KR102496905B1 - 평면 연마 장치 및 캐리어 - Google Patents

평면 연마 장치 및 캐리어 Download PDF

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Publication number
KR102496905B1
KR102496905B1 KR1020170023261A KR20170023261A KR102496905B1 KR 102496905 B1 KR102496905 B1 KR 102496905B1 KR 1020170023261 A KR1020170023261 A KR 1020170023261A KR 20170023261 A KR20170023261 A KR 20170023261A KR 102496905 B1 KR102496905 B1 KR 102496905B1
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KR
South Korea
Prior art keywords
carrier
thickness
measuring
work
polishing
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KR1020170023261A
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English (en)
Korean (ko)
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KR20170104925A (ko
Inventor
유스케 이노우에
히데아키 요시하라
Original Assignee
스피드팸 가부시키가이샤
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    • H01L21/30625—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • H01L21/304—
    • H01L21/67092—
    • H01L22/12—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020170023261A 2016-03-08 2017-02-22 평면 연마 장치 및 캐리어 Active KR102496905B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016044113A JP6622117B2 (ja) 2016-03-08 2016-03-08 平面研磨装置及びキャリア
JPJP-P-2016-044113 2016-03-08

Publications (2)

Publication Number Publication Date
KR20170104925A KR20170104925A (ko) 2017-09-18
KR102496905B1 true KR102496905B1 (ko) 2023-02-07

Family

ID=59848707

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170023261A Active KR102496905B1 (ko) 2016-03-08 2017-02-22 평면 연마 장치 및 캐리어

Country Status (4)

Country Link
JP (1) JP6622117B2 (https=)
KR (1) KR102496905B1 (https=)
CN (1) CN107160288B (https=)
TW (1) TWI709457B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6760638B2 (ja) * 2016-04-14 2020-09-23 スピードファム株式会社 平面研磨装置
CN107486786A (zh) * 2017-10-01 2017-12-19 德清凯晶光电科技有限公司 防塌边游星轮
JP7035748B2 (ja) * 2018-04-11 2022-03-15 株式会社Sumco ワークの両面研磨装置
JP7046358B2 (ja) * 2018-04-17 2022-04-04 スピードファム株式会社 研磨装置
JP7364217B2 (ja) * 2019-11-05 2023-10-18 スピードファム株式会社 研磨装置
JP7651151B2 (ja) * 2019-12-25 2025-03-26 スピードファム株式会社 ワークホール検出装置及びワークホール検出方法
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7425411B2 (ja) * 2020-10-12 2024-01-31 株式会社Sumco キャリア測定装置、キャリア測定方法、及びキャリア管理方法
DE112022002923T5 (de) * 2021-06-04 2024-03-14 Sumco Corporation Doppelseitige poliervorrichtung und doppelseitiges polierverfahren für werkstücke
CN117506703B (zh) * 2023-12-01 2024-05-10 苏州博宏源机械制造有限公司 测量装置及抛光系统
TWI880618B (zh) * 2024-01-31 2025-04-11 準力機械股份有限公司 基板研磨設備的研磨構造

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2008227393A (ja) 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP2010045279A (ja) 2008-08-18 2010-02-25 Nippon Steel Corp 半導体基板の両面研磨方法
JP2015047656A (ja) 2013-08-30 2015-03-16 株式会社Sumco ワークの両面研磨装置及び両面研磨方法

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JPS61213611A (ja) * 1985-03-19 1986-09-22 Nec Corp 結晶の研磨方法
JPH05309559A (ja) * 1992-05-12 1993-11-22 Speedfam Co Ltd 平面研磨方法及び装置
JPH0740233A (ja) * 1993-07-27 1995-02-10 Speedfam Co Ltd ワークの厚さ測定装置
JP3326443B2 (ja) * 1993-08-10 2002-09-24 株式会社ニコン ウエハ研磨方法及びその装置
JP3431115B2 (ja) * 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
JP2888339B1 (ja) * 1998-03-27 1999-05-10 直江津電子工業株式会社 被加工物保持プレート
US8834230B2 (en) * 2008-07-31 2014-09-16 Shin-Etsu Handotai Co., Ltd. Wafer polishing method and double-side polishing apparatus
CN201419354Y (zh) * 2009-04-29 2010-03-10 上海合晶硅材料有限公司 一种用于加工薄型硅单晶片的行星片
JP2012205258A (ja) * 2011-03-28 2012-10-22 Seiko Instruments Inc 研磨方法、圧電振動片の製造方法、圧電振動子、発振器、電子機器及び電波時計
JP5630414B2 (ja) * 2011-10-04 2014-11-26 信越半導体株式会社 ウェーハの加工方法
JP5896884B2 (ja) * 2012-11-13 2016-03-30 信越半導体株式会社 両面研磨方法
JP6003800B2 (ja) * 2013-05-16 2016-10-05 信越半導体株式会社 ウェーハの両面研磨方法及び両面研磨システム
KR20150053049A (ko) * 2013-11-07 2015-05-15 주식회사 엘지실트론 웨이퍼의 양면 연마 방법
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227393A (ja) 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP2010045279A (ja) 2008-08-18 2010-02-25 Nippon Steel Corp 半導体基板の両面研磨方法
JP2015047656A (ja) 2013-08-30 2015-03-16 株式会社Sumco ワークの両面研磨装置及び両面研磨方法

Also Published As

Publication number Publication date
CN107160288A (zh) 2017-09-15
TWI709457B (zh) 2020-11-11
JP2017159382A (ja) 2017-09-14
KR20170104925A (ko) 2017-09-18
JP6622117B2 (ja) 2019-12-18
TW201731633A (zh) 2017-09-16
CN107160288B (zh) 2020-06-26

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