US3752956A
(en)
*
|
1972-05-03 |
1973-08-14 |
Du Pont |
Electrical resistance heating control circuit
|
DE3017749A1
(de)
|
1980-05-09 |
1981-11-12 |
Artur Dr.H.C. 7244 Waldachtal Fischer |
Befestigungsvorrichtung fuer die befestigung von sanitaergegenstaenden
|
US5059770A
(en)
*
|
1989-09-19 |
1991-10-22 |
Watkins-Johnson Company |
Multi-zone planar heater assembly and method of operation
|
US6998065B1
(en)
*
|
1989-12-28 |
2006-02-14 |
Nippon Mitsubishi Oil Corporation |
Fluid compositions containing refrigerator oils and chlorine-free fluorocarbon refrigerants
|
US5447570A
(en)
|
1990-04-23 |
1995-09-05 |
Genus, Inc. |
Purge gas in wafer coating area selection
|
US5074456A
(en)
*
|
1990-09-18 |
1991-12-24 |
Lam Research Corporation |
Composite electrode for plasma processes
|
US5376213A
(en)
*
|
1992-07-28 |
1994-12-27 |
Tokyo Electron Limited |
Plasma processing apparatus
|
EP0635870A1
(en)
*
|
1993-07-20 |
1995-01-25 |
Applied Materials, Inc. |
An electrostatic chuck having a grooved surface
|
KR100404631B1
(ko)
|
1994-01-31 |
2004-02-05 |
어플라이드 머티어리얼스, 인코포레이티드 |
두께가일정한절연체막을갖는정전기척
|
US5583736A
(en)
*
|
1994-11-17 |
1996-12-10 |
The United States Of America As Represented By The Department Of Energy |
Micromachined silicon electrostatic chuck
|
JPH08293539A
(ja)
|
1995-04-21 |
1996-11-05 |
Hitachi Ltd |
半導体製造方法および装置
|
US5886863A
(en)
*
|
1995-05-09 |
1999-03-23 |
Kyocera Corporation |
Wafer support member
|
US5968379A
(en)
*
|
1995-07-14 |
1999-10-19 |
Applied Materials, Inc. |
High temperature ceramic heater assembly with RF capability and related methods
|
US6370007B2
(en)
*
|
1995-09-20 |
2002-04-09 |
Hitachi, Ltd. |
Electrostatic chuck
|
US5781400A
(en)
*
|
1995-09-20 |
1998-07-14 |
Hitachi, Ltd. |
Electrostatically attracting electrode and a method of manufacture thereof
|
US6108189A
(en)
*
|
1996-04-26 |
2000-08-22 |
Applied Materials, Inc. |
Electrostatic chuck having improved gas conduits
|
US6048798A
(en)
*
|
1996-06-05 |
2000-04-11 |
Lam Research Corporation |
Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer
|
JPH1079372A
(ja)
*
|
1996-09-03 |
1998-03-24 |
Matsushita Electric Ind Co Ltd |
プラズマ処理方法及びプラズマ処理装置
|
US6395363B1
(en)
|
1996-11-05 |
2002-05-28 |
Applied Materials, Inc. |
Sloped substrate support
|
US6444037B1
(en)
*
|
1996-11-13 |
2002-09-03 |
Applied Materials, Inc. |
Chamber liner for high temperature processing chamber
|
US5968587A
(en)
*
|
1996-11-13 |
1999-10-19 |
Applied Materials, Inc. |
Systems and methods for controlling the temperature of a vapor deposition apparatus
|
US5800621A
(en)
*
|
1997-02-10 |
1998-09-01 |
Applied Materials, Inc. |
Plasma source for HDP-CVD chamber
|
US6616767B2
(en)
*
|
1997-02-12 |
2003-09-09 |
Applied Materials, Inc. |
High temperature ceramic heater assembly with RF capability
|
US6035101A
(en)
*
|
1997-02-12 |
2000-03-07 |
Applied Materials, Inc. |
High temperature multi-layered alloy heater assembly and related methods
|
US6189483B1
(en)
|
1997-05-29 |
2001-02-20 |
Applied Materials, Inc. |
Process kit
|
US5978202A
(en)
*
|
1997-06-27 |
1999-11-02 |
