CN107160288B - 平面研磨装置及游星轮 - Google Patents

平面研磨装置及游星轮 Download PDF

Info

Publication number
CN107160288B
CN107160288B CN201710129352.0A CN201710129352A CN107160288B CN 107160288 B CN107160288 B CN 107160288B CN 201710129352 A CN201710129352 A CN 201710129352A CN 107160288 B CN107160288 B CN 107160288B
Authority
CN
China
Prior art keywords
workpiece
thickness
planetary wheel
light
transmitting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710129352.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN107160288A (zh
Inventor
井上裕介
吉原秀明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Publication of CN107160288A publication Critical patent/CN107160288A/zh
Application granted granted Critical
Publication of CN107160288B publication Critical patent/CN107160288B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201710129352.0A 2016-03-08 2017-03-06 平面研磨装置及游星轮 Active CN107160288B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-044113 2016-03-08
JP2016044113A JP6622117B2 (ja) 2016-03-08 2016-03-08 平面研磨装置及びキャリア

Publications (2)

Publication Number Publication Date
CN107160288A CN107160288A (zh) 2017-09-15
CN107160288B true CN107160288B (zh) 2020-06-26

Family

ID=59848707

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710129352.0A Active CN107160288B (zh) 2016-03-08 2017-03-06 平面研磨装置及游星轮

Country Status (4)

Country Link
JP (1) JP6622117B2 (https=)
KR (1) KR102496905B1 (https=)
CN (1) CN107160288B (https=)
TW (1) TWI709457B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6760638B2 (ja) * 2016-04-14 2020-09-23 スピードファム株式会社 平面研磨装置
CN107486786A (zh) * 2017-10-01 2017-12-19 德清凯晶光电科技有限公司 防塌边游星轮
JP7035748B2 (ja) * 2018-04-11 2022-03-15 株式会社Sumco ワークの両面研磨装置
JP7046358B2 (ja) * 2018-04-17 2022-04-04 スピードファム株式会社 研磨装置
JP7364217B2 (ja) * 2019-11-05 2023-10-18 スピードファム株式会社 研磨装置
JP7651151B2 (ja) * 2019-12-25 2025-03-26 スピードファム株式会社 ワークホール検出装置及びワークホール検出方法
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7425411B2 (ja) * 2020-10-12 2024-01-31 株式会社Sumco キャリア測定装置、キャリア測定方法、及びキャリア管理方法
DE112022002923T5 (de) * 2021-06-04 2024-03-14 Sumco Corporation Doppelseitige poliervorrichtung und doppelseitiges polierverfahren für werkstücke
CN117506703B (zh) * 2023-12-01 2024-05-10 苏州博宏源机械制造有限公司 测量装置及抛光系统
TWI880618B (zh) * 2024-01-31 2025-04-11 準力機械股份有限公司 基板研磨設備的研磨構造

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213611A (ja) * 1985-03-19 1986-09-22 Nec Corp 結晶の研磨方法
JPH05309559A (ja) * 1992-05-12 1993-11-22 Speedfam Co Ltd 平面研磨方法及び装置
JPH0752032A (ja) * 1993-08-10 1995-02-28 Sumitomo Metal Mining Co Ltd ウエハ研磨方法及びその装置
EP0738561A1 (en) * 1995-03-28 1996-10-23 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations
CN101264585A (zh) * 2007-03-15 2008-09-17 不二越机械工业株式会社 双面研磨装置
CN201419354Y (zh) * 2009-04-29 2010-03-10 上海合晶硅材料有限公司 一种用于加工薄型硅单晶片的行星片

