ko) | 2017-11-16 | 2018-11-14 | 액체 공급 유닛 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7021913B2 (zh) |
KR (1) | KR102635786B1 (zh) |
CN (1) | CN109794399A (zh) |
TW (1) | TWI780260B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101752640B1 (ko) * | 2009-03-27 | 2017-06-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
KR102217939B1 (ko) * | 2019-07-03 | 2021-02-22 | 세메스 주식회사 | 유체 제어 장치 및 이를 포함하는 기판 처리 시스템 |
CN111550583A (zh) * | 2020-04-13 | 2020-08-18 | 宁波润华全芯微电子设备有限公司 | 一种匀胶显影设备使用的高精度胶泵 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005322711A (ja) * | 2004-05-07 | 2005-11-17 | Toray Ind Inc | 感光性ポリイミド溶液塗布装置 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62279864A (ja) * | 1986-05-27 | 1987-12-04 | Japan Electronic Control Syst Co Ltd | 接着剤の塗布装置 |
ES2016844B3 (es) * | 1986-06-02 | 1990-12-01 | Technicon Instr Corporation(A Delaware Corporation) | Sistema y metodo de distribucion de cantidades medidas de un fluido. |
US5119989A (en) * | 1991-02-15 | 1992-06-09 | Lubriquip, Inc. | Dripless spray nozzle |
US5305916A (en) * | 1991-12-09 | 1994-04-26 | Kabushiki Kaisha San-Ai | Drip free, volume-adjustable, automatic liquid dispenser |
JP2974488B2 (ja) * | 1992-03-04 | 1999-11-10 | 沖電気工業株式会社 | レジスト塗布装置 |
JP3137850B2 (ja) * | 1994-11-11 | 2001-02-26 | キッコーマン株式会社 | 液垂れ防止逆止弁およびそれを用いた注出容器 |
JPH08196949A (ja) * | 1995-01-27 | 1996-08-06 | Iwata Air Compressor Mfg Co Ltd | 超微量液体吐出装置 |
KR100311593B1 (ko) * | 1995-01-27 | 2002-12-05 | 가부시키가이샤 요시노 고교쇼 | 액체분출펌프 |
JP3329720B2 (ja) * | 1998-01-19 | 2002-09-30 | 東京エレクトロン株式会社 | 塗布装置 |
JP2002045736A (ja) | 2000-08-04 | 2002-02-12 | Mitani Valve Co Ltd | 噴出ポンプ |
JP2004136397A (ja) * | 2002-10-17 | 2004-05-13 | Disco Abrasive Syst Ltd | ウォータージェット加工装置 |
CN2605441Y (zh) * | 2003-03-18 | 2004-03-03 | 施占仁 | 焊接高温高压球式止回阀 |
CN2606226Y (zh) * | 2003-03-18 | 2004-03-10 | 施占仁 | 法兰连接球式止回阀 |
CN2622503Y (zh) * | 2003-06-18 | 2004-06-30 | 施占仁 | 螺纹连接球式止回阀 |
CN2670707Y (zh) * | 2003-08-21 | 2005-01-12 | 包波 | 套管气回收单流阀 |
CN201053525Y (zh) * | 2007-03-29 | 2008-04-30 | 柳州柳二空机械股份有限公司 | 单向节流阀 |
JP5038378B2 (ja) * | 2009-11-11 | 2012-10-03 | 株式会社コガネイ | 薬液供給装置および薬液供給方法 |
CN101885454A (zh) * | 2010-06-29 | 2010-11-17 | 常熟通润汽车零部件股份有限公司 | 组合防回跳单向阀的液压千斤顶 |
CN202109033U (zh) * | 2011-06-03 | 2012-01-11 | 浙江万向精工有限公司 | 单向阀 |
CN203067865U (zh) * | 2012-12-24 | 2013-07-17 | 徐卫星 | 液压井水抽取装置及液压千斤顶用控制阀 |
CN203115197U (zh) * | 2013-01-11 | 2013-08-07 | 华晶精密制造有限公司 | 一种金刚石切割线生产设备的单向阀机构 |
CN203549013U (zh) * | 2013-11-26 | 2014-04-16 | 苏州大学 | 防倒灌单向阀 |
JP6173192B2 (ja) | 2013-12-03 | 2017-08-02 | 株式会社ディスコ | 液体噴射装置 |
US9799539B2 (en) * | 2014-06-16 | 2017-10-24 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
CN105135006B (zh) * | 2015-08-21 | 2018-05-15 | 杭州水利水电勘测设计院有限公司 | 小型泵站截流新装置 |
CN205036914U (zh) * | 2015-08-31 | 2016-02-17 | 常州博之园智能装备有限公司 | 新型单向阀 |
CN105236769B (zh) * | 2015-09-24 | 2017-10-17 | 湖北凯乐光电有限公司 | 光纤生产涂覆中央集中供料系统 |
-
2017
- 2017-11-16 JP JP2017220728A patent/JP7021913B2/ja active Active
-
2018
- 2018-11-09 CN CN201811330713.9A patent/CN109794399A/zh active Pending
- 2018-11-14 KR KR1020180139888A patent/KR102635786B1/ko active IP Right Grant
- 2018-11-15 TW TW107140503A patent/TWI780260B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005322711A (ja) * | 2004-05-07 | 2005-11-17 | Toray Ind Inc | 感光性ポリイミド溶液塗布装置 |
Also Published As
Publication number | Publication date |
---|---|
CN109794399A (zh) | 2019-05-24 |
KR20190056315A (ko) | 2019-05-24 |
TWI780260B (zh) | 2022-10-11 |
JP7021913B2 (ja) | 2022-02-17 |
JP2019091837A (ja) | 2019-06-13 |
TW201922358A (zh) | 2019-06-16 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |