KR102460768B1 - 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법 - Google Patents

폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법 Download PDF

Info

Publication number
KR102460768B1
KR102460768B1 KR1020207019673A KR20207019673A KR102460768B1 KR 102460768 B1 KR102460768 B1 KR 102460768B1 KR 1020207019673 A KR1020207019673 A KR 1020207019673A KR 20207019673 A KR20207019673 A KR 20207019673A KR 102460768 B1 KR102460768 B1 KR 102460768B1
Authority
KR
South Korea
Prior art keywords
polyimide
group
film
carbon atoms
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020207019673A
Other languages
English (en)
Korean (ko)
Other versions
KR20200085383A (ko
Inventor
마사키 마이타니
다케키 시미즈
다카유키 가나다
Original Assignee
아사히 가세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 가부시키가이샤 filed Critical 아사히 가세이 가부시키가이샤
Priority to KR1020227037038A priority Critical patent/KR102659377B1/ko
Publication of KR20200085383A publication Critical patent/KR20200085383A/ko
Application granted granted Critical
Publication of KR102460768B1 publication Critical patent/KR102460768B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020207019673A 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법 Active KR102460768B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227037038A KR102659377B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2015186730 2015-09-24
JPJP-P-2015-186730 2015-09-24
JP2015218783 2015-11-06
JPJP-P-2015-218783 2015-11-06
JP2016055476 2016-03-18
JPJP-P-2016-055476 2016-03-18
JPJP-P-2016-124849 2016-06-23
JP2016124849 2016-06-23
KR1020187003697A KR102133559B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
PCT/JP2016/077878 WO2017051827A1 (ja) 2015-09-24 2016-09-21 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020187003697A Division KR102133559B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227037038A Division KR102659377B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

Publications (2)

Publication Number Publication Date
KR20200085383A KR20200085383A (ko) 2020-07-14
KR102460768B1 true KR102460768B1 (ko) 2022-10-28

Family

ID=58386775

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020207019673A Active KR102460768B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
KR1020187003697A Active KR102133559B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
KR1020227037038A Active KR102659377B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020187003697A Active KR102133559B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
KR1020227037038A Active KR102659377B1 (ko) 2015-09-24 2016-09-21 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법

Country Status (5)

