KR102582193B1 - 가공 장치 - Google Patents

가공 장치 Download PDF

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Publication number
KR102582193B1
KR102582193B1 KR1020180135794A KR20180135794A KR102582193B1 KR 102582193 B1 KR102582193 B1 KR 102582193B1 KR 1020180135794 A KR1020180135794 A KR 1020180135794A KR 20180135794 A KR20180135794 A KR 20180135794A KR 102582193 B1 KR102582193 B1 KR 102582193B1
Authority
KR
South Korea
Prior art keywords
upper plate
processing
plate
processing chamber
hinge
Prior art date
Application number
KR1020180135794A
Other languages
English (en)
Korean (ko)
Other versions
KR20190058296A (ko
Inventor
데츠오 구보
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190058296A publication Critical patent/KR20190058296A/ko
Application granted granted Critical
Publication of KR102582193B1 publication Critical patent/KR102582193B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020180135794A 2017-11-20 2018-11-07 가공 장치 KR102582193B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017222548A JP7049813B2 (ja) 2017-11-20 2017-11-20 加工装置
JPJP-P-2017-222548 2017-11-20

Publications (2)

Publication Number Publication Date
KR20190058296A KR20190058296A (ko) 2019-05-29
KR102582193B1 true KR102582193B1 (ko) 2023-09-22

Family

ID=66672627

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180135794A KR102582193B1 (ko) 2017-11-20 2018-11-07 가공 장치

Country Status (4)

Country Link
JP (1) JP7049813B2 (ja)
KR (1) KR102582193B1 (ja)
CN (1) CN109822413B (ja)
TW (1) TWI798289B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7304742B2 (ja) * 2019-06-06 2023-07-07 東京エレクトロン株式会社 基板加工装置
JP7507598B2 (ja) 2020-05-08 2024-06-28 株式会社ディスコ 加工装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014065102A (ja) * 2012-09-25 2014-04-17 Disco Abrasive Syst Ltd 加工装置
WO2014118939A1 (ja) * 2013-01-31 2014-08-07 富士機械製造株式会社 対回路基板作業機の開閉式カバー装置
JP2015093336A (ja) 2013-11-11 2015-05-18 株式会社ディスコ 切削装置
JP2017159379A (ja) 2016-03-07 2017-09-14 株式会社ディスコ 開閉扉を有する装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705187A (en) * 1987-01-16 1987-11-10 Boston Digital Corporation Enclosure for a machine tool
JPH07116940A (ja) * 1993-08-31 1995-05-09 Nippei Toyama Corp トランスファマシンにおけるカバー装置
JP2005246526A (ja) 2004-03-03 2005-09-15 Brother Ind Ltd 工作機械の扉装置
CN100590251C (zh) * 2005-05-24 2010-02-17 海尔集团公司 具有滑槽折叠门的洗衣机及滑槽折叠门
CN201057869Y (zh) * 2007-07-30 2008-05-14 梁海标 学生用书桌
CN201775272U (zh) * 2010-09-03 2011-03-30 陈爱娟 一种可折叠稳定书立
JP5148722B2 (ja) 2011-02-28 2013-02-20 株式会社東芝 電子機器及びカバー
CN202305345U (zh) * 2011-10-25 2012-07-04 深圳亚大塑料制品有限公司 极端环境pe管测试箱
CN202476949U (zh) * 2011-12-26 2012-10-10 劳可敬 折叠书立
CN203748891U (zh) * 2014-04-02 2014-08-06 李炳吉 一种床上学习专用笔记本电脑桌
CN203776480U (zh) 2014-04-02 2014-08-20 陕西科技大学 一种具有收纳功能的床
CN203840025U (zh) * 2014-05-07 2014-09-17 常州朗升电器有限公司 一种带手机支撑架且具备led照明功能的移动电源
JP2015167043A (ja) 2015-06-11 2015-09-24 株式会社 カンパーニュ 平板状端末機用スタンド兼用カバー

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014065102A (ja) * 2012-09-25 2014-04-17 Disco Abrasive Syst Ltd 加工装置
WO2014118939A1 (ja) * 2013-01-31 2014-08-07 富士機械製造株式会社 対回路基板作業機の開閉式カバー装置
JP2015093336A (ja) 2013-11-11 2015-05-18 株式会社ディスコ 切削装置
JP2017159379A (ja) 2016-03-07 2017-09-14 株式会社ディスコ 開閉扉を有する装置

Also Published As

Publication number Publication date
JP7049813B2 (ja) 2022-04-07
CN109822413B (zh) 2022-06-03
CN109822413A (zh) 2019-05-31
KR20190058296A (ko) 2019-05-29
TWI798289B (zh) 2023-04-11
JP2019093458A (ja) 2019-06-20
TW201923885A (zh) 2019-06-16

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