SG10201702287RA - Plasma Processing Method - Google Patents

Plasma Processing Method

Info

Publication number
SG10201702287RA
SG10201702287RA SG10201702287RA SG10201702287RA SG10201702287RA SG 10201702287R A SG10201702287R A SG 10201702287RA SG 10201702287R A SG10201702287R A SG 10201702287RA SG 10201702287R A SG10201702287R A SG 10201702287RA SG 10201702287R A SG10201702287R A SG 10201702287RA
Authority
SG
Singapore
Prior art keywords
processing method
plasma processing
plasma
processing
Prior art date
Application number
SG10201702287RA
Inventor
Kumiko Ono
Hiroshi Tsujimoto
Koichi Nagami
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201702287RA publication Critical patent/SG10201702287RA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32174Circuits specially adapted for controlling the RF discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32091Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32137Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32155Frequency modulation
    • H01J37/32165Plural frequencies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32174Circuits specially adapted for controlling the RF discharge
    • H01J37/32183Matching circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • H01J37/32449Gas control, e.g. control of the gas flow
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32577Electrical connecting means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/0228Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
SG10201702287RA 2016-03-22 2017-03-21 Plasma Processing Method SG10201702287RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016057010A JP6541596B2 (en) 2016-03-22 2016-03-22 Plasma treatment method

Publications (1)

Publication Number Publication Date
SG10201702287RA true SG10201702287RA (en) 2017-10-30

Family

ID=59899045

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201702287RA SG10201702287RA (en) 2016-03-22 2017-03-21 Plasma Processing Method

Country Status (6)

Country Link
US (2) US9960016B2 (en)
JP (1) JP6541596B2 (en)
KR (1) KR102223327B1 (en)
CN (1) CN107221486B (en)
SG (1) SG10201702287RA (en)
TW (1) TWI718272B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019186098A (en) * 2018-04-12 2019-10-24 東京エレクトロン株式会社 Method of generating plasma
CN113272939B (en) * 2019-12-17 2023-11-14 株式会社日立高新技术 Plasma processing apparatus and method of operating the same
JP2023019285A (en) 2021-07-29 2023-02-09 三井・ケマーズ フロロプロダクツ株式会社 Fluorine-based solvent composition

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030000471A1 (en) * 2001-06-18 2003-01-02 Soo-Sik Yoon Method and apparatus for manufacturing semiconductor devices
JP4763235B2 (en) * 2001-08-29 2011-08-31 東京エレクトロン株式会社 Apparatus and method for plasma processing
US20070066038A1 (en) * 2004-04-30 2007-03-22 Lam Research Corporation Fast gas switching plasma processing apparatus
JP2008118017A (en) * 2006-11-07 2008-05-22 Hitachi High-Technologies Corp Method of plasma treatment and treatment apparatus
CN102446739B (en) * 2008-03-21 2016-01-20 应用材料公司 The method and apparatus of substrate etching system and processing procedure
US20130048082A1 (en) * 2011-08-22 2013-02-28 Mirzafer Abatchev System, method and apparatus for real time control of rapid alternating processes (rap)
JP5847496B2 (en) * 2011-09-01 2016-01-20 株式会社日立国際電気 Plasma generation power supply apparatus and plasma generation parameter setting method
US9772629B2 (en) * 2011-09-29 2017-09-26 Applied Materials, Inc. Methods for monitoring a flow controller coupled to a process chamber
JP5935116B2 (en) * 2011-12-16 2016-06-15 東京エレクトロン株式会社 Plasma processing equipment
KR102168064B1 (en) * 2013-02-20 2020-10-20 도쿄엘렉트론가부시키가이샤 Plasma processing apparatus and plasma processing method
TWI593015B (en) * 2014-07-10 2017-07-21 東京威力科創股份有限公司 Methods for high precision etching of substrates
JP6316735B2 (en) * 2014-12-04 2018-04-25 東京エレクトロン株式会社 Plasma etching method

Also Published As

Publication number Publication date
CN107221486A (en) 2017-09-29
CN107221486B (en) 2019-05-07
JP2017174890A (en) 2017-09-28
US9960016B2 (en) 2018-05-01
TW201737393A (en) 2017-10-16
KR102223327B1 (en) 2021-03-05
US20180218882A1 (en) 2018-08-02
US10269539B2 (en) 2019-04-23
JP6541596B2 (en) 2019-07-10
KR20170110035A (en) 2017-10-10
TWI718272B (en) 2021-02-11
US20170278675A1 (en) 2017-09-28

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