PH12014502606B1 - Dicing sheet - Google Patents
Dicing sheet Download PDFInfo
- Publication number
- PH12014502606B1 PH12014502606B1 PH12014502606A PH12014502606A PH12014502606B1 PH 12014502606 B1 PH12014502606 B1 PH 12014502606B1 PH 12014502606 A PH12014502606 A PH 12014502606A PH 12014502606 A PH12014502606 A PH 12014502606A PH 12014502606 B1 PH12014502606 B1 PH 12014502606B1
- Authority
- PH
- Philippines
- Prior art keywords
- pressure sensitive
- sensitive adhesive
- adhesive layer
- dicing sheet
- mass parts
- Prior art date
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 197
- 239000010410 layer Substances 0.000 claims abstract description 155
- 229920005989 resin Polymers 0.000 claims abstract description 111
- 239000011347 resin Substances 0.000 claims abstract description 111
- 150000002148 esters Chemical class 0.000 claims abstract description 103
- 229920000642 polymer Polymers 0.000 claims abstract description 89
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 77
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 60
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 59
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000004065 semiconductor Substances 0.000 claims abstract description 58
- 150000001875 compounds Chemical class 0.000 claims abstract description 54
- 239000000203 mixture Substances 0.000 claims abstract description 50
- 239000003208 petroleum Substances 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 claims abstract description 16
- 150000003384 small molecules Chemical class 0.000 claims description 62
- 239000004971 Cross linker Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 238000004132 cross linking Methods 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 5
- 150000002500 ions Chemical class 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 47
- 239000007787 solid Substances 0.000 description 36
- 239000011248 coating agent Substances 0.000 description 29
- 238000000576 coating method Methods 0.000 description 29
- -1 polybutylene terephthalate Polymers 0.000 description 29
- 239000007788 liquid Substances 0.000 description 25
- 125000000524 functional group Chemical group 0.000 description 22
- 239000000178 monomer Substances 0.000 description 15
- 239000000047 product Substances 0.000 description 15
- 230000006870 function Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
- 229920001577 copolymer Polymers 0.000 description 9
- 239000005056 polyisocyanate Substances 0.000 description 9
- 229920001228 polyisocyanate Polymers 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 239000003999 initiator Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 6
- 230000002708 enhancing effect Effects 0.000 description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 6
- 241001050985 Disco Species 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000005865 ionizing radiation Effects 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229940059574 pentaerithrityl Drugs 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 125000006841 cyclic skeleton Chemical group 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000638 stimulation Effects 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- ARUKYTASOALXFG-UHFFFAOYSA-N cycloheptylcycloheptane Chemical compound C1CCCCCC1C1CCCCCC1 ARUKYTASOALXFG-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 230000008571 general function Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2493/00—Presence of natural resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
As a dicing sheet which has a reduced possibility of occurrence of troubles in any of a dicing step, an expanding step and a picking-up step, there is provided a dicing sheet (1) comprising a base material (2) and a pressure sensitive adhesive layer (3) laminated on at least one surface of the base material (2), wherein: the pressure sensitive adhesive layer is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A), an energy ray polymerizable compound (B) and a tackifier resin (C); the tackifier resin (C) contains a polymerized rosin ester (C1) and further contains at least one of a disproportionated rosin ester (C2) and a petroleum-based resin (C3); the polymerized rosin ester (C1) contained in the pressure sensitive adhesive composition has a content of 5 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A); and the dicing sheet has a ratio of a peel strength in a state before energy ray irradiation to a peel strength in a state after the energy ray irradiation of 3 or more wherein the peel strengths are measured when a 180ø peeling test is performed in accordance with JIS Z023 7: 2000 so that an exposed surface of the pressure sensitive adhesive layer opposite to a surface facing the base material is used as a surface to be measured and a resin sealing surface of a semiconductor package is used as an adherend surface.
Description
ee —— —— EE .,. ' . polybutylene terephthalate film; polyurethane film; polyimide film; ionomer resin film; ethylene-based copolymer film such as ethylene-vinyl acetate copolymer film, ethylene-(meth)acrylic acid copolymer film and ethylene-(meth)acrylic ester copolymer film; polystyrene film; polycarbonate film; fluorine resin film; and films in which hydrogenated products and modified products of these resins are used as the main materials. There may also be used a cross-linked film and a copolymer film thereof. One type of the above base material 2 may be solely used, or a laminated film comprising a combination of two or more types thereof may also be used. The "(meth)acrylic acid" as used in the present description means both acrylic acid and methacrylic acid. The same applies to other similar terms.
The base material 2 may also contain various additives, such as pigment, fire retardant, plasticizer, antistatic, glidant and filler, in the film that contains the above resin-based material as the main material. Examples of the pigment include titanium dioxide and carbon black. Examples of the filler include organic material such as melamine resin, inorganic material such as fumed silica, and metal-based material such as nickel particle. The content of such additives is not particularly limited, but may have to be within a range in which the base material 2 exerts a desirable function and does not lose desirable flatness and/or flexibility.
When ultraviolet ray is used as an energy ray that is irradiated to harden the pressure sensitive adhesive layer 3, it is preferred that the base material 2 has transparency for the ultraviolet ray. When electron ray is used as the energy ray, it is preferred that the base material 2 has transparency for the electron ray.
It is preferred that a component having one or more types selected from the group consisting of a carboxyl group and ion and salt thereof is present at a surface of the base material 2 at the side of the pressure sensitive adhesive layer 3 (referred also to as a "base material adhering surface" hereinafter). Such a component in the base material 2 and components relating to the pressure sensitive adhesive layer 3 (there may be exemplified components that constitute the pressure sensitive adhesive layer 3 and components, such as a cross-linker, that are used when forming the pressure sensitive adhesive layer 3) may interact chemically with each other thereby to reduce the possibility of occurrence of delamination therebetween. A specific approach for
‘ . allowing such a component to be present at the base material adhering surface is not particularly limited. For example, such a specific approach may be such that the resin as a material of the base material 2 itself is constituted of a monomer which has a carboxyl group and ion and salt thereof, wherein the specific example of the base material 2 may be an ethylene-(meth) acrylic acid copolymer film, an ionomer resin film or the like. Another approach for allowing the above component to be generated at the base material adhering surface may be such that a polyolefin-based film is used as the base material 2, for example, and the side of the base material adhering surface is subjected to corona treatment and/or provided with a primer layer.
In addition, one or more types of coating films may be provided on the opposite surface of the base material 2 to the base material adhering surface.
The thickness of the base material 2 is not limited as long as the dicing sheet 1 can function appropriately in each of the previously described steps. The thickness may preferably be within a range of 20 to 450 pm, more preferably 25 to 200 um, and most preferably 50 to 150 um.
The fracture elongation of the base material 2 in the present embodiment may preferably be 100% or more as a value measured at 23°C and a relative humidity of 50%, and most preferably 200% or more and 1,000% or less. The base material 2 having a fracture elongation of 100% or more as described above is unlikely to fracture during the expanding step, and the mold chips formed by cutting the semiconductor package can be easily separated from one another. The fracture elongation as referred to herein is an elongation percentage of the length of a test piece when the test piece fractures to the original length in a tensile test in accordance with JIS K7161: 1994.
The tensile stress at a strain of 25% of the base material 2 in the present embodiment, which is measured by a test in accordance with JIS K7161: 1994, may preferably be 5 N/10 mm or more and 15 N/10 mm or less, and the maximum tensile stress may preferably be 15 MPa or more and 50 MPa or less. If the tensile stress at a strain of 25% is less than 5 N/10 mm and/or the maximum tensile stress is less than 15 MPa, then, when the dicing sheet 1 is fixed to a ring frame after a semiconductor package is applied to the dicing sheet 1, a slack may occur because the base material 2 ee ———— EEE... ‘ 4 is yielding, which may cause errors in transportation. If, on the other hand, the tensile stress at a strain of 25% exceeds 15 N/10 mm and/or the maximum tensile stress is more than 50 MPa, a problem may possibly occur such as that the dicing sheet 1 itself is released from the ring frame because the load added in the expanding step becomes large. The fracture elongation, the tensile stress at a strain of 25% and the maximum tensile stress in the present invention refer to values measured in the longitudinal direction of the base material. 2. Pressure sensitive adhesive layer
The pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment is to be formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A), an energy ray polymerizable compound (B) and a tackifier resin (C), etc. as will be described below. (1) Acrylic-based polymer (A)
The pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment contains an acrylic-based polymer (A). In the pressure sensitive adhesive layer 3 formed of this pressure sensitive adhesive composition, the acrylic-based polymer (A) may be contained as a cross-linked product obtained by a cross-linking reaction of at least a part of the acrylic-based polymer (A) and a cross-linker to be described later. In the present description, a functional group that is reactive in cross-linking with the cross-linker may also be referred to as a "reactive functional group." It may not necessarily be required that the acrylic-based polymer (A) has a reactive functional group, but the acrylic-based polymer (A) having a reactive functional group is preferable because it can form a cross-linked product with the cross-linker as described above. The type of a reactive functional group may be determined in accordance with the type of the cross-linker.
Conventionally known acrylic-based polymer may be used as the acrylic-based polymer (A). The weight-average molecular weight (Mw) of the acrylic-based polymer (A) may preferably be 10,000 or more and 2,000,000 or less, and more preferably 100,000 or more and 1,500,000 or less. The glass-transition
' temperature Tg of the acrylic-based polymer (A) may preferably be within a range of —70°C or more and 30°C or less, and further preferably —-60°C or more and 20°C or less.
The above acrylic-based polymer (A) may be a homopolymer formed of one type of acrylic-based monomer, a copolymer formed of plural types of acrylic-based monomers, or a copolymer formed of one or more types of acrylic-based monomers and monomer or monomers other than the acrylic-based monomers. Specific types of a compound to be an acrylic-based monomer are not particularly limited, and specific examples thereof include (meth)acrylic acid, (meth)acrylic ester, and derivatives thereof (such as acrylonitrile). Specific examples of the (meth)acrylic ester include: (meth)acrylate having a chain-like skeleton, such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate; (meth)acrylate having a cyclic skeleton, such as cycloalkyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyl oxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate and imide acrylate; (meth)acrylate having a hydroxyl group, such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; and (meth)acrylate having a reactive functional group other than hydroxyl group, such as glycidyl (meth)acrylate and
N-methylaminoethyl (meth)acrylate. Examples of a monomer other than the acrylic-based monomer include olefin such as ethylene and norbornene, vinyl acetate, and styrene. When the acrylic-based monomer is alkyl (meth) acrylate, it is preferred that the carbon number of the alkyl group is within a range of 1 to 18.
When the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment contains a cross-linker that is reactive in cross-linking with the acrylic-based polymer (A) as will be described later, the type of a reactive functional group possessed by the acrylic-based polymer (A) is not particularly limited, and may appropriately be determined on the basis of the type of the cross-linker and the like. For example, when the cross-linker is a polyisocyanate compound, examples of the reactive functional group possessed by the acrylic-based polymer (A) include hydroxyl group, carboxyl group and amino group. Such a polar functional group has a function of reacting with the cross-linker
' ‘ as well as an effect of improving the compatibility between the acrylic-based polymer (A) and the tackifier resin (C). When the cross-linker is a polyisocyanate compound, hydroxyl group having high reactivity with the isocyanate group may preferably be employed as the reactive functional group. A method of introducing hydroxyl group as the reactive functional group into the acrylic-based polymer (A) is not particularly limited. One example thereof may be causing the acrylic-based polymer (A) to contain in its skeleton a constitutional unit based on an acrylate having hydroxyl group, such as 2-hydroxyethyl (meth) acrylate. (2) Energy ray polymerizable compound (B)
Specific configuration of the energy ray polymerizable compound (B) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment is not particularly limited as long as the energy ray polymerizable compound (B) has an energy ray polymerizable group and is capable of polymerization reaction when irradiated by an energy ray such as ultraviolet ray and electron ray. Polymerization of the energy ray polymerizable compound (B) reduces the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 thereby to improve the workability in the picking-up step.
The type of the energy ray polymerizable group is not particularly limited.
Specific examples thereof include a functional group having an ethylenic unsaturated bond, such as vinyl group and (meth) acryloyl group. In view of excellent polymerization reactivity, the energy ray polymerizable group may preferably be a functional group having an ethylenic unsaturated bond, and in particular a (meth) acryloyl group may be more preferable from the viewpoint of the high reactivity when the energy ray is irradiated.
The energy ray polymerizable compound (B) can be roughly classified into a low molecular weight compound having an energy ray polymerizable group (referred simply to as a "low molecular weight compound" in the present description) (B1) and an energy ray curable polymer (B2) comprising a polymer that has an energy ray polymerizable group at the main chain or the side chain. Either of them or both of them in combination may be used for the pressure sensitive adhesive layer 3 according to the present embodiment. i) Low molecular weight compound (B1)
When the energy ray polymerizable compound (B) contains the low molecular weight compound (B1), the low molecular weight compound (B1) can plasticize the pressure sensitive adhesive layer 3 in a similar way the tackifier resin (C) does, as will be described later, and the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 can readily be enhanced. The low molecular weight compound (B1) may be configured of one type of a compound, or may also be configured of a plurality of compounds. One molecule of the low molecular weight compound (B1) may have one energy ray polymerizable group (monofunctional), or the number of energy ray polymerizable groups possessed by one molecule of the low molecular weight compound (B1) may be two or more (multi-functional). The low molecular weight compound (B1) may have a molecular weight to such an extent that it is referred to as a so-called oligomer (a compound having about 10 to 100 constitutional units derived from a monomer), and the molecular weight may preferably be 100 or more and 30,000 or less. If the molecular weight of the low molecular weight compound (B1) is unduly small, a concern is the volatilization in the manufacturing process, which may deteriorate the stability of the composition of the pressure sensitive adhesive layer 3. If, on the other hand, the molecular weight of the low molecular weight compound (B1) is unduly large, a concern is that the function to plasticize the pressure sensitive adhesive layer 3 may be difficult to be obtained. In view of more stably satisfying both of reducing the possibility of volatilization in the manufacturing process and enhancing the function to plasticize the pressure sensitive adhesive layer 3, the molecular weight of the low molecular weight compound (B1) may preferably be 200 or more and 20,000 or less, more preferably 300 or more and 10,000 or less, and most preferably 300 or more and 4,000 or less, as a weight-average molecular weight (Mw).
Specific composition of the low molecular weight compound (B1) is not particularly limited. Specific examples include: alkyl (meth)acrylate having a chain-like skeleton, such as trimethylolpropane tri(meth)acrylate, tetramethylolmethane ~~ tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butyleneglycol di(meth)acrylate and 1,6-hexanediol di(meth)acrylate; alkyl (meth)acrylate having a cyclic skeleton, such as dicyclopentadiene dimethoxy di(meth)acrylate and isobornyl (meth)acrylate; and acrylate-based compound, such as polyethylene glycol di(meth)acrylate, oligoester (meth)acrylate, urethane (meth)acrylate oligomer, epoxy modified (meth)acrylate and polyether (meth)acrylate. Among them, the acrylate-based compound is preferred because of its high compatibility to the acrylic-based polymer (A).
The low molecular weight compound (B1) may preferably have 3 or more energy ray polymerizable groups in one molecule. While the pressure sensitive adhesive layer 3 according to the present embodiment contains a polymerized rosin ester (C1) as described later, the polymerized rosin ester (C1) has an unsaturated carbon-carbon double bond, so that it may inhibit the polymerization of the energy ray polymerizable groups possessed by the low molecular weight compound (Bl).
However, if the low molecular weight compound (B1) is such that the number of the energy ray curable groups possessed in one molecule is within the range as the above, the polymerization may progress efficiently thereby to make it easy to adjust the peel strength ratio of the dicing sheet 1, as will be described later, within a preferable range.
In particular, if the low molecular weight compound (B1) has 5 or more energy ray polymerizable groups in one molecule, the polymerization may progress efficiently even when the compounding amount of the low molecular weight compound (B1) is not excessively large, which may be more preferable.
When n represents the number of energy ray polymerizable groups possessed in one molecule of the low molecular weight compound (B1), and M represents the weight-average molecular weight of the low molecular weight compound (B1), the value n/M obtained by dividing n by M may preferably be 1x107* or more. The value n/M being within the range as the above allows the polymerization to progress efficiently even when the pressure sensitive adhesive layer 3 contains the polymerized rosin ester (C1), and it becomes easy to adjust the peel strength ratio of the dicing sheet 1, as will be described later, within a preferable range. In particular, if the value n/M is 1x10 or more, the polymerization may progress efficiently even when the compounding amount of the low molecular weight compound (Bl) is not excessively large, which may be more preferable. In view of the handling ability of the pressure sensitive adhesive layer 3, such as suppression of hardening in storage, the upper limit of preferable range of the value n/M may by about 5x1 072
The content of the low molecular weight compound (B1) in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment may preferably be 50 mass parts or more and 300 mass parts or less, and more preferably 75 mass parts or more and 150 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A). In the present description, the unit of "mass parts" indicating the content of each component means an amount as a solid content. If the content of the low molecular weight compound (B1) 1s within such a range, the existing density of the energy ray polymerizable groups in the pressure sensitive adhesive layer 3 may be appropriate value, so that the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 can be appropriately reduced when energy ray is irradiated, and the pressure sensitive adhesive layer 3 is plasticized by this component thereby to significantly exert an effect of enhancing the pressure sensitive adhesion property. Moreover, a trouble may not readily occur such that the compatibility between the acrylic-based polymer (A) and the tackifier resin (C) is deteriorated. As a consequence, it may be possible to prevent that a variation occurs in the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 and that the peel strength ratio to be described later of the dicing sheet 1 cannot sufficiently be increased because low concentration parts of the energy ray polymerizable compound (B) occur locally in the vicinity of the interface between the pressure sensitive adhesive layer 3 and the adherend. Also in consideration of the above value n/M, the content of the low molecular weight compound (Bl) in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment may be a content such that a product of the above value n/M and the content relative to 100 mass parts of the acrylic-based polymer (A) is preferably 1.010”! or more and 15 or less, more preferably 1.510" or more and 5 or less, and most preferably 3.0x 107 or more and 1.0 or less. i1) Energy ray curable polymer (B2)
Specific structure of the energy ray curable polymer (B2) is not limited, but when the energy ray curable polymer (B2) is an acrylic-based polymer that has a constitutional unit having an energy ray polymerizable group at the main chain or the side chain, it has a property as the acrylic-based polymer (A). Advantages are therefore such that the manufacturing process for the pressure sensitive adhesive layer 3 can be simplified and that the existing density of the energy ray polymerizable groups can easily be controlled in the pressure sensitive adhesive layer 3. In this case, the acrylic-based polymer (A) may not contained separately. If the energy ray curable polymer (B2) has a property as the acrylic-based polymer (A) in this manner, the term "100 mass parts of the acrylic-based polymer (A)" as used when specifying a preferable range of the content of a component other than the acrylic-based polymer (A) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3, such as the above-described low molecular weight compound (B1) and a tackifier resin (C) to be described later, means 100 mass parts as the sum of a content of the acrylic-based polymer (A) and a content of the energy ray curable polymer (B2) having a property as the acrylic-based polymer (A). It should be noted that, when the energy ray curable polymer (B2) has a property as the acrylic-based polymer (A), the total amount of the acrylic-based polymer (A) may be the energy ray curable polymer (B2). In this case, the energy ray curable polymer (B2) may have reactive functional groups in addition to the energy ray polymerizable groups. At least a part of the reactive functional groups possessed by the energy ray curable polymer (B2) may react in cross-linking with the cross-linker.
The energy ray curable polymer (B2) is a polymer having energy ray polymerizable groups, and may have a weight-average molecular weight (Mw) of 30,000 or more. Like the acrylic-based polymer (A), the energy ray curable polymer (BZ) may exhibit an effect of maintaining the cohesive property of the pressure sensitive adhesive layer as a general function of a pressure sensitive adhesive main agent. Such an effect is enhanced as the molecular weight increases. However, if the molecular weight of the energy ray curable polymer (B2) is unduly large, the possibility of occurrence of troubles may increase, such as that the pressure sensitive adhesive layer 3 will be difficult to be thin when manufactured. Therefore, the weight-average molecular weight of the energy ray curable polymer (B2) may preferably be 100,000 or more and 2,000,000 or less, and more preferably 150,000 or more and 1,500,000 or less. .
When the energy ray curable polymer (B2) has a constitutional unit based on (meth) acrylate in the skeleton, it can be prepared, for example, by a method as below.
That is, an acrylic-based polymer which is a copolymer configured to include: a constitutional unit based on (meth)acrylate that contains a functional group such as hydroxyl group, carboxyl group, amino group, substituted amino group and epoxy group; and a constitutional unit based on alkyl (meth)acrylate, and a compound of which one molecule has: a substituent group that can react with the above functional group; and one to five energy ray polymerizable groups (e.g., a group having an ethylenic double bond), may be reacted together thereby to add the energy ray polymerizable groups to the above acrylic-based polymer.
Examples of the energy ray for hardening the energy ray polymerizable compound (B) include ionizing radiation, i.e., X-ray, ultraviolet ray, electron ray or the like. Among them, ultraviolet ray may be preferred because the introduction of irradiation equipment is relatively easy.
When ultraviolet ray is used as the ionizing radiation, near-ultraviolet rays including rays of wavelengths of about 200 to 380 nm may be used in view of easy management. The amount of ultraviolet ray may be appropriately selected in accordance with the type of the energy ray polymerizable compound (B) and the thickness of the pressure sensitive adhesive layer 3, and may ordinarily be about 50 to 500 mJ/cm®, preferably 100 to 450 mJ/cm?, and more preferably 200 to 400 mJ/cm?.
The illuminance of ultraviolet ray may ordinarily be about 50 to 500 mW/cm?, preferably 100 to 450 mW/cm?, and more preferably 200 to 400 mW/cm?. The ultraviolet ray source is not particularly restricted, and examples thereof to be used include a high-pressure mercury lamp and a metal halide lamp.
When electron ray is used as the ionizing radiation, the accelerating voltage may be appropriately selected in accordance with the type of the energy ray polymerizable compound (B) and the thickness of the pressure sensitive adhesive layer 3, and may preferably be about 10 to 1,000 kV in general. The amount of irradiated ray may be set within a range in which the energy ray polymerizable compound (B) is appropriately hardened, which may ordinarily be a range of 10 to
1,000 krad. The electron ray source is not particularly restricted, and examples thereof to be used include various electron ray accelerators, such as of
Cockeroft-Walton type, Van de Graaff type, resonance transformer type, insulated core transformer type, linear type, dynamitron type, and high-frequency type. (3) Tackifier resin (C)
The pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment contains a polymerized rosin ester (C1) and further contains at least one of a disproportionated rosin ester (C2) and a petroleum-based resin (C3), as a tackifier resin (C). The tackifier resin (C) may comprise an oligomer having a molecular weight of several hundreds to several thousands. Containing such tackifier resin (C) allows the pressure sensitive adhesive layer 3 to have an enhanced pressure sensitive adhesion property.
The content of the tackifier resin (C) in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment may appropriately be set in accordance with the pressure sensitive adhesion property required for the pressure sensitive adhesion property 3, etc.
As a fundamental tendency, an unduly small content of the tackifier resin (C) may make it difficult to enhance the pressure sensitive adhesion property, whereas an unduly large content may deteriorate the compatibility with the acrylic-based polymer (A) and/or the energy ray polymerizable compound (B), and the possibility of occurrence of troubles may increase, such as that a variation in the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 occurs, and the peel strength ratio of the dicing sheet 1 is reduced. In view of making it easy to set the pressure sensitive adhesion property within an appropriate range, the content of the tackifier resin (C) in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 may preferably be 55 mass parts or more and 200 mass parts or less, and more preferably 100 mass parts or more and 175 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A).
Specific type of the polymerized rosin ester (C1) is not particularly limited.
As long as rosin of which the main component is a mixture of abietic acid and isomer thereof is polymerized (dimerized) and the carboxyl group portion is esterified to be chemically stable, the type of alcohol for esterification (such as glycerin and pentaerythritol), etc. may be arbitrarily selected. Specific examples of the polymerized rosin ester (C1) include "PENSEL D125," "PENSEL D135" and "PENSEL D160" which are available from ARAKAWA CHEMICAL INDUSTRIES,
LTD.
In view of stably obtaining the enhanced pressure sensitive adhesion property of the pressure sensitive adhesive layer based on the tackifier resin (C) being contained, the content of the polymerized rosin ester (C1) in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment is 5 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A). If this content is less than 5 mass parts, a concern is that an effect of enhancing the pressure sensitive adhesion property based on the polymerized rosin ester (C1) being contained may not readily be obtained. If, on the other hand, the content of the polymerized rosin ester (C1) is unduly large, the compatibility between the polymerized rosin ester (C1) and the acrylic-based polymer (A) may readily be deteriorated, so that concerns are that a variation may occur in the pressure sensitive adhesion property of the pressure sensitive adhesion property 3 and that the peel strength ratio of the dicing sheet 1 tends to deteriorate. Therefore, the content of the polymerized rosin ester (C1) in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment may preferably be 20 mass parts or less relative to 100 mass parts of the acrylic-based polymer (A). In view of stably achieving both the reduced possibility of occurrence of the variation in the pressure sensitive adhesion property and the enhanced pressure sensitive adhesion property, the content of the polymerized rosin ester (Cl) in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 may more preferably be 8 mass parts or more and 18 mass parts or less, and most preferably 10 mass parts or more and 15 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A).
Each of the disproportionated rosin ester (C2) and the petroleum-based resin (C3) has a function to enhance the compatibility between the polymerized rosin ester (C1) and the acrylic-based polymer (A) in addition to a function as the tackifier resin.
Therefore, when the difference between SP values of the acrylic-based polymer (A) and the polymerized rosin ester (C1) is large, both the disproportionated rosin ester (C2) and the petroleum-based resin (C3) may preferably be contained in view of reducing the variation in the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 and enhancing the peel strength ratio of the dicing sheet 1.
In view of stably exerting the above functions, the sum of the content of the disproportionated rosin ester (C2) and the content of the petroleum-based resin (C3) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 may preferably be 50 mass parts or more, more preferably 80 mass parts or more, and most preferably 100 mass parts or more, relative to 100 mass parts of the acrylic-based polymer (A). The upper limit of the sum of the content of the disproportionated rosin ester (C2) and the content of the petroleum-based resin (C3) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 is to be determined on the basis of other matters, such as the pressure sensitive adhesion property, which the pressure sensitive adhesive layer 3 may have to satisfy, but may preferably be 200 mass parts or less in general, and more preferably 170 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A). The range of each content of the disproportionated rosin ester (C2) and the petroleum-based resin (C3) in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 is not particularly limited, but each may preferably be 25 mass parts or more and 140 mass parts or less relative to 100 mass parts of the acrylic-based polymer (A).
Specific composition, etc. of the disproportionated rosin ester (C2) are not particularly limited. Specific examples thereof include "SUPER ESTER A100" and "KE 656" which are available from ARAKAWA CHEMICAL INDUSTRIES, LTD.
Specific type of the petroleum-based resin (C3) is also not particularly limited, and examples thereof include a Cs-based petroleum resin, Co-based petroleum resin, Cs/Co-based petroleum resin, and hydrogenated resin thereof. Specific examples include "FTR 6100," FTR 7100" and "FTR 8100" which are available from Mitsui
Chemicals, Inc.
‘ ‘
When the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 contains the low molecular weight compound (B1) having energy ray polymerizable groups, this compound may exert a similar function to that of the tackifier resin (plasticization of the pressure sensitive adhesive layer 3) in the pressure sensitive adhesive layer 3 formed of the pressure sensitive adhesive composition. Therefore, the sum of the content of the low molecular weight compound (B1) having energy ray polymerizable groups and the content of the tackifier resin (C) may preferably be 165 mass parts or more and 400 mass parts or less, more preferably 190 mass parts or more and 300 mass parts or less, and further preferably 200 mass parts or more and 275 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A). (4) Cross-linker
As previously described, the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment may contain a cross-linker that is reactive with the acrylic-based polymer (A). In this case, the pressure sensitive adhesive layer 3 according to the present embodiment may contain a cross-linked product obtained by the cross-linking reaction of the acrylic-based polymer (A) and the cross-linker. Examples of the cross-linker include: epoxy-based compound, isocyanate-based compound, metal chelate-based compound, polyimine compound such as aziridine-based compound, melamine resin, urea resin, dialdehydes, methylol polymer, metal alkoxide and metal salt. Among them, polyisocyanate compound is preferred as the cross-linker because the cross-linking reaction can be easily controlled, etc.
The polyisocyanate compound will now be described relatively in detail.
The polyisocyanate compound is a compound having two or more isocyanate groups in one molecule. Examples thereof include: aromatic polyisocyanate, such as tolylene diisocyanate, diphenylmethane diisocyanate and xylylene diisocyanate; alicyclic isocyanate compound, such as dicyclohexylmethane-4,4'-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate and hydrogenated xylylene diisocyanate; and acyclic aliphatic isocyanate, such as hexamethylene diisocyanate, trimethyl hexamethylene diisocyanate and lysine isocyanate.
There may also be used biuret products and isocyanurate products of these compounds, and modified products such as adduct products that are reaction products of these compounds and non-aromatic low molecule active hydrogen-containing compounds such as ethylene glycol, trimethylol propane and castor oil. One type of the above polyisocyanate compound may be used, or plural types may also be used.
When the pressure sensitive adhesive layer 3 according to the present embodiment has a cross-linked product based on the acrylic-based polymer (A) and the cross-linker, the crosslink density may be adjusted thereby to control properties of the pressure sensitive adhesive layer 3, such as the pressure sensitive adhesion property before energy ray irradiation. Therefore, this crosslink density should appropriately be set in accordance with the properties required for the pressure sensitive adhesive layer 3. When the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment contains the cross-linker, an appropriate cross-linking promoter may preferably be contained therein depending on the type of the cross-linker and the like. For example, when the cross-linker is a polyisocyanate compound, the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 may preferably contain an organometallic compound-based cross-linking promoter, such as an organotin compound. (5) Other components
The pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment may contain, in addition to the above components, photopolymerization initiator, coloring material such as colorant and pigment, flame retardant, and filler, etc.
The photopolymerization initiator will now be described relatively in detail.
Examples of the photopolymerization initiator include photo initiators, such as benzoin compound, acetophenone compound, acyl phosphine oxide compound, titanocene compound, thioxanthone compound and peroxide compound, and photo sensitizers, such as amine and quinone. Specifically, there may be exemplified 1-hydroxycyclohexyl phenyl! ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, p-chloroanthraquinone, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, and the like. When ultraviolet ray is used as the energy ray, the photopolymerization initiator may be compounded thereby to reduce the irradiation time and irradiation amount. (6) Physical properties and shape, etc. i) Peel strength ratio :
In the present description, the peel strength ratio refers to a ratio of a peel strength in a state before energy ray irradiation (referred also to as a "peel strength before irradiation") to a peel strength in a state after the energy ray irradiation (referred also to as a "peel strength after irradiation") (before/after), wherein the peel strengths are measured for the dicing sheet 1 according to the present embodiment provided with the pressure sensitive adhesive layer 3 when a 180° peeling test is performed in accordance with JIS Z0237: 2000 so that an exposed surface of the pressure sensitive adhesive layer 3 opposite to the surface facing the base material 2 is used as a surface to be measured and a resin sealing surface of a semiconductor package is used as an adherend surface. The peel strength ratio of the dicing sheet 1 according to the present embodiment is 3 or more. The peel strength ratio being within such a range allows to realize reducing the possibility of occurrence of the pickup failure in the picking-up step while reducing the possibility of occurrence of the mold chip fly in the dicing step and the expanding step. If the peel strength ratio is less than 3, the mold chip fly is likely to occur because it may be difficult to maintain the peel strength before irradiation at a high level, and/or the pickup failure is likely to occur because it may be difficult to maintain the peel strength after irradiation at a low level. In view of more stably reducing the possibility of occurrence of the mold chip fly and/or the pickup failure, the peel strength ratio may preferably be 4.5 or more, and more preferably 8.0 or more. The upper limit of the peel strength ratio is not particularly set. However, since the extent of the volume contraction of the pressure sensitive adhesive layer 3 occurring at the time of hardening due to the energy ray irradiation may be positively correlated with the peel strength ratio, if the peel strength ratio is unduly high, a concern is that a trouble occurs such that the mold chips move when the pressure sensitive adhesive layer 3 is hardened. Therefore, the peel strength ratio may preferably be 20 or less in general, more preferably 13 or less, and most preferably 10 or less.
Preferable ranges of the peel strength before irradiation and the peel strength after irradiation should appropriately be set in accordance with specific conditions in the dicing step, the expanding step and the picking-up step, and the material and surface condition (such as the degree of irregularity) of a semiconductor package as the adherend. In general, the peel strength before irradiation may preferably be 2,000 mN/25 mm or more, and more preferably 2,500 mN/25 mm or more. The peel strength after irradiation may preferably be 600 mN/25 mm or less, more preferably 400 mN/25 mm or less, and most preferably 300 mN/25 mm or less. ii) Thickness
The thickness of the pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment is not particularly limited. If the thickness is unduly small, a concern is that a problem occurs such that a variation in the pressure sensitive adhesion property of the pressure sensitive adhesive layer becomes large.
If the thickness is unduly large, concerns are that the pressure sensitive adhesion property is excessively enhanced so that the it will be difficult to control the peel strength ratio of the dicing sheet 1 within the previously described range, and that the possibility of occurrence of the cohesive fracture in the pressure sensitive adhesive layer 3 becomes high at the time of pickup so that the pressure sensitive adhesive remaining percentage (the definition and details thereof will be described later in the examples) will be high. In view of stably reducing the possibility of occurrence of such problems, the thickness of the pressure sensitive adhesive layer 3 may preferably be 2 um or more and 50 pm or less, more preferably 5 um or more and 35 pm or less, further preferably 5 um or more and 20 pm or less, and most preferably 5 pm or more and 15 pm or less. The thickness of the pressure sensitive adhesive layer 3 being 20 um or less allows the pressure sensitive adhesive remaining percentage to be particularly low, and the thickness of the pressure sensitive adhesive layer 3 being 15 pum or less allows the pressure sensitive adhesive remaining percentage to be 20% or less. 111) Release sheet
For the purpose of protecting the pressure sensitive adhesive layer 3 before the pressure sensitive adhesive layer 3 is applied to a semiconductor package as the adherend, the dicing sheet 1 according to the present embodiment may be configured such that a release surface of a release sheet is provisionally applied to a surface of the pressure sensitive adhesive layer 3 opposite to the surface facing the base material adhering surface. The release sheet may be arbitrarily configured, and examples thereof include a plastic film that has been subjected to release treatment using a release agent. Specific examples of the plastic film include a film of polyester, such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and a film of polyolefin, such as polypropylene and polyethylene.
Examples of the release agent to be used include silicone-based, fluorine-based and long-chain alkyl-based ones, among which the silicone-based release agent is preferred because a stable property can be obtained at low cost. The above plastic film of the release sheet may be substituted by a paper base such as glassine paper, coated paper and wood-free paper, or a laminated paper obtained by laminating a paper base with a thermoplastic resin such as polyethylene. The thickness of the release sheet may ordinarily be about 20 pm or more and 250 pm or less, but is not limited thereto. 3. Method for manufacturing dicing sheet
The method for manufacturing the dicing sheet 1 is not particularly limited in detail as long as the pressure sensitive adhesive layer 3 formed of the previously described pressure sensitive adhesive composition can be laminated on one surface of the base material 2. As one example, the pressure sensitive adhesive layer 3 can be formed through: preparing a coating liquid that contains the previously described pressure sensitive adhesive composition and if necessary further contains some solvent; applying the coating liquid to one surface of the base material 2 using a coater, such as die coater, curtain coater, spray coater, slit coater and knife coater; and drying the coating film on the one surface. Properties of the coating liquid are not particularly limited as long as the coating can be performed, and the component for forming the pressure sensitive adhesive layer 3 may be contained therein as a solute or as a dispersed material.
When the pressure sensitive adhesive composition contains a cross-linker, conditions for the above drying (such as temperature and time) may be adjusted, or a heating process for cross-linking may be separately provided, thereby to progress the cross-linking reaction of the acrylic-based polymer (A) and the cross-linker in the coating film, so that a cross-linked structure is formed with a desired existing density in the pressure sensitive adhesive layer 3. To sufficiently progress this cross-linking reaction, after the pressure sensitive adhesive layer 3 is laminated on the base material 2 using the above method or the like, curing may be performed, such as that the obtained dicing sheet 1 is stationarily placed in an environment of 23°C and a relative humidity of 50% for several days, for example.
Another method may include: applying the coating liquid to the previously described release surface of the release sheet to form a coating liquid layer; drying it to form a laminated body comprising the pressure sensitive adhesive layer 3 and the release sheet; and applying a surface of the pressure sensitive adhesive layer 3 of this laminated body opposite to the surface facing the release sheet to the base material adhering surface of the base material 2, so that a laminated body of the dicing sheet 1 and the release sheet is obtained. The release sheet of this laminated body may be released as a process material, or may keep protecting the pressure sensitive adhesive layer 3 before the dicing sheet is applied to a semiconductor package. 4. Method for manufacturing mold chips
Description will then be directed to a method for manufacturing mold chips from a semiconductor package using the dicing sheet 1 according to the present embodiment.
As described above, a semiconductor package is an electronic component collected body configured such that semiconductor chips are placed on respective bases of a collected body of bases and these semiconductor chips are collectively sealed with resin. In general, such a semiconductor package has a board surface and a resin sealing surface, and the thickness thereof may be about 200 to 2,000 pum.
The resin sealing surface has an arithmetic mean roughness Ra of about 0.5 to 10 pm, which may be coarse. In addition, to allow for easy release from a mold of a sealing apparatus, the sealing material may contain a release component. Therefore, when the pressure sensitive adhesive sheet is applied to the resin sealing surface, there is a tendency that a sufficient fixing property cannot be exerted. When the dicing sheet 1 according to the present embodiment is used, the surface at the side of the pressure sensitive adhesive layer 3 (i.e., the surface of the pressure sensitive adhesive layer 3 opposite to the base material 2) is applied to the resin sealing surface of the semiconductor package. If a release sheet is applied to the surface of the dicing sheet 1 at the side of the pressure sensitive adhesive layer 3, the release sheet is to be released to expose the surface at the side of the pressure sensitive adhesive layer 3, so that the surface may be applied to the resin sealing surface of the semiconductor package. In general, outer circumferential portion of the dicing sheet 1 is applied, via the pressure sensitive adhesive layer 3 provided at that portion, to a circular jig referred to as a ring frame for transportation and/or fixation to an apparatus. Since the pressure sensitive adhesive layer 3 contains an appropriate amount of the appropriate tackifier resin (C), so that the peel strength before irradiation is sufficiently high. Therefore, when the semiconductor package applied to the dicing sheet 1 is put into the dicing step, the possibility that the mold chips obtained by dividing the semiconductor package into pieces fly away at the time of processing may be reduced. While the size of mold chips formed in the dicing step is ordinarily 5 mmx5 mm or less, and may even be about 1 mmx1 mm in recent years, the pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment has a sufficiently high peel strength before irradiation, and can respond to the dicing at such a fine pitch.
By carrying out the dicing step as described above, a plurality of mold chips can be obtained from the semiconductor package. After completion of the dicing step, for easy pickup of the plurality of mold chips closely disposed on the dicing sheet 1, the expanding step is performed in general to elongate the dicing sheet 1 in a direction or directions in the main surface. The degree of this elongation may appropriately be set in consideration of the space which the adjacent mold chips should have and the tensile strength of the base material 2, etc.
After the adjacently disposed mold chips have been appropriately separated from each other by carrying out the expanding step, pickup of the mold chips on the pressure sensitive adhesive layer 3 is performed by a general-purpose means such as a suction collet. The picked-up mold chips are provided to the subsequent step such as a transportation step.
et — Er ———_ < ! NTE rr,
SPECIFICATION "™¢n ee ee
BIEAT 13 us, ’
DICING SHEET =
The present invention relates to a dicing sheet used when dicing a semiconductor package which is configured such that a plurality of semiconductor chips are sealed with resin.
A semiconductor component in which a semiconductor chip is sealed with resin (referred to as a "mold chip" in the present description) may ordinarily be manufactured as follows. First, semiconductor chips are placed on respective bases of a collected body, such as TAB tape, configured such that a plurality of the bases are connected in series or in a matrix state, and these semiconductor chips are collectively sealed with resin to obtain an electronic component collected body (referred to as a "semiconductor package" in the present description). Next, a pressure sensitive adhesive sheet comprising a base material and a pressure sensitive adhesive layer (referred to as a "dicing sheet" in the present description) is applied to one surface of the semiconductor package thereby to fix the semiconductor package to the dicing sheet. This semiconductor package fixed to the dicing sheet is then cut and separated (diced) into pieces, and a member is produced in which a plurality of mold chips are closely disposed on the dicing sheet (dicing step). The pressure sensitive adhesive layer of the dicing sheet is designed in general such that the pressure sensitive adhesion property of the pressure sensitive adhesive layer is reduced by a specific stimulation. For example, irradiation of energy ray may be employed as the specific stimulation. Thus, a step is involved in which the energy ray is irradiated to reduce the pressure sensitive adhesion property of the pressure sensitive adhesive layer before the following steps are performed. Subsequently, the dicing sheet in that member is expanded (elongated in a direction or directions in the main surface) to increase the space between the mold chips disposed on the dicing sheet (expanding
After completion of the dicing step and before initiating the picking-up step, energy ray irradiation may be performed from the side of the base material 2 of the dicing sheet 1 according to the present embodiment thereby to progress the polymerization reaction of the energy ray polymerizable compound (B) contained in the pressure sensitive adhesive layer 3 of the dicing sheet 1, so that the peel strength after irradiation becomes one third or less of the peel strength before irradiation.
Therefore, the pickup failure is unlikely to occur. The timing when this energy ray irradiation is carried out is not particularly limited as long as it is after completion of the dicing step and before initiating the picking-up step. In view of reducing the possibility of the mold chip fly during the expanding step, it may be preferred that the energy ray irradiation is performed after the expanding step.
However, since the pressure sensitive adhesive layer 3 may contract to some extent as it is hardened due to the energy ray irradiation, the energy ray irradiation may be performed before carrying out the expanding step such as when the positional displacement based on this contraction is problematic.
As described above, the method for manufacturing mold chips according to the present embodiment is unlikely to cause the mold chip fly, and the pickup failure is also unlikely to occur in the subsequent step or steps. Therefore, the yield rate may not readily deteriorate in the series of steps including the dicing step, the expanding step and the picking-up step in which the semiconductor package is divided into a plurality of mold chips, to the next step or steps. Hence, the mold chips obtained through the manufacturing method according to the present embodiment using the dicing sheet 1 according to the present embodiment can be advantageous in cost. The mold chip fly and the pickup failure may lead to a problem, such as breakage of other mold chips than those relating directly to these troubles, i.e., mold chips manufactured in the same lot, due to collision of chips or the like. Therefore, the mold chips manufactured through the method for manufacturing mold chips according to the present embodiment are excellent in their quality because the possibility of having such a problem is reduced.
The embodiments heretofore explained are described to facilitate understanding of the present invention and are not described to limit the present invention. Therefore, it is intended that the elements disclosed in the above embodiments include all design changes and equivalents to fall within the technical scope of the present invention.
The present invention will hereinafter be described further specifically with reference to examples, etc, but the scope of the present invention is not limited to these examples, etc.
Example 1 (1) Preparation of coating liquid
Coating liquid was prepared having a composition as follows: i) as the acrylic-based polymer (A), 100 mass parts as a solid content of copolymer (weight-average molecular weight of 600,000, solid content concentration of 40 mass%) obtained by copolymerization of 100 mass parts of butyl acrylate, 2 mass parts of acrylic acid and 0.5 mass parts of 2-hydroxyethyl acrylate; ii) as the energy ray polymerizable compound (B), 100 mass parts as a solid content of an acrylate-based compound comprising hexa-functional urethane acrylate oligomer (SEIKA-BEAM 14-29B, available from Dainichiseika Color & Chemicals
Mfg. Co., Ltd., weight-average molecular weight of 2,000, solid content concentration of 80 mass%, n/M=3x10"%); iii) as the polymerized rosin ester (C1) in the tackifier resin (C), 12.5 mass parts as a solid content of PENSEL D125 (solid content concentration of 100 mass%) available from ARAKAWA CHEMICAL INDUSTRIES, LTD; iv) as the disproportionated rosin ester (C2) in the tackifier resin (C), 62.5 mass parts as a solid content of SUPER ESTER A100 (solid content concentration of 100 mass%) available from ARAKAWA CHEMICAL INDUSTRIES, LTD; v) as the petroleum-based resin (C3) in the tackifier resin (C), 62.5 mass parts as a solid content of FTR 6100 (solid content concentration of 100 mass%) available from Mitsui Chemicals, Inc; vi) as the cross-linker for reacting with the acrylic-based polymer (A), 9 mass parts as a solid content of a polyisocyanate compound (trimethylol propane adduct of tolylene diisocyanate, 3 isocyanate groups in one molecule, solid content concentration of 75 mass%) comprising Coronate L available from NIPPON
‘ \
POLYURETHANE INDUSTRY CO., LTD; and vii) as the photopolymerization initiator, 7.5 mass parts as a solid content of
IRGACURE 184 (available from Ciba Specialty Chemicals Inc, solid content concentration of 100 mass%). (2) Production of dicing sheet
A release sheet (SP-PET381031, available from LINTEC Corporation) was prepared having a silicone-based release agent layer formed on one main surface of a polyethylene terephthalate base film of a thickness of 38 um. The previously described coating liquid was applied to the release surface of the release sheet using a knife coater so that the thickness of the pressure sensitive adhesive layer to be finally obtained would be 10 um. The coating liquid layer thus obtained with the release sheet was caused to pass through an environment of 80°C for 1 minute thereby to dry the coating liquid layer and progress the cross-linking reaction, and a laminated body comprising the release sheet and the pressure sensitive adhesive layer (thickness of 10 pum) was obtained.
A base material comprising an ethylene-methacrylic acid copolymer (EMAA) film (tensile stress at strain of 25%: 10.8 N/10 mm, maximum tensile stress: 25.5 MPa, fracture elongation: 525%) having a thickness of 140 pm was prepared.
One surface of the base material was provided as the base material adhering surface, and the surface at the side of the pressure sensitive adhesive layer of the above laminated body was applied to the base material adhering surface. A dicing sheet comprising the base material and the pressure sensitive adhesive layer as illustrated in
FIG. 1 was thus obtained in a state of being further laminated thereon with the release sheet.
Example 2
A similar procedure to that in Example 1 was performed except that the acrylic-based polymer (A) contained in the coating liquid was copolymer (weight-average molecular weight of 600,000, solid content concentration of 40 mass%) obtained by copolymerization of 100 mass parts of butyl acrylate, 5 mass parts of acrylic acid and 0.2 mass parts of 2-hydroxyethyl acrylate, and a dicing sheet was thus obtained.
Example 3
A similar procedure to that in Example 1 was performed except that the content of the disproportionated rosin ester (C2) was 125 mass parts as a solid content and the content of the petroleum-based resin (C3) was 50 mass parts as a solid content in the tackifier resin (C) contained in the coating liquid and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in Example 1 to 182.5 mass parts, and a dicing sheet was thus obtained.
Example 4
A similar procedure to that in Example 1 was performed except that the thickness of the pressure sensitive adhesive layer was changed from 10 pm in
Example 1 to 15 um, and a dicing sheet was thus obtained.
Example 5
A similar procedure to that in Example 1 was performed except that the thickness of the pressure sensitive adhesive layer was changed from 10 pm in
Example 1 to 30 pm, and a dicing sheet was thus obtained.
Example 6
A similar procedure to that in Example 1 was performed except that the petroleum-based resin (C3) was not contained in the tackifier resin (C) contained in the coating liquid and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in Example 1 to 75 mass parts, and a dicing sheet was thus obtained.
Example 7
A similar procedure to that in Example 1 was performed except that the disproportionated rosin ester (C2) was not contained and the content of the petroleum-based resin (C3) was 75 mass parts as a solid content in the tackifier resin (©) contained in the coating liquid and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in Example 1 to 87.5 mass parts, and a dicing sheet was thus obtained.
Example 8
A similar procedure to that in Example 1 was performed except that the type of the energy ray polymerizable compound (B) contained in the coating liquid was changed from the hexa-functional urethane acrylate in Example 1 to tri-functional urethane acrylate oligomer (SEIKA-BEAM EXL-810TL, available from
Dainichiseika Color & Chemicals Mfg. Co., Ltd., weight-average molecular weight of : 5,000, solid content concentration of 60 mass%, n/M=6x10"% and the content thereof was 250 mass parts, and a dicing sheet was thus obtained.
Comparative Example 1
A similar procedure to that in Example 1 was performed except that the polymerized rosin ester (C1) was not contained in the tackifier resin (C) contained in the coating liquid and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in Example 1 to 125 mass parts, and a dicing sheet was thus obtained.
Comparative Example 2
A similar procedure to that in Example 1 was performed except that both the polymerized rosin ester (C1) and the disproportionated rosin ester (C2) was not contained in the tackifier resin (C) contained in the coating liquid and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in
Example 1 to 62.5 mass parts, and a dicing sheet was thus obtained.
Comparative Example 3
A similar procedure to that in Example 1 was performed except that each content of the polymerized rosin ester (C1), the disproportionated rosin ester (C2) and the petroleum-based resin (C3) in the tackifier resin (C) contained in the coating liquid was 125 mass parts as a solid content and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in Example 1 to 375 mass parts, and a dicing sheet was thus obtained.
Comparative Example 4
A similar procedure to that in Example 1 was performed except that both the energy ray polymerizable compound (B) and the photopolymerization initiator were
‘ ' not contained in the coating liquid, and a dicing sheet was thus obtained.
Comparative Example 5
A similar procedure to that in Example 1 was performed except that the contents in the tackifier resin (C) contained in the coating liquid were set as below and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in Example 1 to 52.5 mass parts, and a dicing sheet was thus obtained.
Polymerized rosin ester (C1): 2.5 mass parts as a solid content;
Disproportionated rosin ester (C2): 25 mass parts as a solid content; and
Petroleum-based resin (C3): as 25 mass parts as a solid content.
Comparative Example 6
A similar procedure to that in Example 1 was performed except that the content of the polymerized rosin ester (C1) was 50 mass parts as a solid content and the content of the petroleum-based resin (C3) was 75 mass parts as a solid content in the tackifier resin (C) contained in the coating liquid and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in Example 1 to 187.5 mass parts, and a dicing sheet was thus obtained. :
Comparative Example 7
A similar procedure to that in Example 1 was performed except that the content of the polymerized rosin ester (C1) was 50 mass parts as a solid content and both the disproportionated rosin ester (C2) and the petroleum-based resin (C3) were not contained in the tackifier resin (C) contained in the coating liquid and that the content of the tackifier resin (C) as a solid content was changed from 137.5 mass parts in Example 1 to 50 mass parts, and a dicing sheet was thus obtained.
Comparative Example 8
A similar procedure to that in Example 1 was performed except that the type of the energy ray polymerizable compound (B) contained in the coating liquid was changed from the hexa-functional urethane acrylate in Example 1 to tri-functional urethane acrylate oligomer (SEIKA-BEAM EXL-810TL, available from
Dainichiseika Color & Chemicals Mfg. Co., Ltd., weight-average molecular weight of ee —————— EE —————EEEEEN EN. ¢ t . . . —4 oo. 5,000, solid content concentration of 60 mass%, n/M=6x10"), and a dicing sheet was thus obtained.
Table 1 collectively shows compositions, etc. of the coating liquids prepared to manufacture the dicing sheets according to the above examples and comparative examples and thicknesses of the obtained dicing sheets. Since the energy ray polymerizable compound (B) contained in the coating liquid according to each of the examples and the comparative examples was urethane acrylate oligomer, the column for the type of the energy ray polymerizable compound (B) in Table 1 indicates the number of the functional groups.
Table 1
Photopolymer
Acrylic-based polymer (A) | Energy ray polymerizable compcund (B} Tackifier resin (C) Cross- linker zation Pressure initiator sensitive weight- Polymerized | Disproportio| Petroleum- adhesive layer
Composition | Content average y Content rosin ester | nated rosin | based resin |, tal Content Content thickness (um)
BA/AA/HER | (mass pars) Type molecular bd (mass parts) ch ester (C2) {c3) fot (mass parts) | {mass parts) weight (mass parts) § (mass parts) | {mass parts) ) elo | | [on [ow ow Joon Joa [oon fod | |] omer | [ow Jor] ow oe [on {a fo {oo
CE CC EC NC CC NE elo | oo J] oon {or Lon od mms | [ow Joe] wo [wo [on fo + [a [oo] ro [om] [we or] wn [we | 0 [ol + [0 [oo]
CEE Cd CC CO CI NC HE mv Leo 0 | Jer] ow | oo [er Lon fof [|]
EE CO CCC C0 2 NC HE
Eton] wo [we [ow] wo | |e fe
ED x CC CE CI HO
EE CI CC CO CE NC HC
FE CC CE CC NC HE
Eon] [Jw ow [5 [we [5] lon | a [Jw Jo ow [oo [el [no]
Em | [we Jor] wn [or [or [wn fo] + [ow | 0
Exemplary Test 1-Measurement of peel strength ratio
Each of the dicing sheets manufactured in the above examples and comparative examples was cut, and a sheet for measuring peel strength was obtained
¢ with a width of 25 mm. A resin for semiconductor package (KE-G1250, available from KYOCERA Chemical Corporation) was used to manufacture a sheet-like member having a thickness of 600 um and an arithmetic mean roughness Ra at one main surface of 2 pm. The surface at the side of the pressure sensitive adhesive layer of the sheet for measuring peel strength was applied to the above one main surface of the sheet-like member, and a laminated body comprising the sheet-like member and the sheet for measuring peel strength was obtained. The obtained laminated body was stationarily placed under an environment of 23°C and a relative humidity of 50% for 20 minutes. For the laminated body after the stationary placement, a universal tensile tester (TENSILON/UTM-4-100, available from
ORIENTEC Co., LTD.) was used to perform a 180° peeling test in accordance with
JIS Z0237: 2000 (the sheet for measuring peel strength was used as a member to be peeled off from the other), and the peel strength before irradiation was measured (unit: mN/25 mm).
Another laminated body comprising the above sheet-like member and the sheet for measuring peel strength was produced and stationarily placed under an environment of 23°C and a relative humidity of 50% for 20 minutes. Thereafter, an ultraviolet ray irradiating apparatus (RAD-2000m/12, available from LINTEC
Corporation) was used to perform ultraviolet ray irradiation (illuminance of 230 mW/cm?, ultraviolet ray amount of 190 mJ/cm?) in nitrogen atmosphere from the side of the base material, and the energy ray polymerizable compound (B) contained in the pressure sensitive adhesive layer of the above laminated body was thus polymerized.
For this laminated body after the ultraviolet ray irradiation, a peeling test under the same condition as that in the peeling test for measuring the above peel strength before irradiation was performed to measure the peel strength after irradiation (unit: mN/25 mm).
The peel strength before irradiation and the peel strength after irradiation thus obtained were used to calculate the peel strength ratio. These results are listed in Table 2.
; .