Applied Materials, Inc. |
Electrostatic chuck having a thermal transfer regulator pad
|
US6176932B1
(en)
*
|
1998-02-16 |
2001-01-23 |
Anelva Corporation |
Thin film deposition apparatus
|
US6073577A
(en)
|
1998-06-30 |
2000-06-13 |
Lam Research Corporation |
Electrode for plasma processes and method for manufacture and use thereof
|
JP4053148B2
(ja)
|
1998-07-28 |
2008-02-27 |
株式会社エフオーアイ |
プラズマ処理装置
|
US6639783B1
(en)
*
|
1998-09-08 |
2003-10-28 |
Applied Materials, Inc. |
Multi-layer ceramic electrostatic chuck with integrated channel
|
TW517092B
(en)
*
|
1999-03-17 |
2003-01-11 |
Kobe Steel Ltd |
High-temperature and high-pressure treatment device
|
JP2000323558A
(ja)
*
|
1999-05-07 |
2000-11-24 |
Nikon Corp |
静電吸着装置
|
US6462928B1
(en)
*
|
1999-05-07 |
2002-10-08 |
Applied Materials, Inc. |
Electrostatic chuck having improved electrical connector and method
|
US6310755B1
(en)
*
|
1999-05-07 |
2001-10-30 |
Applied Materials, Inc. |
Electrostatic chuck having gas cavity and method
|
US20020036881A1
(en)
*
|
1999-05-07 |
2002-03-28 |
Shamouil Shamouilian |
Electrostatic chuck having composite base and method
|
US6490146B2
(en)
*
|
1999-05-07 |
2002-12-03 |
Applied Materials Inc. |
Electrostatic chuck bonded to base with a bond layer and method
|
KR20010007406A
(ko)
*
|
1999-06-17 |
2001-01-26 |
조셉 제이. 스위니 |
정전 처크에 의해 발생한 정전력 균형을 맞추는 방법 및장치
|
US6228438B1
(en)
*
|
1999-08-10 |
2001-05-08 |
Unakis Balzers Aktiengesellschaft |
Plasma reactor for the treatment of large size substrates
|
US6839217B1
(en)
*
|
1999-10-01 |
2005-01-04 |
Varian Semiconductor Equipment Associates, Inc. |
Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure
|
US6170432B1
(en)
*
|
2000-01-24 |
2001-01-09 |
M.E.C. Technology, Inc. |
Showerhead electrode assembly for plasma processing
|
JP4522527B2
(ja)
*
|
2000-03-06 |
2010-08-11 |
キヤノンアネルバ株式会社 |
半導体製造装置における基板搭載方法
|
JP5165817B2
(ja)
*
|
2000-03-31 |
2013-03-21 |
ラム リサーチ コーポレーション |
静電チャック及びその製造方法
|
US6306247B1
(en)
*
|
2000-04-19 |
2001-10-23 |
Taiwan Semiconductor Manufacturing Company, Ltd |
Apparatus and method for preventing etch chamber contamination
|
JP4592916B2
(ja)
*
|
2000-04-25 |
2010-12-08 |
東京エレクトロン株式会社 |
被処理体の載置装置
|
US6922324B1
(en)
*
|
2000-07-10 |
2005-07-26 |
Christopher M. Horwitz |
Remote powering of electrostatic chucks
|
US6475336B1
(en)
*
|
2000-10-06 |
2002-11-05 |
Lam Research Corporation |
Electrostatically clamped edge ring for plasma processing
|
JP4868649B2
(ja)
|
2001-03-29 |
2012-02-01 |
ラム リサーチ コーポレーション |
プラズマ処理装置
|
US6693790B2
(en)
*
|
2001-04-12 |
2004-02-17 |
Komatsu, Ltd. |
Static electricity chuck apparatus and semiconductor producing apparatus provided with the static electricity chuck apparatus
|
US6847014B1
(en)
*
|
2001-04-30 |
2005-01-25 |
Lam Research Corporation |
Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
|
WO2002089531A1
(en)
*
|
2001-04-30 |
2002-11-07 |
Lam Research, Corporation |
Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
|
US20050211385A1
(en)
*
|
2001-04-30 |
2005-09-29 |
Lam Research Corporation, A Delaware Corporation |