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740233A (ja) * 1993-07-27 1995-02-10 Speedfam Co Ltd ワークの厚さ測定装置
JP2888339B1 (ja) * 1998-03-27 1999-05-10 直江津電子工業株式会社 被加工物保持プレート
US8834230B2 (en) * 2008-07-31 2014-09-16 Shin-Etsu Handotai Co., Ltd. Wafer polishing method and double-side polishing apparatus
JP2010045279A (ja) * 2008-08-18 2010-02-25 Nippon Steel Corp 半導体基板の両面研磨方法
JP2012205258A (ja) * 2011-03-28 2012-10-22 Seiko Instruments Inc 研磨方法、圧電振動片の製造方法、圧電振動子、発振器、電子機器及び電波時計
JP5630414B2 (ja) * 2011-10-04 2014-11-26 信越半導体株式会社 ウェーハの加工方法
JP5896884B2 (ja) * 2012-11-13 2016-03-30 信越半導体株式会社 両面研磨方法
JP6003800B2 (ja) * 2013-05-16 2016-10-05 信越半導体株式会社 ウェーハの両面研磨方法及び両面研磨システム
JP6146213B2 (ja) * 2013-08-30 2017-06-14 株式会社Sumco ワークの両面研磨装置及び両面研磨方法
KR20150053049A (ko) * 2013-11-07 2015-05-15 주식회사 엘지실트론 웨이퍼의 양면 연마 방법
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213611A (ja) * 1985-03-19 1986-09-22 Nec Corp 結晶の研磨方法
JPH05309559A (ja) * 1992-05-12 1993-11-22 Speedfam Co Ltd 平面研磨方法及び装置
JPH0752032A (ja) * 1993-08-10 1995-02-28 Sumitomo Metal Mining Co Ltd ウエハ研磨方法及びその装置
EP0738561A1 (en) * 1995-03-28 1996-10-23 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations
CN101264585A (zh) * 2007-03-15 2008-09-17 不二越机械工业株式会社 双面研磨装置
CN201419354Y (zh) * 2009-04-29 2010-03-10 上海合晶硅材料有限公司 一种用于加工薄型硅单晶片的行星片

Also Published As

Publication number Publication date
CN107160288A (zh) 2017-09-15
TWI709457B (zh) 2020-11-11
JP2017159382A (ja) 2017-09-14
KR20170104925A (ko) 2017-09-18
JP6622117B2 (ja) 2019-12-18
TW201731633A (zh) 2017-09-16
KR102496905B1 (ko) 2023-02-07

Similar Documents

Publication Publication Date Title
CN107160288B (zh) 平面研磨装置及游星轮
JP6760638B2 (ja) 平面研磨装置
JP6146213B2 (ja) ワークの両面研磨装置及び両面研磨方法
TWI478226B (zh) Grinding method of double - sided grinding device and wafer
JP5630414B2 (ja) ウェーハの加工方法
KR101840285B1 (ko) 반도체 웨이퍼의 연마 방법
TWI752045B (zh) 研磨裝置
WO2014002467A1 (ja) ワークの研磨方法およびワークの研磨装置
JP5639147B2 (ja) 両面研削機における極薄被加工物の材料除去機械加工方法
CN116900924A (zh) 双面研磨装置及双面研磨方法
CN117464487A (zh) 硅片边缘研磨装置及硅片边缘研磨方法
WO2018043054A1 (ja) ドレッサー
CN107052985B (zh) 平面研磨装置
JP2008036802A (ja) 両面研磨装置および両面研磨装置におけるワークとキャリアとの重なり検知方法
CN118338987A (zh) 双面研磨装置
JP2006237098A (ja) 半導体ウェーハの両面研磨装置及び両面研磨方法
JP2010186776A (ja) ウエーハの研削方法
JPH11285969A (ja) 光学式定寸装置付ラップ又は研磨装置及び方法
JP2001315057A (ja) 枚葉式両面研磨装置
JP4496535B2 (ja) ラッピングキャリア及びその管理方法並びにウエーハの製造方法
JP2015009293A (ja) ドレス処理方法
JP2009130077A (ja) Ｓｏｉウェーハの製造方法
JP2019034349A (ja) 板加工用キャリア及び研磨方法
JP2005259980A (ja) 化学機械研磨装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant