JP6444522B2 - ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法 - Google Patents

ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法 Download PDF

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JP6444522B2
JP6444522B2 JP2017541568A JP2017541568A JP6444522B2 JP 6444522 B2 JP6444522 B2 JP 6444522B2 JP 2017541568 A JP2017541568 A JP 2017541568A JP 2017541568 A JP2017541568 A JP 2017541568A JP 6444522 B2 JP6444522 B2 JP 6444522B2
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polyimide
carbon atoms
general formula
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JPWO2017051827A1 (ja
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昌樹 米谷
昌樹 米谷
建樹 清水
建樹 清水
隆行 金田
隆行 金田
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Asahi Kasei Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2017541568A 2015-09-24 2016-09-21 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法 Active JP6444522B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2015186730 2015-09-24
JP2015186730 2015-09-24
JP2015218783 2015-11-06
JP2015218783 2015-11-06
JP2016055476 2016-03-18
JP2016055476 2016-03-18
JP2016124849 2016-06-23
JP2016124849 2016-06-23
PCT/JP2016/077878 WO2017051827A1 (ja) 2015-09-24 2016-09-21 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法

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JPWO2017051827A1 JPWO2017051827A1 (ja) 2018-03-22
JP6444522B2 true JP6444522B2 (ja) 2018-12-26

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JP2018221482A Active JP6725626B2 (ja) 2015-09-24 2018-11-27 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
JP2020109828A Active JP7095024B2 (ja) 2015-09-24 2020-06-25 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
JP2022100555A Active JP7383764B2 (ja) 2015-09-24 2022-06-22 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
JP2023190850A Pending JP2024023254A (ja) 2015-09-24 2023-11-08 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法

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JP2020109828A Active JP7095024B2 (ja) 2015-09-24 2020-06-25 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
JP2022100555A Active JP7383764B2 (ja) 2015-09-24 2022-06-22 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
JP2023190850A Pending JP2024023254A (ja) 2015-09-24 2023-11-08 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法

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JP (5) JP6444522B2 (enExample)
KR (3) KR102460768B1 (enExample)
CN (2) CN108026273B (enExample)
TW (2) TWI641632B (enExample)
WO (1) WO2017051827A1 (enExample)

Cited By (3)

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WO2021210641A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
WO2021210640A1 (ja) * 2020-04-16 2021-10-21 三菱瓦斯化学株式会社 イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
JP7235157B1 (ja) 2022-07-29 2023-03-08 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体

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WO2018139311A1 (ja) * 2017-01-27 2018-08-02 ウィンゴーテクノロジー株式会社 ジアミン化合物、並びにそれを用いたポリイミド化合物および成形物
JP7189619B2 (ja) * 2017-04-07 2022-12-14 株式会社アイ．エス．テイ ポリイミド膜
CN112004858B (zh) 2018-03-30 2023-06-30 株式会社钟化 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体及柔性装置、以及聚酰亚胺膜的制造方法
KR102516144B1 (ko) * 2018-08-28 2023-03-29 주식회사 엘지화학 투명 필름 제조용 용매의 전처리 방법
JP7041662B2 (ja) * 2018-12-20 2022-03-24 コーロン インダストリーズ インク ポリアミック酸、ポリイミド樹脂及びポリイミドフィルム
WO2020159193A1 (ko) * 2019-02-01 2020-08-06 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이로부터 제조된 폴리이미드 필름, 디스플레이 장치용 기판, 및 광학 장치
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JPWO2020195819A1 (enExample) * 2019-03-26 2020-10-01
JP7349253B2 (ja) * 2019-03-29 2023-09-22 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
WO2021028960A1 (ja) * 2019-08-09 2021-02-18 太陽ホールディングス株式会社 着色樹脂組成物、硬化物および積層体
KR20220056861A (ko) * 2019-10-03 2022-05-06 미쓰이 가가쿠 가부시키가이샤 폴리이미드 필름, 폴리아마이드산 및 이것을 포함하는 바니시, 및 폴리이미드 적층체 및 그 제조 방법
JP7365940B2 (ja) * 2020-03-05 2023-10-20 東京応化工業株式会社 ワニス組成物、及びポリイミド樹脂の製造方法
JP7757955B2 (ja) 2020-03-27 2025-10-22 三菱瓦斯化学株式会社 ポリイミドフィルム及び積層体
JP7576926B2 (ja) * 2020-04-24 2024-11-01 旭化成株式会社 ジアミン化合物及びその製造方法
JP2021175790A (ja) * 2020-04-24 2021-11-04 旭化成株式会社 ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
JP7483480B2 (ja) * 2020-04-24 2024-05-15 旭化成株式会社 ポリイミド前駆体、ポリイミド樹脂組成物、並びにポリイミド樹脂フィルム及びその製造方法
CN111533909B (zh) * 2020-06-08 2023-04-25 武汉柔显科技股份有限公司 一种聚酰胺酰亚胺、聚酰胺酰亚胺薄膜及显示装置
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JPWO2022071443A1 (enExample) * 2020-09-30 2022-04-07
CN112225897A (zh) * 2020-10-19 2021-01-15 深圳市道尔顿电子材料有限公司 含芳香酯结构的三氟甲基取代芳香二胺化合物及其制备方法
WO2022085620A1 (ja) * 2020-10-22 2022-04-28 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体、電子デバイス、及びポリイミド膜の製造方法
CN112175186B (zh) * 2020-10-29 2022-12-20 深圳市道尔顿电子材料有限公司 聚酰亚胺材料及其制备方法、聚酰亚胺薄膜及其制备方法
US12382822B2 (en) 2020-11-19 2025-08-05 Lg Chem, Ltd. Substrate for display device or flexible display device, and display device or flexible display device using the same
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WO2022211086A1 (ja) * 2021-04-02 2022-10-06 旭化成株式会社 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
CN113292726B (zh) * 2021-04-10 2023-03-24 常州市尚科新材料有限公司 聚酰亚胺模塑粉及其制备方法和应用
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TWI869806B (zh) * 2022-03-29 2025-01-11 日商Ｕｂｅ股份有限公司 可撓性配線基板用聚醯亞胺前驅體組合物、聚醯亞胺膜及聚醯亞胺金屬積層體
JPWO2024024901A1 (enExample) * 2022-07-29 2024-02-01
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WO2025047704A1 (ja) * 2023-08-30 2025-03-06 株式会社カネカ ポリアミド酸組成物、ポリイミド、ポリイミド膜、積層体、電子デバイス、及びポリアミド酸組成物の製造方法
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