Method and apparatus for controlling spatial temperature distribution
|
JP3810300B2
(ja)
*
|
2001-10-30 |
2006-08-16 |
京セラ株式会社 |
静電チャック
|
US6538872B1
(en)
*
|
2001-11-05 |
2003-03-25 |
Applied Materials, Inc. |
Electrostatic chuck having heater and method
|
WO2003047312A1
(fr)
*
|
2001-11-30 |
2003-06-05 |
Ibiden Co., Ltd. |
Dispositif chauffant en ceramique
|
US6754062B2
(en)
*
|
2002-02-27 |
2004-06-22 |
Praxair S.T. Technology, Inc. |
Hybrid ceramic electrostatic clamp
|
US6646233B2
(en)
*
|
2002-03-05 |
2003-11-11 |
Hitachi High-Technologies Corporation |
Wafer stage for wafer processing apparatus and wafer processing method
|
US6921724B2
(en)
*
|
2002-04-02 |
2005-07-26 |
Lam Research Corporation |
Variable temperature processes for tunable electrostatic chuck
|
US6682603B2
(en)
*
|
2002-05-07 |
2004-01-27 |
Applied Materials Inc. |
Substrate support with extended radio frequency electrode upper surface
|
US20040045813A1
(en)
*
|
2002-09-03 |
2004-03-11 |
Seiichiro Kanno |
Wafer processing apparatus, wafer stage, and wafer processing method
|
US20040231798A1
(en)
*
|
2002-09-13 |
2004-11-25 |
Applied Materials, Inc. |
Gas delivery system for semiconductor processing
|
US7147749B2
(en)
*
|
2002-09-30 |
2006-12-12 |
Tokyo Electron Limited |
Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
|
US7850174B2
(en)
|
2003-01-07 |
2010-12-14 |
Tokyo Electron Limited |
Plasma processing apparatus and focus ring
|
US7361865B2
(en)
*
|
2003-08-27 |
2008-04-22 |
Kyocera Corporation |
Heater for heating a wafer and method for fabricating the same
|
US20050079729A1
(en)
*
|
2003-10-08 |
2005-04-14 |
Woo-Sung Jang |
High density plasma oxide film deposition apparatus having a guide ring and a semiconductor device manufacturing method using the same
|
KR100505035B1
(ko)
|
2003-11-17 |
2005-07-29 |
삼성전자주식회사 |
기판을 지지하기 위한 정전척
|
US7196295B2
(en)
*
|
2003-11-21 |
2007-03-27 |
Watlow Electric Manufacturing Company |
Two-wire layered heater system
|
KR100808349B1
(ko)
*
|
2003-11-21 |
2008-02-27 |
다이킨 고교 가부시키가이샤 |
밀봉재, 그의 제조방법 및 그를 갖는 액정·반도체 제조 장치
|
US8680443B2
(en)
*
|
2004-01-06 |
2014-03-25 |
Watlow Electric Manufacturing Company |
Combined material layering technologies for electric heaters
|
US7697260B2
(en)
*
|
2004-03-31 |
2010-04-13 |
Applied Materials, Inc. |
Detachable electrostatic chuck
|
KR101098798B1
(ko)
*
|
2004-05-26 |
2011-12-26 |
쿄세라 코포레이션 |
히터와 웨이퍼 가열장치 및 히터의 제조방법
|
CN100470756C
(zh)
*
|
2004-06-28 |
2009-03-18 |
京瓷株式会社 |
静电卡盘
|
TWI281833B
(en)
*
|
2004-10-28 |
2007-05-21 |
Kyocera Corp |
Heater, wafer heating apparatus and method for manufacturing heater
|
US7052553B1
(en)
*
|
2004-12-01 |
2006-05-30 |
Lam Research Corporation |
Wet cleaning of electrostatic chucks
|
US20060273277A1
(en)
*
|
2005-06-02 |
2006-12-07 |
Heller Mark J |
Plasma resistant seal assembly with replaceable barrier shield
|
SG163536A1
(en)
*
|
2005-06-29 |
2010-08-30 |
Watlow Electric Mfg |
Smart layered heater surfaces
|
US7431788B2
(en)
*
|
2005-07-19 |
2008-10-07 |
Lam Research Corporation |
Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
|
US7525787B2
(en)
*
|
2005-09-30 |
2009-04-28 |
Lam Research Corporation |
Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
|
US7869184B2
(en)
*
|
2005-11-30 |
2011-01-11 |
Lam Research Corporation |
Method of determining a target mesa configuration of an electrostatic chuck
|
JP2007311613A
(ja)
*
|
2006-05-19 |
2007-11-29 |
Hitachi High-Technologies Corp |
試料台及びそれを備えたプラズマ処理装置
|
JP5183058B2
(ja)
*
|
2006-07-20 |
2013-04-17 |
アプライド マテリアルズ インコーポレイテッド |
急速温度勾配コントロールによる基板処理
|
US9275887B2
(en)
|
2006-07-20 |
2016-03-01 |
Applied Materials, Inc. |
Substrate processing with rapid temperature gradient control
|
US20080041312A1
(en)
*
|
2006-08-10 |
2008-02-21 |
Shoichiro Matsuyama |
Stage for plasma processing apparatus, and plasma processing apparatus
|
JP4943086B2
(ja)
*
|
2006-08-10 |
2012-05-30 |
東京エレクトロン株式会社 |
静電チャック装置及びプラズマ処理装置
|
JP5233093B2
(ja)
*
|
2006-08-10 |
2013-07-10 |
東京エレクトロン株式会社 |
プラズマ処理装置用の載置台及びプラズマ処理装置
|
US7589950B2
(en)
*
|
2006-10-13 |
2009-09-15 |
Applied Materials, Inc. |
Detachable electrostatic chuck having sealing assembly
|
US8398778B2
(en)
|
2007-01-26 |
2013-03-19 |
Lam Research Corporation |
Control of bevel etch film profile using plasma exclusion zone rings larger than the wafer diameter
|
JP5029089B2
(ja)
*
|
2007-03-26 |
2012-09-19 |
東京エレクトロン株式会社 |
プラズマ処理装置用の載置台及びプラズマ処理装置
|
US8108981B2
(en)
|
2007-07-31 |
2012-02-07 |
Applied Materials, Inc. |
Method of making an electrostatic chuck with reduced plasma penetration and arcing
|
JP2009054871A
(ja)
|
2007-08-28 |
2009-03-12 |
Tokyo Electron Ltd |
載置台構造及び処理装置
|
TWI459851B
(zh)
*
|
2007-09-10 |
2014-11-01 |
Ngk Insulators Ltd |
heating equipment
|
JP4905375B2
(ja)
|
2008-01-30 |
2012-03-28 |
住友電気工業株式会社 |
ウエハ保持体の支持構造
|
JP5284153B2
(ja)
*
|
2008-03-21 |
2013-09-11 |
日本碍子株式会社 |
セラミックスヒータ
|
JP5324251B2
(ja)
*
|
2008-05-16 |
2013-10-23 |
キヤノンアネルバ株式会社 |
基板保持装置
|
US8161906B2
(en)
|
2008-07-07 |
2012-04-24 |
Lam Research Corporation |
Clamped showerhead electrode assembly
|
CN102160167B
(zh)
*
|
2008-08-12 |
2013-12-04 |
应用材料公司 |
静电吸盘组件
|
JP2010080717A
(ja)
*
|
2008-09-26 |
2010-04-08 |
Tokyo Electron Ltd |
プラズマ処理装置用の載置台
|
KR101413764B1
(ko)
|
2008-10-22 |
2014-07-02 |
주식회사 뉴파워 프라즈마 |
서셉터 어셈블리
|
US9218997B2
(en)
|
2008-11-06 |
2015-12-22 |
Applied Materials, Inc. |
Electrostatic chuck having reduced arcing
|
JP2010153730A
(ja)
*
|
2008-12-26 |
2010-07-08 |
Omron Corp |
配線構造、ヒータ駆動装置、計測装置および制御システム
|
JP5262878B2
(ja)
|
2009-03-17 |
2013-08-14 |
東京エレクトロン株式会社 |
載置台構造及びプラズマ成膜装置
|
US8637794B2
(en)
*
|
2009-10-21 |
2014-01-28 |
Lam Research Corporation |
Heating plate with planar heating zones for semiconductor processing
|
US8270141B2
(en)
|
2009-11-20 |
2012-09-18 |
Applied Materials, Inc. |
Electrostatic chuck with reduced arcing
|
JP5218865B2
(ja)
*
|
2010-03-26 |
2013-06-26 |
Toto株式会社 |
静電チャック
|
US8791392B2
(en)
*
|
2010-10-22 |
2014-07-29 |
Lam Research Corporation |
Methods of fault detection for multiplexed heater array
|
WO2012056807A1
(ja)
*
|
2010-10-25 |
2012-05-03 |
日本碍子株式会社 |
セラミックス材料、積層体、半導体製造装置用部材及びスパッタリングターゲット部材
|
WO2012056808A1
(ja)
*
|
2010-10-25 |
2012-05-03 |
日本碍子株式会社 |
