CN107591355B - 具有防止电弧和点火并改善工艺均匀性的特征的静电卡盘 - Google Patents

具有防止电弧和点火并改善工艺均匀性的特征的静电卡盘 Download PDF

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Publication number
CN107591355B
CN107591355B CN201710544961.2A CN201710544961A CN107591355B CN 107591355 B CN107591355 B CN 107591355B CN 201710544961 A CN201710544961 A CN 201710544961A CN 107591355 B CN107591355 B CN 107591355B
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region
thickness
substrate
ceramic
substrate support
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CN107591355A (zh
Inventor
亚历山大·马丘什金
约翰·帕特里克·霍兰德
哈梅特·辛格
阿列克谢·马拉霍塔诺夫
基思·加夫
陈志刚
费利克斯·科扎克维奇
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
CN201710544961.2A 2016-07-07 2017-07-06 具有防止电弧和点火并改善工艺均匀性的特征的静电卡盘 Active CN107591355B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662359405P 2016-07-07 2016-07-07
US62/359,405 2016-07-07
US15/634,365 2017-06-27
US15/634,365 US11069553B2 (en) 2016-07-07 2017-06-27 Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity

Publications (2)

Publication Number Publication Date
CN107591355A CN107591355A (zh) 2018-01-16
CN107591355B true CN107591355B (zh) 2023-09-08

Family

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Family Applications (1)

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CN201710544961.2A Active CN107591355B (zh) 2016-07-07 2017-07-06 具有防止电弧和点火并改善工艺均匀性的特征的静电卡盘

Country Status (5)

Country Link
US (1) US11069553B2 (enExample)
JP (1) JP7062383B2 (enExample)
KR (1) KR102454532B1 (enExample)
CN (1) CN107591355B (enExample)
TW (1) TWI752051B (enExample)

Families Citing this family (15)

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US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
CN108649012B (zh) * 2018-05-11 2021-10-01 北京华卓精科科技股份有限公司 新型陶瓷塞及具有该新型陶瓷塞的静电卡盘装置
JP6703645B2 (ja) * 2018-05-28 2020-06-03 日本特殊陶業株式会社 保持装置、および、保持装置の製造方法
KR102447586B1 (ko) * 2018-05-28 2022-09-26 니뽄 도쿠슈 도교 가부시키가이샤 유지 장치의 제조 방법, 및, 유지 장치
US11133211B2 (en) * 2018-08-22 2021-09-28 Lam Research Corporation Ceramic baseplate with channels having non-square corners
KR102752849B1 (ko) 2018-11-30 2025-01-10 소니그룹주식회사 표시 장치
JP7541005B2 (ja) * 2018-12-03 2024-08-27 アプライド マテリアルズ インコーポレイテッド チャックとアーク放電に関する性能が改良された静電チャック設計
CN111627790B (zh) 2019-02-27 2024-05-03 Toto株式会社 半导体制造装置构件、半导体制造装置、显示器制造装置
JP6801773B2 (ja) * 2019-02-27 2020-12-16 Toto株式会社 半導体製造装置用部材および半導体製造装置用部材を備えた半導体製造装置並びにディスプレイ製造装置
CN113544837A (zh) * 2019-03-08 2021-10-22 朗姆研究公司 用于等离子体处理室的卡盘
CN115280485A (zh) * 2020-03-13 2022-11-01 朗姆研究公司 包括用于衬底处理系统的间柱阵列的接合层的衬底支撑件
KR102817778B1 (ko) * 2020-04-29 2025-06-05 어플라이드 머티어리얼스, 인코포레이티드 균일성 개선을 위한 히터 커버 플레이트
CN115151105B (zh) * 2022-07-13 2024-07-30 业成科技（成都）有限公司 贴合治具

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