JPWO2024024901A1 - - Google Patents

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Publication number
JPWO2024024901A1
JPWO2024024901A1 JP2024537232A JP2024537232A JPWO2024024901A1 JP WO2024024901 A1 JPWO2024024901 A1 JP WO2024024901A1 JP 2024537232 A JP2024537232 A JP 2024537232A JP 2024537232 A JP2024537232 A JP 2024537232A JP WO2024024901 A1 JPWO2024024901 A1 JP WO2024024901A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024537232A
Other languages
Japanese (ja)
Other versions
JPWO2024024901A5 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024024901A1 publication Critical patent/JPWO2024024901A1/ja
Publication of JPWO2024024901A5 publication Critical patent/JPWO2024024901A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
JP2024537232A 2022-07-29 2023-07-27 Pending JPWO2024024901A1 (enExample)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022122329 2022-07-29
JP2022140335 2022-09-02
JP2023029768 2023-02-28
PCT/JP2023/027627 WO2024024901A1 (ja) 2022-07-29 2023-07-27 ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体

Publications (2)

Publication Number Publication Date
JPWO2024024901A1 true JPWO2024024901A1 (enExample) 2024-02-01
JPWO2024024901A5 JPWO2024024901A5 (enExample) 2025-04-16

Family

ID=89706508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024537232A Pending JPWO2024024901A1 (enExample) 2022-07-29 2023-07-27

Country Status (4)

Country Link
JP (1) JPWO2024024901A1 (enExample)
KR (2) KR102841382B1 (enExample)
CN (2) CN118139913B (enExample)
WO (1) WO2024024901A1 (enExample)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014029465A (ja) * 2012-06-29 2014-02-13 Jsr Corp 光配向用液晶配向剤、液晶配向膜及びその製造方法、液晶表示素子、化合物、並びに重合体
JP2014173028A (ja) * 2013-03-11 2014-09-22 Ube Ind Ltd ポリアミック酸溶液組成物、及びポリイミド積層体
JP2017049576A (ja) * 2015-09-02 2017-03-09 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子、並びにこれらの製造方法
WO2017051827A1 (ja) * 2015-09-24 2017-03-30 旭化成株式会社 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
JP2018158535A (ja) * 2017-03-23 2018-10-11 宇部興産株式会社 ポリイミドフィルムとハードコート層とを含む積層体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3079867B2 (ja) 1993-11-10 2000-08-21 信越化学工業株式会社 ポリイミド共重合体、その製造方法及びポリイミドフィルム
KR20100125252A (ko) 2008-02-25 2010-11-30 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 폴리이미드 전구체 조성물, 폴리이미드 필름 및 투명 플렉서블 필름
JP2010202729A (ja) 2009-03-02 2010-09-16 Hitachi Chemical Dupont Microsystems Ltd フレキシブルデバイス基板用ポリイミド前駆体樹脂組成物及びそれを用いたフレキシブルデバイスの製造方法、フレキシブルデバイス
JP2012532459A (ja) 2009-07-02 2012-12-13 フリップチップ インターナショナル エルエルシー 垂直ピラー相互接続方法及び構造体
CN110628025B (zh) 2010-07-22 2022-07-12 宇部兴产株式会社 聚酰亚胺前体、聚酰亚胺及其制备中所用的材料
JP6254197B2 (ja) * 2014-02-14 2017-12-27 旭化成株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
CN111234217A (zh) 2015-02-10 2020-06-05 日产化学工业株式会社 剥离层形成用组合物
KR102143307B1 (ko) 2017-05-31 2020-08-10 우베 고산 가부시키가이샤 폴리이미드 필름
JP7304338B2 (ja) 2018-03-30 2023-07-06 株式会社カネカ ポリイミド膜の製造方法および電子デバイスの製造方法
JP7349253B2 (ja) 2019-03-29 2023-09-22 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
CN110003470A (zh) * 2019-04-29 2019-07-12 中国科学院长春应用化学研究所 一种应用于柔性显示基板的聚酰亚胺材料及其制备方法
CN112239539A (zh) 2019-07-16 2021-01-19 臻鼎科技股份有限公司 聚酰胺酸组成物、聚酰亚胺覆铜板及电路板
JP2021175790A (ja) 2020-04-24 2021-11-04 旭化成株式会社 ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
JP2021195380A (ja) 2020-06-09 2021-12-27 日東電工株式会社 ポリイミドフィルムおよび金属張積層板
WO2021261177A1 (ja) 2020-06-23 2021-12-30 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体、積層体の製造方法及び電子デバイス
CN114426666B (zh) 2020-10-29 2024-09-27 臻鼎科技股份有限公司 聚酰亚胺膜及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014029465A (ja) * 2012-06-29 2014-02-13 Jsr Corp 光配向用液晶配向剤、液晶配向膜及びその製造方法、液晶表示素子、化合物、並びに重合体
JP2014173028A (ja) * 2013-03-11 2014-09-22 Ube Ind Ltd ポリアミック酸溶液組成物、及びポリイミド積層体
JP2017049576A (ja) * 2015-09-02 2017-03-09 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子、並びにこれらの製造方法
WO2017051827A1 (ja) * 2015-09-24 2017-03-30 旭化成株式会社 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
JP2018158535A (ja) * 2017-03-23 2018-10-11 宇部興産株式会社 ポリイミドフィルムとハードコート層とを含む積層体

Also Published As

Publication number Publication date
KR102693676B1 (ko) 2024-08-12
KR102841382B1 (ko) 2025-08-01
CN118139913B (zh) 2025-04-29
WO2024024901A1 (ja) 2024-02-01
KR20240055121A (ko) 2024-04-26
CN120059184A (zh) 2025-05-30
KR20240123430A (ko) 2024-08-13
CN118139913A (zh) 2024-06-04
TW202413488A (zh) 2024-04-01

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