KR102502965B1 - 테스트 헤드용 접촉 프로브 - Google Patents

테스트 헤드용 접촉 프로브 Download PDF

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Publication number
KR102502965B1
KR102502965B1 KR1020177021268A KR20177021268A KR102502965B1 KR 102502965 B1 KR102502965 B1 KR 102502965B1 KR 1020177021268 A KR1020177021268 A KR 1020177021268A KR 20177021268 A KR20177021268 A KR 20177021268A KR 102502965 B1 KR102502965 B1 KR 102502965B1
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KR
South Korea
Prior art keywords
coating layer
contact
core
layer
inner coating
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KR1020177021268A
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English (en)
Korean (ko)
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KR20170107465A (ko
Inventor
줴세페 크리파
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테크노프로브 에스.피.에이.
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Priority to KR1020227037896A priority Critical patent/KR102542154B1/ko
Publication of KR20170107465A publication Critical patent/KR20170107465A/ko
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Publication of KR102502965B1 publication Critical patent/KR102502965B1/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020177021268A 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브 Active KR102502965B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227037896A KR102542154B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITMI2014A002286(102014902319648) 2014-12-30
ITMI20142286 2014-12-30
PCT/EP2015/079544 WO2016107729A1 (en) 2014-12-30 2015-12-14 Contact probe for testing head

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227037896A Division KR102542154B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브

Publications (2)

Publication Number Publication Date
KR20170107465A KR20170107465A (ko) 2017-09-25
KR102502965B1 true KR102502965B1 (ko) 2023-02-23

Family

ID=52633392

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177021268A Active KR102502965B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브
KR1020227037896A Active KR102542154B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227037896A Active KR102542154B1 (ko) 2014-12-30 2015-12-14 테스트 헤드용 접촉 프로브

Country Status (9)

Country Link
US (1) US11131690B2 (enExample)
EP (1) EP3241028B1 (enExample)
JP (1) JP6759213B2 (enExample)
KR (2) KR102502965B1 (enExample)
CN (1) CN107257928B (enExample)
PH (1) PH12017501220B1 (enExample)
SG (1) SG11201704433TA (enExample)
TW (1) TWI679425B (enExample)
WO (1) WO2016107729A1 (enExample)

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JP7005939B2 (ja) * 2017-05-25 2022-01-24 日本電産リード株式会社 コンタクトプローブ
CN109425762B (zh) * 2017-09-01 2021-05-07 中华精测科技股份有限公司 探针组件及其探针结构
CN109425814B (zh) * 2017-09-01 2021-09-10 中华精测科技股份有限公司 探针组件及其探针结构
US20190103693A1 (en) * 2017-09-29 2019-04-04 Apple Inc. Electrical contacts having sacrificial layer for corrosion protection
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
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TWI714151B (zh) * 2019-07-01 2020-12-21 技鼎股份有限公司 探針頭及其導電探針
TWI822833B (zh) * 2019-08-15 2023-11-21 優顯科技股份有限公司 電子探測板、光電探測模組、與電子探測方法
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US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
CN113109603A (zh) * 2020-01-13 2021-07-13 科磊股份有限公司 具有多个金属涂层的悬臂式探针
EP3862759B1 (de) * 2020-02-04 2022-05-11 Heraeus Deutschland GmbH & Co. KG Manteldraht und verfahren zur herstellung von manteldrähten
WO2021187339A1 (ja) * 2020-03-19 2021-09-23 日本電産リード株式会社 接触端子、検査治具、および検査装置
CN111403937A (zh) * 2020-03-24 2020-07-10 东莞立德精密工业有限公司 金属端子及其制作方法
US11774467B1 (en) * 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
JPWO2022059070A1 (enExample) * 2020-09-15 2022-03-24
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
KR102517778B1 (ko) * 2021-02-26 2023-04-04 (주)포인트엔지니어링 전기 전도성 접촉핀 어셈블리 및 그 제조방법
WO2022202681A1 (ja) * 2021-03-26 2022-09-29 石福金属興業株式会社 プローブピン用合金材料
KR102549551B1 (ko) * 2021-04-06 2023-06-29 (주)포인트엔지니어링 전기 전도성 접촉핀, 이를 구비하는 검사장치 및 전기 전도성 접촉핀의 제조방법
KR102577539B1 (ko) * 2021-04-09 2023-09-12 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이의 제조방법
KR102321083B1 (ko) * 2021-07-21 2021-11-03 (주)새한마이크로텍 접촉 프로브
CN113507005A (zh) * 2021-08-10 2021-10-15 烟台艾睿光电科技有限公司 一种巡检机器人充电房及巡检机器人
CN114791517B (zh) * 2022-04-18 2025-06-03 苏州伊欧陆系统集成有限公司 一种低漏电耐高温陶瓷刀片测试探针
KR102763456B1 (ko) 2022-05-11 2025-02-07 (주)티에스이 프로브 팁의 제조 방법 및 이에 의해 제조된 프로브 팁
TW202424495A (zh) * 2022-08-15 2024-06-16 美商微製造股份有限公司 具有解耦結構及電流乘載梁的多梁探針
EP4325227B1 (de) * 2022-08-16 2025-10-01 Heraeus Precious Metals GmbH & Co. KG Bandförmiger verbundwerkstoff für prüfnadeln
JP2024070404A (ja) * 2022-11-11 2024-05-23 株式会社日本マイクロニクス プローブおよび電気的接続装置
JP2024081055A (ja) * 2022-12-05 2024-06-17 株式会社日本マイクロニクス プローブおよび電気的接続装置
JP2024082419A (ja) * 2022-12-08 2024-06-20 株式会社日本マイクロニクス プローブ
JP2025117043A (ja) * 2024-01-30 2025-08-12 株式会社日本マイクロニクス プローブおよび電気的接続装置
CN120405195A (zh) * 2025-05-09 2025-08-01 芯卓科技(浙江)有限公司 测试探针、探针卡和测试探针制造方法

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JP2006228743A (ja) 2003-06-20 2006-08-31 Alps Electric Co Ltd 接続装置
US20080074128A1 (en) 2006-09-26 2008-03-27 Kabushiki Kaisha Nihon Micronics Electrical test probe and electrical test probe assembly
JP2008116284A (ja) 2006-11-02 2008-05-22 Takeshi Kaneko コンタクトプローブ、及びコンタクトプローブの製造方法
US20090243637A1 (en) 2008-03-31 2009-10-01 Hitachi High-Technologies Corporation Measuring apparatus having nanotube probe
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Also Published As

Publication number Publication date
TW201629493A (zh) 2016-08-16
PH12017501220A1 (en) 2018-01-08
TWI679425B (zh) 2019-12-11
KR20170107465A (ko) 2017-09-25
JP2018501490A (ja) 2018-01-18
US20170307657A1 (en) 2017-10-26
EP3241028B1 (en) 2020-02-05
KR102542154B1 (ko) 2023-06-13
CN107257928B (zh) 2020-12-01
WO2016107729A1 (en) 2016-07-07
SG11201704433TA (en) 2017-07-28
CN107257928A (zh) 2017-10-17
PH12017501220B1 (en) 2020-11-18
EP3241028A1 (en) 2017-11-08
JP6759213B2 (ja) 2020-09-23
US11131690B2 (en) 2021-09-28
KR20220153661A (ko) 2022-11-18

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