KR102449502B1 - 반도체 가공용 시트 - Google Patents

반도체 가공용 시트 Download PDF

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Publication number
KR102449502B1
KR102449502B1 KR1020177009887A KR20177009887A KR102449502B1 KR 102449502 B1 KR102449502 B1 KR 102449502B1 KR 1020177009887 A KR1020177009887 A KR 1020177009887A KR 20177009887 A KR20177009887 A KR 20177009887A KR 102449502 B1 KR102449502 B1 KR 102449502B1
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KR
South Korea
Prior art keywords
curable
energy ray
sheet
energy
polymer
Prior art date
Application number
KR1020177009887A
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English (en)
Korean (ko)
Other versions
KR20170131830A (ko
Inventor
시게유키 야마시타
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20170131830A publication Critical patent/KR20170131830A/ko
Application granted granted Critical
Publication of KR102449502B1 publication Critical patent/KR102449502B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
KR1020177009887A 2015-03-03 2016-02-26 반도체 가공용 시트 KR102449502B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015041818 2015-03-03
JPJP-P-2015-041818 2015-03-03
PCT/JP2016/055836 WO2016140163A1 (ja) 2015-03-03 2016-02-26 半導体加工用シート

Publications (2)

Publication Number Publication Date
KR20170131830A KR20170131830A (ko) 2017-11-30
KR102449502B1 true KR102449502B1 (ko) 2022-09-30

Family

ID=56848843

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177009887A KR102449502B1 (ko) 2015-03-03 2016-02-26 반도체 가공용 시트

Country Status (5)

Country Link
JP (1) JP6656222B2 (ja)
KR (1) KR102449502B1 (ja)
CN (1) CN107078039B (ja)
TW (1) TWI686457B (ja)
WO (1) WO2016140163A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7159633B2 (ja) * 2018-06-15 2022-10-25 昭和電工マテリアルズ株式会社 ダイシング・ダイボンディング一体型フィルム及びこれに用いる粘着フィルム
KR102417467B1 (ko) * 2019-05-10 2022-07-06 쇼와덴코머티리얼즈가부시끼가이샤 픽업성의 평가 방법, 다이싱·다이본딩 일체형 필름, 다이싱·다이본딩 일체형 필름의 평가 방법과 선별 방법, 및 반도체 장치의 제조 방법
CN113348533B (zh) * 2019-05-10 2022-06-03 昭和电工材料株式会社 拾取性的评价方法、切晶粘晶一体型膜及其评价方法及分选方法、半导体装置的制造方法
JPWO2021065070A1 (ja) * 2019-10-04 2021-04-08

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014169457A (ja) 2004-06-01 2014-09-18 Nitto Denko Corp 粘着剤組成物、粘着シート類及び表面保護フィルム
WO2015030186A1 (ja) 2013-08-30 2015-03-05 リンテック株式会社 半導体加工用シート

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4247956B2 (ja) * 2001-07-04 2009-04-02 古河電気工業株式会社 帯電防止ダイシングテープ
JP4518535B2 (ja) * 2003-07-01 2010-08-04 日東電工株式会社 ダイシング用粘着シート用粘着剤、ダイシング用粘着シート、半導体素子の製造方法、半導体素子
EP2246404A1 (en) * 2004-03-08 2010-11-03 Nitto Denko Corporation Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film
TWI388640B (zh) * 2004-06-01 2013-03-11 Nitto Denko Corp 壓敏黏合劑組成物、壓敏黏合片及表面保護膜
TWI434908B (zh) * 2007-07-17 2014-04-21 Lintec Corp An adhesive composition, an adhesive layer, and an adhesive sheet
CN102015952B (zh) * 2008-03-07 2014-04-16 3M创新有限公司 抗静电的嵌段共聚物压敏粘合剂及制品
JP2011012195A (ja) 2009-07-03 2011-01-20 Sanyo Chem Ind Ltd 帯電防止性粘着剤
TW201103885A (en) * 2009-07-22 2011-02-01 Daxon Technology Inc Antistatic ionic compound, oligomer thereof, copolymer thereof, and pressure-sensitive adhesive composition
JP5890405B2 (ja) * 2011-05-19 2016-03-22 デンカ株式会社 粘着シートおよび電子部品の製造方法
JP6181958B2 (ja) * 2013-03-28 2017-08-16 日東電工株式会社 帯電防止性粘着シート、及び、光学フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014169457A (ja) 2004-06-01 2014-09-18 Nitto Denko Corp 粘着剤組成物、粘着シート類及び表面保護フィルム
WO2015030186A1 (ja) 2013-08-30 2015-03-05 リンテック株式会社 半導体加工用シート

Also Published As

Publication number Publication date
CN107078039B (zh) 2020-11-10
TWI686457B (zh) 2020-03-01
CN107078039A (zh) 2017-08-18
WO2016140163A1 (ja) 2016-09-09
TW201704401A (zh) 2017-02-01
JPWO2016140163A1 (ja) 2017-12-14
KR20170131830A (ko) 2017-11-30
JP6656222B2 (ja) 2020-03-04

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