Country Link
JP (5) JP6444522B2 (enExample)
KR (3) KR102460768B1 (enExample)
CN (2) CN108026273B (enExample)
TW (2) TWI641632B (enExample)
WO (1) WO2017051827A1 (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018139311A1 (ja) * 2017-01-27 2018-08-02 ウィンゴーテクノロジー株式会社 ジアミン化合物、並びにそれを用いたポリイミド化合物および成形物
JP7189619B2 (ja) * 2017-04-07 2022-12-14 株式会社アイ．エス．テイ ポリイミド膜
CN112004858B (zh) 2018-03-30 2023-06-30 株式会社钟化 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体及柔性装置、以及聚酰亚胺膜的制造方法
KR102516144B1 (ko) * 2018-08-28 2023-03-29 주식회사 엘지화학 투명 필름 제조용 용매의 전처리 방법
JP7041662B2 (ja) * 2018-12-20 2022-03-24 コーロン インダストリーズ インク ポリアミック酸、ポリイミド樹脂及びポリイミドフィルム
WO2020159193A1 (ko) * 2019-02-01 2020-08-06 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이로부터 제조된 폴리이미드 필름, 디스플레이 장치용 기판, 및 광학 장치
CN112204085B (zh) * 2019-02-01 2023-04-07 株式会社Lg化学 基于聚酰亚胺的聚合物膜、使用其的显示装置用基底和光学装置
US20210214501A1 (en) 2019-02-01 2021-07-15 Lg Chem, Ltd. Polyimide-based polymer film, substrate for display device, and optical device using the same
EP3919548A4 (en) * 2019-02-01 2022-10-12 Wingo Technology Co., Ltd. POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SUCH POLYIMIDE COMPOUND
JPWO2020195819A1 (enExample) * 2019-03-26 2020-10-01
JP7349253B2 (ja) * 2019-03-29 2023-09-22 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
WO2021028960A1 (ja) * 2019-08-09 2021-02-18 太陽ホールディングス株式会社 着色樹脂組成物、硬化物および積層体
KR20220056861A (ko) * 2019-10-03 2022-05-06 미쓰이 가가쿠 가부시키가이샤 폴리이미드 필름, 폴리아마이드산 및 이것을 포함하는 바니시, 및 폴리이미드 적층체 및 그 제조 방법
JP7365940B2 (ja) * 2020-03-05 2023-10-20 東京応化工業株式会社 ワニス組成物、及びポリイミド樹脂の製造方法
JP7757955B2 (ja) 2020-03-27 2025-10-22 三菱瓦斯化学株式会社 ポリイミドフィルム及び積層体
WO2021210640A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
WO2021210641A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
JP7576926B2 (ja) * 2020-04-24 2024-11-01 旭化成株式会社 ジアミン化合物及びその製造方法
JP2021175790A (ja) * 2020-04-24 2021-11-04 旭化成株式会社 ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
JP7483480B2 (ja) * 2020-04-24 2024-05-15 旭化成株式会社 ポリイミド前駆体、ポリイミド樹脂組成物、並びにポリイミド樹脂フィルム及びその製造方法
CN111533909B (zh) * 2020-06-08 2023-04-25 武汉柔显科技股份有限公司 一种聚酰胺酰亚胺、聚酰胺酰亚胺薄膜及显示装置
EP4223521A4 (en) * 2020-09-29 2024-10-30 Toyobo Co., Ltd. LAMINATED BODY COMPRISING AN INORGANIC SUBSTRATE AND CURED POLYAMIC ACID PRODUCT
JPWO2022071443A1 (enExample) * 2020-09-30 2022-04-07
CN112225897A (zh) * 2020-10-19 2021-01-15 深圳市道尔顿电子材料有限公司 含芳香酯结构的三氟甲基取代芳香二胺化合物及其制备方法
WO2022085620A1 (ja) * 2020-10-22 2022-04-28 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体、電子デバイス、及びポリイミド膜の製造方法
CN112175186B (zh) * 2020-10-29 2022-12-20 深圳市道尔顿电子材料有限公司 聚酰亚胺材料及其制备方法、聚酰亚胺薄膜及其制备方法
US12382822B2 (en) 2020-11-19 2025-08-05 Lg Chem, Ltd. Substrate for display device or flexible display device, and display device or flexible display device using the same
EP4289879A4 (en) * 2021-02-03 2024-12-11 Mitsui Chemicals, Inc. METHOD FOR PRODUCING AN OPTICAL MATERIAL, POLYMERIZABLE COMPOSITION FOR OPTICAL MATERIAL AND OPTICAL MATERIAL
WO2022211086A1 (ja) * 2021-04-02 2022-10-06 旭化成株式会社 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
CN113292726B (zh) * 2021-04-10 2023-03-24 常州市尚科新材料有限公司 聚酰亚胺模塑粉及其制备方法和应用
JPWO2022220286A1 (enExample) 2021-04-16 2022-10-20
TWI869806B (zh) * 2022-03-29 2025-01-11 日商Ｕｂｅ股份有限公司 可撓性配線基板用聚醯亞胺前驅體組合物、聚醯亞胺膜及聚醯亞胺金屬積層體
JP7235157B1 (ja) 2022-07-29 2023-03-08 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体
JPWO2024024901A1 (enExample) * 2022-07-29 2024-02-01
CN119894963A (zh) * 2022-09-16 2025-04-25 三菱瓦斯化学株式会社 聚酰亚胺薄膜的制造方法
WO2025047704A1 (ja) * 2023-08-30 2025-03-06 株式会社カネカ ポリアミド酸組成物、ポリイミド、ポリイミド膜、積層体、電子デバイス、及びポリアミド酸組成物の製造方法
WO2025084154A1 (ja) * 2023-10-19 2025-04-24 三菱瓦斯化学株式会社 ポリイミド樹脂の製造方法
WO2025084155A1 (ja) * 2023-10-19 2025-04-24 三菱瓦斯化学株式会社 ポリイミド樹脂の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139086A1 (ja) * 2008-05-16 2009-11-19 旭化成イーマテリアルズ株式会社 ポリエステルイミド前駆体及びポリエステルイミド
WO2010110335A1 (ja) * 2009-03-26 2010-09-30 新日鐵化学株式会社 感光性樹脂組成物及び硬化膜
JP2015135464A (ja) 2013-10-07 2015-07-27 Jsr株式会社 液晶配向膜の製造方法、光配向剤及び液晶表示素子
JP5773090B1 (ja) 2013-09-27 2015-09-02 東レ株式会社 ポリイミド前駆体、それから得られるポリイミド樹脂膜、ならびにそれを含む表示素子、光学素子、受光素子、タッチパネル、回路基板、有機ｅｌディスプレイ、および、有機ｅｌ素子ならびにカラーフィルタの製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4627297Y1 (enExample) 1966-10-15 1971-09-20
JP3079867B2 (ja) 1993-11-10 2000-08-21 信越化学工業株式会社 ポリイミド共重合体、その製造方法及びポリイミドフィルム
JPH1070157A (ja) * 1996-08-27 1998-03-10 Kanegafuchi Chem Ind Co Ltd 新規ポリイミドフィルムをベースフィルムとするｆｃテープ及びｔａｂテープ
JP4608715B2 (ja) * 1999-12-24 2011-01-12 Ｄｉｃ株式会社 ポリアリーレンスルフィドの製造方法
JP3079867U (ja) 2001-02-27 2001-08-31 馬 慶修 コンピュータ・デスク
WO2005113647A1 (ja) 2004-05-21 2005-12-01 Manac Inc 低線熱膨張係数を有するポリエステルイミドとその前駆体
JP4699321B2 (ja) * 2005-09-20 2011-06-08 新日鐵化学株式会社 エステル基含有ポリイミド、その前駆体及びこれらの製造方法
KR101075146B1 (ko) * 2006-07-27 2011-10-19 우베 고산 가부시키가이샤 내열성 필름 금속박 적층체 및 그 제조 방법
KR101225842B1 (ko) 2007-08-27 2013-01-23 코오롱인더스트리 주식회사 무색투명한 폴리이미드 필름
JP2009091441A (ja) * 2007-10-05 2009-04-30 Asahi Kasei Corp ポリイミド前駆体及びポリイミド
JP2009286854A (ja) * 2008-05-27 2009-12-10 Asahi Kasei E-Materials Corp ポリエステルイミド前駆体およびポリエステルイミド
JP5362385B2 (ja) * 2009-02-23 2013-12-11 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物及びそれを用いたポリイミド金属積層板
JP5755401B2 (ja) * 2009-04-30 2015-07-29 株式会社ピーアイ技術研究所 変性ポリイミドの製造方法及び変性ポリイミド
JP2011021072A (ja) * 2009-07-14 2011-02-03 Asahi Kasei E-Materials Corp ポリエステルイミド前駆体及びポリエステルイミド
CN102712753B (zh) * 2009-11-20 2015-08-26 E·I·内穆尔杜邦公司 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法
JP5923887B2 (ja) * 2011-07-21 2016-05-25 宇部興産株式会社 ポリイミド、及びポリイミド前駆体
JP5842429B2 (ja) * 2010-07-22 2016-01-13 宇部興産株式会社 ポリイミド前駆体及びポリイミド
CN104066768B (zh) * 2011-11-25 2018-03-23 日产化学工业株式会社 显示器基板用树脂组合物
JP2014009305A (ja) * 2012-06-29 2014-01-20 Asahi Kasei E-Materials Corp 樹脂組成物、積層体及び積層体の製造方法
CN104640907B (zh) * 2012-09-19 2019-03-22 本州化学工业株式会社 聚酰亚胺及其成形体
JP6405616B2 (ja) * 2012-10-25 2018-10-17 三菱ケミカル株式会社 積層体の製造方法、積層体、デバイス積層体及びデバイスフィルム
JP6067740B2 (ja) * 2012-11-08 2017-01-25 旭化成株式会社 フレキシブルデバイスの製造方法、積層体及びその製造方法、並びに、樹脂組成物
JP2015078254A (ja) * 2013-10-15 2015-04-23 東レ株式会社 樹脂組成物、それを用いたポリイミド樹脂膜、それを含むカラーフィルタ、ｔｆｔ基板、表示デバイスおよびそれらの製造方法
KR101980506B1 (ko) * 2014-02-14 2019-05-20 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 그것을 함유하는 수지 조성물
CN106029743B (zh) * 2014-02-21 2019-03-29 三菱化学株式会社 含聚酰亚胺前驱体和/或聚酰亚胺的组合物，以及聚酰亚胺膜
CN106029744B (zh) * 2014-02-26 2018-08-28 东丽株式会社 聚酰亚胺树脂、使用其的树脂组合物及层叠膜
JP6729403B2 (ja) * 2015-02-10 2020-07-22 日産化学株式会社 剥離層形成用組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139086A1 (ja) * 2008-05-16 2009-11-19 旭化成イーマテリアルズ株式会社 ポリエステルイミド前駆体及びポリエステルイミド
WO2010110335A1 (ja) * 2009-03-26 2010-09-30 新日鐵化学株式会社 感光性樹脂組成物及び硬化膜
JP5773090B1 (ja) 2013-09-27 2015-09-02 東レ株式会社 ポリイミド前駆体、それから得られるポリイミド樹脂膜、ならびにそれを含む表示素子、光学素子、受光素子、タッチパネル、回路基板、有機ｅｌディスプレイ、および、有機ｅｌ素子ならびにカラーフィルタの製造方法
JP2015135464A (ja) 2013-10-07 2015-07-27 Jsr株式会社 液晶配向膜の製造方法、光配向剤及び液晶表示素子

