CN118139913B - 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体 - Google Patents

聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体 Download PDF

Info

Publication number
CN118139913B
CN118139913B CN202380014149.2A CN202380014149A CN118139913B CN 118139913 B CN118139913 B CN 118139913B CN 202380014149 A CN202380014149 A CN 202380014149A CN 118139913 B CN118139913 B CN 118139913B
Authority
CN
China
Prior art keywords
mol
polyimide
polyimide precursor
formula
polyimide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202380014149.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN118139913A (zh
Inventor
冈卓也
根本雄基
小滨幸德
伊藤太一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Corp filed Critical Ube Corp
Priority to CN202510438782.5A priority Critical patent/CN120059184A/zh
Publication of CN118139913A publication Critical patent/CN118139913A/zh
Application granted granted Critical
Publication of CN118139913B publication Critical patent/CN118139913B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
CN202380014149.2A 2022-07-29 2023-07-27 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体 Active CN118139913B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202510438782.5A CN120059184A (zh) 2022-07-29 2023-07-27 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2022122329 2022-07-29
JP2022-122329 2022-07-29
JP2022140335 2022-09-02
JP2022-140335 2022-09-02
JP2023029768 2023-02-28
JP2023-029768 2023-02-28
PCT/JP2023/027627 WO2024024901A1 (ja) 2022-07-29 2023-07-27 ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202510438782.5A Division CN120059184A (zh) 2022-07-29 2023-07-27 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体

Publications (2)

Publication Number Publication Date
CN118139913A CN118139913A (zh) 2024-06-04
CN118139913B true CN118139913B (zh) 2025-04-29

Family

ID=89706508

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202380014149.2A Active CN118139913B (zh) 2022-07-29 2023-07-27 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体
CN202510438782.5A Pending CN120059184A (zh) 2022-07-29 2023-07-27 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202510438782.5A Pending CN120059184A (zh) 2022-07-29 2023-07-27 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体

Country Status (4)

Country Link
JP (1) JPWO2024024901A1 (enExample)
KR (2) KR102693676B1 (enExample)
CN (2) CN118139913B (enExample)
WO (1) WO2024024901A1 (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105916910A (zh) * 2014-02-14 2016-08-31 旭化成株式会社 聚酰亚胺前体和含有其的树脂组合物
CN108026273A (zh) * 2015-09-24 2018-05-11 旭化成株式会社 聚酰亚胺前体、树脂组合物和树脂薄膜的制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3079867B2 (ja) 1993-11-10 2000-08-21 信越化学工業株式会社 ポリイミド共重合体、その製造方法及びポリイミドフィルム
WO2009107429A1 (ja) 2008-02-25 2009-09-03 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体組成物、ポリイミドフィルム及び透明フレキシブルフィルム
JP2010202729A (ja) 2009-03-02 2010-09-16 Hitachi Chemical Dupont Microsystems Ltd フレキシブルデバイス基板用ポリイミド前駆体樹脂組成物及びそれを用いたフレキシブルデバイスの製造方法、フレキシブルデバイス
JP2012532459A (ja) 2009-07-02 2012-12-13 フリップチップ インターナショナル エルエルシー 垂直ピラー相互接続方法及び構造体
US20130178597A1 (en) 2010-07-22 2013-07-11 Ube Industries, Ltd. Polyimide precursor, polyimide, and materials to be used in producing same
JP6146077B2 (ja) * 2012-06-29 2017-06-14 Jsr株式会社 液晶配向膜の製造方法
JP2014173028A (ja) * 2013-03-11 2014-09-22 Ube Ind Ltd ポリアミック酸溶液組成物、及びポリイミド積層体
CN113402882B (zh) 2015-02-10 2024-02-06 日产化学工业株式会社 剥离层形成用组合物
JP6776687B2 (ja) * 2015-09-02 2020-10-28 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子、並びにこれらの製造方法
JP6926566B2 (ja) 2017-03-23 2021-08-25 宇部興産株式会社 ポリイミドフィルムとハードコート層とを含む積層体
JP7072140B2 (ja) 2017-05-31 2022-05-20 Ｕｂｅ株式会社 ポリイミドフィルム
JP7304338B2 (ja) 2018-03-30 2023-07-06 株式会社カネカ ポリイミド膜の製造方法および電子デバイスの製造方法
JP7349253B2 (ja) 2019-03-29 2023-09-22 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
CN110003470A (zh) 2019-04-29 2019-07-12 中国科学院长春应用化学研究所 一种应用于柔性显示基板的聚酰亚胺材料及其制备方法
CN112239539A (zh) 2019-07-16 2021-01-19 臻鼎科技股份有限公司 聚酰胺酸组成物、聚酰亚胺覆铜板及电路板
JP2021175790A (ja) 2020-04-24 2021-11-04 旭化成株式会社 ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
JP2021195380A (ja) 2020-06-09 2021-12-27 日東電工株式会社 ポリイミドフィルムおよび金属張積層板
CN115803365B (zh) 2020-06-23 2024-07-30 株式会社钟化 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体、层叠体的制造方法及电子器件
CN114426666B (zh) 2020-10-29 2024-09-27 臻鼎科技股份有限公司 聚酰亚胺膜及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105916910A (zh) * 2014-02-14 2016-08-31 旭化成株式会社 聚酰亚胺前体和含有其的树脂组合物
CN108026273A (zh) * 2015-09-24 2018-05-11 旭化成株式会社 聚酰亚胺前体、树脂组合物和树脂薄膜的制造方法

Also Published As

Publication number Publication date
CN120059184A (zh) 2025-05-30
KR102841382B1 (ko) 2025-08-01
WO2024024901A1 (ja) 2024-02-01
KR20240055121A (ko) 2024-04-26
CN118139913A (zh) 2024-06-04
JPWO2024024901A1 (enExample) 2024-02-01
TW202413488A (zh) 2024-04-01
KR102693676B1 (ko) 2024-08-12
KR20240123430A (ko) 2024-08-13

Similar Documents

Publication Publication Date Title
JP7235157B1 (ja) ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体
JP7586281B2 (ja) ポリイミド前駆体組成物およびポリイミドフィルム
CN113201219B (zh) 聚酰亚胺前体组合物和聚酰亚胺膜/基材层积体
TWI775294B (zh) 聚醯亞胺前驅體組合物及聚醯亞胺膜/基材積層體
JP7722459B2 (ja) ポリイミド前駆体組成物およびポリイミドフィルム
CN118139913B (zh) 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体
CN117120515A (zh) 聚酰亚胺前体组合物和聚酰亚胺膜
JP2022127547A (ja) ポリイミド前駆体組成物およびポリイミドフィルム
TWI854552B (zh) 聚醯亞胺前驅體組合物、聚醯亞胺膜及聚醯亞胺膜/基材積層體
CN116457211B (zh) 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体
CN115551949B (zh) 聚酰亚胺前体组合物和聚酰亚胺膜/基材层积体
TWI901983B (zh) 聚醯亞胺前驅體組合物、聚醯亞胺膜及聚醯亞胺膜/基材積層體
WO2025225424A1 (ja) ポリイミド前駆体組成物およびポリイミドフィルム
WO2025197892A1 (ja) ポリイミド前駆体組成物およびポリイミドフィルム

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant