KR102454532B1 - 전기적 아크 및 발광을 방지하고 프로세스 균일도를 개선하기 위한 피처들을 갖는 정전 척 - Google Patents

전기적 아크 및 발광을 방지하고 프로세스 균일도를 개선하기 위한 피처들을 갖는 정전 척 Download PDF

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KR102454532B1
KR102454532B1 KR1020170083390A KR20170083390A KR102454532B1 KR 102454532 B1 KR102454532 B1 KR 102454532B1 KR 1020170083390 A KR1020170083390 A KR 1020170083390A KR 20170083390 A KR20170083390 A KR 20170083390A KR 102454532 B1 KR102454532 B1 KR 102454532B1
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ceramic layer
layer
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KR102454532B9 (ko
KR20180006307A (ko
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알렉산더 마튜슈킨
존 패트릭 홀란드
하르미트 싱
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020170083390A 2016-07-07 2017-06-30 전기적 아크 및 발광을 방지하고 프로세스 균일도를 개선하기 위한 피처들을 갖는 정전 척 Active KR102454532B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662359405P 2016-07-07 2016-07-07
US62/359,405 2016-07-07
US15/634,365 2017-06-27
US15/634,365 US11069553B2 (en) 2016-07-07 2017-06-27 Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity

Publications (3)

Publication Number Publication Date
KR20180006307A KR20180006307A (ko) 2018-01-17
KR102454532B1 true KR102454532B1 (ko) 2022-10-13
KR102454532B9 KR102454532B9 (ko) 2023-03-13

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Country Status (5)

Country Link
US (1) US11069553B2 (enExample)
JP (1) JP7062383B2 (enExample)
KR (1) KR102454532B1 (enExample)
CN (1) CN107591355B (enExample)
TW (1) TWI752051B (enExample)

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US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
CN108649012B (zh) * 2018-05-11 2021-10-01 北京华卓精科科技股份有限公司 新型陶瓷塞及具有该新型陶瓷塞的静电卡盘装置
US12027406B2 (en) * 2018-05-28 2024-07-02 Niterra Co., Ltd. Method for manufacturing holding device and holding device
US11784067B2 (en) * 2018-05-28 2023-10-10 Niterra Co., Ltd. Holding device and method for manufacturing holding device
US11133211B2 (en) * 2018-08-22 2021-09-28 Lam Research Corporation Ceramic baseplate with channels having non-square corners
US12443019B2 (en) 2018-11-30 2025-10-14 Sony Group Corporation Display device
JP7541005B2 (ja) 2018-12-03 2024-08-27 アプライド マテリアルズ インコーポレイテッド チャックとアーク放電に関する性能が改良された静電チャック設計
CN111627790B (zh) 2019-02-27 2024-05-03 Toto株式会社 半导体制造装置构件、半导体制造装置、显示器制造装置
JP6801773B2 (ja) * 2019-02-27 2020-12-16 Toto株式会社 半導体製造装置用部材および半導体製造装置用部材を備えた半導体製造装置並びにディスプレイ製造装置
WO2020185467A1 (en) * 2019-03-08 2020-09-17 Lam Research Corporation Chuck for plasma processing chamber
US20230105556A1 (en) * 2020-03-13 2023-04-06 Lam Research Corporation Substrate supports including bonding layers with stud arrays for substrate processing systems
KR102817778B1 (ko) 2020-04-29 2025-06-05 어플라이드 머티어리얼스, 인코포레이티드 균일성 개선을 위한 히터 커버 플레이트
CN115151105B (zh) * 2022-07-13 2024-07-30 业成科技（成都）有限公司 贴合治具

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