Also Published As

Publication number Publication date
CN108026273A (zh) 2018-05-11
JPWO2017051827A1 (ja) 2018-03-22
CN112940253A (zh) 2021-06-11
JP7095024B2 (ja) 2022-07-04
KR20200085383A (ko) 2020-07-14
TWI695855B (zh) 2020-06-11
JP2022128480A (ja) 2022-09-01
TW201902992A (zh) 2019-01-16
TWI641632B (zh) 2018-11-21
CN108026273B (zh) 2021-04-06
JP6725626B2 (ja) 2020-07-22
KR20220147724A (ko) 2022-11-03
KR20180048605A (ko) 2018-05-10
JP2019070811A (ja) 2019-05-09
JP2024023254A (ja) 2024-02-21
JP6444522B2 (ja) 2018-12-26
KR102133559B1 (ko) 2020-07-13
TW201718714A (zh) 2017-06-01
JP7383764B2 (ja) 2023-11-20
KR102659377B1 (ko) 2024-04-19
WO2017051827A1 (ja) 2017-03-30
JP2020172652A (ja) 2020-10-22

Similar Documents

Publication Publication Date Title
JP7383764B2 (ja) ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
KR102377097B1 (ko) 폴리이미드 전구체, 수지 조성물, 수지 필름 및 그 제조 방법
JP7152381B2 (ja) 樹脂前駆体及びそれを含有する樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
JP7564622B2 (ja) 樹脂組成物、ポリイミド樹脂膜、及びその製造方法
JP6476278B2 (ja) ポリイミド前駆体樹脂組成物
KR102593077B1 (ko) 폴리이미드 전구체 및 그것을 포함하는 수지 조성물, 폴리이미드 수지막, 수지 필름 및 그 제조 방법
CN113549217A (zh) 聚酰亚胺前体和包含其的树脂组合物、聚酰亚胺树脂膜、树脂薄膜及其制造方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4