セラミックス材料、半導体製造装置用部材、スパッタリングターゲット部材及びセラミックス材料の製造方法
|
US8546732B2
(en)
*
|
2010-11-10 |
2013-10-01 |
Lam Research Corporation |
Heating plate with planar heater zones for semiconductor processing
|
US20120164834A1
(en)
*
|
2010-12-22 |
2012-06-28 |
Kevin Jennings |
Variable-Density Plasma Processing of Semiconductor Substrates
|
WO2012090782A1
(ja)
|
2010-12-27 |
2012-07-05 |
株式会社クリエイティブ テクノロジー |
ワーク加熱装置及びワーク処理装置
|
JP5339162B2
(ja)
*
|
2011-03-30 |
2013-11-13 |
Toto株式会社 |
静電チャック
|
US8901459B2
(en)
*
|
2011-06-30 |
2014-12-02 |
Semes Co. Ltd. |
Substrate supporting units and substrate treating apparatuses including the same
|
US8520360B2
(en)
*
|
2011-07-19 |
2013-08-27 |
Lam Research Corporation |
Electrostatic chuck with wafer backside plasma assisted dechuck
|
CN103999545B
(zh)
*
|
2011-08-30 |
2018-02-06 |
沃特洛电气制造公司 |
制造高清晰度加热器系统的方法
|
US10388493B2
(en)
|
2011-09-16 |
2019-08-20 |
Lam Research Corporation |
Component of a substrate support assembly producing localized magnetic fields
|
US8624168B2
(en)
*
|
2011-09-20 |
2014-01-07 |
Lam Research Corporation |
Heating plate with diode planar heater zones for semiconductor processing
|
US9869392B2
(en)
*
|
2011-10-20 |
2018-01-16 |
Lam Research Corporation |
Edge seal for lower electrode assembly
|
US9076831B2
(en)
*
|
2011-11-04 |
2015-07-07 |
Lam Research Corporation |
Substrate clamping system and method for operating the same
|
CN103123906A
(zh)
*
|
2011-11-18 |
2013-05-29 |
中芯国际集成电路制造(北京)有限公司 |
用于处理晶圆的反应装置、静电吸盘和晶圆温度控制方法
|
US9083182B2
(en)
*
|
2011-11-21 |
2015-07-14 |
Lam Research Corporation |
Bypass capacitors for high voltage bias power in the mid frequency RF range
|
WO2013111363A1
(ja)
*
|
2012-01-26 |
2013-08-01 |
京セラ株式会社 |
静電チャック
|
TWI579956B
(zh)
*
|
2012-02-08 |
2017-04-21 |
東京威力科創股份有限公司 |
靜電吸盤裝置
|
JP5823915B2
(ja)
*
|
2012-05-29 |
2015-11-25 |
新光電気工業株式会社 |
静電チャックの製造方法
|
JP5441019B1
(ja)
*
|
2012-08-29 |
2014-03-12 |
Toto株式会社 |
静電チャック
|
JP5633766B2
(ja)
*
|
2013-03-29 |
2014-12-03 |
Toto株式会社 |
静電チャック
|
US20140356985A1
(en)
*
|
2013-06-03 |
2014-12-04 |
Lam Research Corporation |
Temperature controlled substrate support assembly
|
US10211046B2
(en)
|
2013-07-19 |
2019-02-19 |
Applied Materials, Inc. |
Substrate support ring for more uniform layer thickness
|
US11158526B2
(en)
*
|
2014-02-07 |
2021-10-26 |
Applied Materials, Inc. |
Temperature controlled substrate support assembly
|
JP6432474B2
(ja)
|
2014-03-27 |
2018-12-05 |
Toto株式会社 |
静電チャック
|
JP6442296B2
(ja)
*
|
2014-06-24 |
2018-12-19 |
東京エレクトロン株式会社 |
載置台及びプラズマ処理装置
|
JP6375163B2
(ja)
|
2014-07-11 |
2018-08-15 |
東京エレクトロン株式会社 |
プラズマ処理装置および上部電極アセンブリ
|
JP6435247B2
(ja)
|
2015-09-03 |
2018-12-05 |
新光電気工業株式会社 |
静電チャック装置及び静電チャック装置の製造方法
|
US10340171B2
(en)
*
|
2016-05-18 |
2019-07-02 |
Lam Research Corporation |
Permanent secondary erosion containment for electrostatic chuck bonds
|
US11069553B2
(en)
*
|
2016-07-07 |
2021-07-20 |
Lam Research Corporation |
Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
|
US10741425B2
(en)
*
|
2017-02-22 |
2020-08-11 |
Lam Research Corporation |
Helium plug design to reduce arcing
|