KR102635786B1 - 액체 공급 유닛 - Google Patents

액체 공급 유닛 Download PDF

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Publication number
KR102635786B1
KR102635786B1 KR1020180139888A KR20180139888A KR102635786B1 KR 102635786 B1 KR102635786 B1 KR 102635786B1 KR 1020180139888 A KR1020180139888 A KR 1020180139888A KR 20180139888 A KR20180139888 A KR 20180139888A KR 102635786 B1 KR102635786 B1 KR 102635786B1
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KR
South Korea
Prior art keywords
chamber
liquid
nozzle
pump
sphere
Prior art date
Application number
KR1020180139888A
Other languages
English (en)
Korean (ko)
Other versions
KR20190056315A (ko
Inventor
도모아키 엔도
히로토 요시다
유키야스 마스다
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190056315A publication Critical patent/KR20190056315A/ko
Application granted granted Critical
Publication of KR102635786B1 publication Critical patent/KR102635786B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K15/00—Check valves
    • F16K15/02—Check valves with guided rigid valve members
    • F16K15/04—Check valves with guided rigid valve members shaped as balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/02—Construction of housing; Use of materials therefor of lift valves
    • F16K27/0209—Check valves or pivoted valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Developers In Electrophotography (AREA)
  • Fluid-Pressure Circuits (AREA)
KR1020180139888A 2017-11-16 2018-11-14 액체 공급 유닛 KR102635786B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017220728A JP7021913B2 (ja) 2017-11-16 2017-11-16 液体供給ユニット
JPJP-P-2017-220728 2017-11-16

Publications (2)

Publication Number Publication Date
KR20190056315A KR20190056315A (ko) 2019-05-24
KR102635786B1 true KR102635786B1 (ko) 2024-02-08

Family

ID=66556249

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180139888A KR102635786B1 (ko) 2017-11-16 2018-11-14 액체 공급 유닛

Country Status (4)

Country Link
JP (1) JP7021913B2 (ja)
KR (1) KR102635786B1 (ja)
CN (1) CN109794399A (ja)
TW (1) TWI780260B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101752640B1 (ko) * 2009-03-27 2017-06-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
KR102217939B1 (ko) * 2019-07-03 2021-02-22 세메스 주식회사 유체 제어 장치 및 이를 포함하는 기판 처리 시스템
CN111550583A (zh) * 2020-04-13 2020-08-18 宁波润华全芯微电子设备有限公司 一种匀胶显影设备使用的高精度胶泵

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322711A (ja) * 2004-05-07 2005-11-17 Toray Ind Inc 感光性ポリイミド溶液塗布装置

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JPS62279864A (ja) * 1986-05-27 1987-12-04 Japan Electronic Control Syst Co Ltd 接着剤の塗布装置
ES2016844B3 (es) * 1986-06-02 1990-12-01 Technicon Instr Corporation(A Delaware Corporation) Sistema y metodo de distribucion de cantidades medidas de un fluido.
US5119989A (en) * 1991-02-15 1992-06-09 Lubriquip, Inc. Dripless spray nozzle
US5305916A (en) * 1991-12-09 1994-04-26 Kabushiki Kaisha San-Ai Drip free, volume-adjustable, automatic liquid dispenser
JP2974488B2 (ja) * 1992-03-04 1999-11-10 沖電気工業株式会社 レジスト塗布装置
JP3137850B2 (ja) * 1994-11-11 2001-02-26 キッコーマン株式会社 液垂れ防止逆止弁およびそれを用いた注出容器
JPH08196949A (ja) * 1995-01-27 1996-08-06 Iwata Air Compressor Mfg Co Ltd 超微量液体吐出装置
KR100311593B1 (ko) * 1995-01-27 2002-12-05 가부시키가이샤 요시노 고교쇼 액체분출펌프
JP3329720B2 (ja) * 1998-01-19 2002-09-30 東京エレクトロン株式会社 塗布装置
JP2002045736A (ja) 2000-08-04 2002-02-12 Mitani Valve Co Ltd 噴出ポンプ
JP2004136397A (ja) * 2002-10-17 2004-05-13 Disco Abrasive Syst Ltd ウォータージェット加工装置
CN2605441Y (zh) * 2003-03-18 2004-03-03 施占仁 焊接高温高压球式止回阀
CN2606226Y (zh) * 2003-03-18 2004-03-10 施占仁 法兰连接球式止回阀
CN2622503Y (zh) * 2003-06-18 2004-06-30 施占仁 螺纹连接球式止回阀
CN2670707Y (zh) * 2003-08-21 2005-01-12 包波 套管气回收单流阀
CN201053525Y (zh) * 2007-03-29 2008-04-30 柳州柳二空机械股份有限公司 单向节流阀
JP5038378B2 (ja) * 2009-11-11 2012-10-03 株式会社コガネイ 薬液供給装置および薬液供給方法
CN101885454A (zh) * 2010-06-29 2010-11-17 常熟通润汽车零部件股份有限公司 组合防回跳单向阀的液压千斤顶
CN202109033U (zh) * 2011-06-03 2012-01-11 浙江万向精工有限公司 单向阀
CN203067865U (zh) * 2012-12-24 2013-07-17 徐卫星 液压井水抽取装置及液压千斤顶用控制阀
CN203115197U (zh) * 2013-01-11 2013-08-07 华晶精密制造有限公司 一种金刚石切割线生产设备的单向阀机构
CN203549013U (zh) * 2013-11-26 2014-04-16 苏州大学 防倒灌单向阀
JP6173192B2 (ja) 2013-12-03 2017-08-02 株式会社ディスコ 液体噴射装置
US9799539B2 (en) * 2014-06-16 2017-10-24 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
CN105135006B (zh) * 2015-08-21 2018-05-15 杭州水利水电勘测设计院有限公司 小型泵站截流新装置
CN205036914U (zh) * 2015-08-31 2016-02-17 常州博之园智能装备有限公司 新型单向阀
CN105236769B (zh) * 2015-09-24 2017-10-17 湖北凯乐光电有限公司 光纤生产涂覆中央集中供料系统

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322711A (ja) * 2004-05-07 2005-11-17 Toray Ind Inc 感光性ポリイミド溶液塗布装置

Also Published As

Publication number Publication date
CN109794399A (zh) 2019-05-24
KR20190056315A (ko) 2019-05-24
TWI780260B (zh) 2022-10-11
JP7021913B2 (ja) 2022-02-17
JP2019091837A (ja) 2019-06-13
TW201922358A (zh) 2019-06-16

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