CN107591355A - 具有防止电弧和点火并改善工艺均匀性的特征的静电卡盘 - Google Patents
具有防止电弧和点火并改善工艺均匀性的特征的静电卡盘 Download PDFInfo
- Publication number
- CN107591355A CN107591355A CN201710544961.2A CN201710544961A CN107591355A CN 107591355 A CN107591355 A CN 107591355A CN 201710544961 A CN201710544961 A CN 201710544961A CN 107591355 A CN107591355 A CN 107591355A
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- substrate support
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662359405P | 2016-07-07 | 2016-07-07 | |
US62/359,405 | 2016-07-07 | ||
US15/634,365 | 2017-06-27 | ||
US15/634,365 US11069553B2 (en) | 2016-07-07 | 2017-06-27 | Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107591355A true CN107591355A (zh) | 2018-01-16 |
CN107591355B CN107591355B (zh) | 2023-09-08 |
Family
ID=60911098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710544961.2A Active CN107591355B (zh) | 2016-07-07 | 2017-07-06 | 具有防止电弧和点火并改善工艺均匀性的特征的静电卡盘 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11069553B2 (zh) |
JP (1) | JP7062383B2 (zh) |
KR (1) | KR102454532B1 (zh) |
CN (1) | CN107591355B (zh) |
TW (1) | TWI752051B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108649012A (zh) * | 2018-05-11 | 2018-10-12 | 北京华卓精科科技股份有限公司 | 新型陶瓷塞及具有该新型陶瓷塞的静电卡盘装置 |
CN111261487A (zh) * | 2018-12-03 | 2020-06-09 | 应用材料公司 | 具有改进的吸紧和电弧放电性能的静电吸盘设计 |
CN111627790A (zh) * | 2019-02-27 | 2020-09-04 | Toto株式会社 | 半导体制造装置构件、半导体制造装置、显示器制造装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US10340171B2 (en) | 2016-05-18 | 2019-07-02 | Lam Research Corporation | Permanent secondary erosion containment for electrostatic chuck bonds |
US11069553B2 (en) * | 2016-07-07 | 2021-07-20 | Lam Research Corporation | Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity |
US10910195B2 (en) | 2017-01-05 | 2021-02-02 | Lam Research Corporation | Substrate support with improved process uniformity |
CN112166496B (zh) * | 2018-05-28 | 2024-05-03 | 日本特殊陶业株式会社 | 保持装置及保持装置的制造方法 |
US12027406B2 (en) * | 2018-05-28 | 2024-07-02 | Niterra Co., Ltd. | Method for manufacturing holding device and holding device |
US11133211B2 (en) * | 2018-08-22 | 2021-09-28 | Lam Research Corporation | Ceramic baseplate with channels having non-square corners |
JP6801773B2 (ja) * | 2019-02-27 | 2020-12-16 | Toto株式会社 | 半導体製造装置用部材および半導体製造装置用部材を備えた半導体製造装置並びにディスプレイ製造装置 |
US20230105556A1 (en) * | 2020-03-13 | 2023-04-06 | Lam Research Corporation | Substrate supports including bonding layers with stud arrays for substrate processing systems |
KR20230004790A (ko) * | 2020-04-29 | 2023-01-06 | 어플라이드 머티어리얼스, 인코포레이티드 | 균일성 개선을 위한 히터 커버 플레이트 |
CN115151105B (zh) * | 2022-07-13 | 2024-07-30 | 业成科技(成都)有限公司 | 贴合治具 |
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KR102454532B1 (ko) | 2022-10-13 |
KR102454532B9 (ko) | 2023-03-13 |
US11069553B2 (en) | 2021-07-20 |
JP2018014492A (ja) | 2018-01-25 |
TWI752051B (zh) | 2022-01-11 |
JP7062383B2 (ja) | 2022-05-06 |
CN107591355B (zh) | 2023-09-08 |
KR20180006307A (ko) | 2018-01-17 |
TW201812982A (zh) | 2018-04-01 |
US20180012785A1 (en) | 2018-01-11 |
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