Exemplary Test 2 -Measurement of chip fly rate in the dicing step
A resin for semiconductor package (KE-G1250, available from KYOCERA
Chemical Corporation) was used to produce a simulated semiconductor package having a size of 50 mmx50 mm and a thickness of 600 pm with an arithmetic mean roughness Ra at one main surface of 2 um. Each of the dicing sheets manufactured in the above examples and comparative examples was cut into a circular shape of a diameter of 207 mm, and the surface of the obtained circular dicing sheet at the side of the pressure sensitive adhesive layer was applied to the above one main surface of the above-described simulated semiconductor package using a tape mounter (Adwill
RAD2500, available from LINTEC Corporation). The laminated body of the dicing sheet and the simulated semiconductor package thus obtained was attached to a ring frame for dicing (2-6-1, available from DISCO Corporation), and a dicing apparatus (DFD-651, available from DISCO Corporation) was used to perform the dicing step for cutting the laminated body from the side of the simulated semiconductor package and dividing it into mold chips of a size of 1 mmx>1 mm (division number of 2,500).
The dicing condition was as follows:
Dicing blade: ZBT-5074 (Z1110LS3), available from DISCO Corporation
Blade thickness: 0.17 mm
Protruding amount of blade: 3.3 mm
Rotation speed of blade: 30,000 rpm
Cutting rate: 50 mm/min
Depth of cutting into base material of dicing sheet: 50 um
Cutting water amount: 1.0 L/min ! Cutting water temperature: 20°C
Visual observation was performed for a member obtained in the dicing step, i.e., the dicing sheet having the mold chips attached to the surface at the side of the pressure sensitive adhesive layer, to count the number of the mold chips dropped off from the dicing sheet in the dicing step, and the number was divided by the division number of 2,500 in the dicing step to calculate the mold chip fly rate (unit: %).
Results are listed in Table 2.
¢ «
Exemplary Test 3 -Pickup test
A resin for semiconductor package (KE-G1250, available from KYOCERA
Chemical Corporation) was used to produce a simulated semiconductor package having a size of 50 mmx50 mm and a thickness of 600 um with an arithmetic mean roughness Ra at one main surface of 2 pm. Each of the dicing sheets manufactured in the above examples and comparative examples was cut to have a diameter of 207 mm, and the surface of the obtained dicing sheet at the side of the pressure sensitive adhesive layer was applied to the above one main surface of the above-described simulated semiconductor package using a tape mounter (Adwill RAD2500, available - from LINTEC Corporation). The laminated body of the dicing sheet and the simulated semiconductor package thus obtained was attached to a ring frame for dicing (2-6-1, available from DISCO Corporation), and a dicing apparatus (DFD-651, available from DISCO Corporation) was used to perform the dicing step for cutting the laminated body from the side of the simulated semiconductor package and dividing it into mold chips of a size of 1 mmx1 mm (division number of 2,500). The dicing condition was the same as that in Exemplary Test 3.
For the member which was obtained in the dicing step and in which mold chips were attached to the surface of the dicing sheet at the side of the pressure sensitive adhesive layer, the expanding step was performed to expand the dicing sheet by 20 mm in a direction or directions in the main surface of the sheet at a speed of 300 mm/min using an expanding apparatus (ME-300B-type, a JCM product).
For the above member after the expanding step, ultraviolet ray irradiation (illuminance: 230 mW/cm?, ultraviolet ray amount: 190 mJ/cm?) was performed in nitrogen atmosphere from the side of the dicing sheet using an ultraviolet ray irradiating apparatus (RAD-2000m/12, available from LINTEC Corporation) to polymerize the energy ray polymerizable compound (B) contained in the pressure sensitive adhesive layer of the dicing sheet.
Subsequently, a pickup test was performed for 100 mold chips located in the vicinity of the center of the main surface of the dicing sheet. More specifically, a part of the dicing sheet contacting with mold chips to be pickup objects was elevated ee —— EE ——. ¢ . step). The mold chips thus separated from one another on the dicing sheet are individually picked up to depart from the dicing sheet (picking-up step) and transported to the next step. In this operation, the above step for reducing the pressure sensitive adhesion property of the pressure sensitive adhesive layer is involved thereby to allow the picking-up to easily be performed.
In the dicing step and the subsequent expanding step among the series of steps, the semiconductor package and the mold chips obtained by dicing the semiconductor package are required to maintain a state of being fixed onto the dicing sheet. To this end, it is preferred that the pressure sensitive adhesive layer of the dicing sheet has a high pressure sensitive adhesion property to the semiconductor ! package and the mold chips before energy ray irradiation (unless otherwise stated in the present description, the "pressure sensitive adhesion property" means a pressure sensitive adhesion property before energy ray irradiation). Here, when an adherend for the dicing sheet is a semiconductor package or each mold chip, irregularities on the adherend surface tend to be larger than those in a case where a semiconductor chip is to be an adherend. Therefore, if a dicing sheet for a semiconductor chip as the adherend is diverted to a dicing sheet to be used in the above step for a semiconductor package, the pressure sensitive adhesion property to the adherend will be insufficient, and troubles may occur such as that some of mold chips individually cut from the semiconductor package in the dicing step are released and fly from the dicing sheet and that some of mold chips are released and fly from the dicing sheet when the dicing sheet is elongated in the expanding step. Hereinafter, such troubles occurring in the dicing step and the expanding step are referred collectively to as "mold chip fly." For the purpose of reducing the possibility of occurrence of this mold chip fly, as described in Patent Literature 1, for example, a resin material for imparting a pressure sensitive adhesion property to the pressure sensitive adhesive layer of the dicing sheet (referred to as a "tackifier resin" in the present description) may be contained therein.
A rosin-based material commonly used as the tackifier resin is a material that is preferable in view of enhancing the pressure sensitive adhesion property of the
¢ [ by 1.5 mm using needles from the side of the base material, and a vacuum collet was attached to surfaces of the projected mold chips opposite to the surfaces facing the dicing sheet to raise the mold chips attached to the vacuum collet. At that time, the number of mold chips that were able to be picked up by the vacuum collet was measured, and a pickup rate (unit: %) was calculated by dividing the number by the number of objects (100). Results thereof are listed in Table 2.
Observation using an optical microscope was performed for the surface of each picked up mold chip that had faced the dicing sheet, and confirmation was made as to whether a material constituting the pressure sensitive adhesive layer remained or not. A pressure sensitive adhesive remaining percentage (unit: %) was calculated by dividing the number of remaining mold chips by the number of objects (100).
Results thereof are listed in Table 2.
Table 2
Pressure
Peel strength|Peel strength sensitive
Lrratiation | irrasiarion | ratio | rate tar | FRE | Comatning en | ow | wm [ow [ow |e mv [ew [wo |e Tw [ow ee] we | |e |e [ow | u oe | wm [ow | wo [0 | ow |e ew |e | | | ow |e ee] ow [wa [ow |e or | me | ow [er [ow [ow ne om | wo | | ow | w mer] ow | ow | ww | u] ns] we [wo [ww | vo om] ow | we | oo [oo | w
Ctr] ow | ow | oo | wo [ow ter] ww | wo [wm [wm
RY Pog
As understood from Table 2, it can be said that the dicing sheets according to the examples satisfying the condition in the present invention are unlikely to cause troubles in any of the dicing step, the expanding step and the picking-up step. : 5 The dicing sheet according to the present invention can be suitably used as a dicing sheet for a semiconductor package having large irregularities on the adherend surface.
Description of Reference Numerals 1... Dicing sheet 2... Base material 3... Pressure sensitive adhesive layer pressure sensitive adhesive layer. However, detailed studies by the present inventors have revealed that, unless the type and the content of the rosin-based tackifier resin are appropriately managed, variation may occur in the pressure sensitive adhesion property of the pressure sensitive adhesive layer, and/or the picking-up step cannot be appropriately performed even though the pressure sensitive adhesion property of the pressure sensitive adhesive layer can be ensured. Specifically, troubles may occur such as that the mold chips cannot be picked up in the picking-up step. Hereinafter, such troubles are referred collectively to as a "pickup failure."
An object of the present invention is to provide a dicing sheet which has a reduced possibility of occurrence of troubles in any of the dicing step, the expanding step and the picking-up step. Another object of the present invention is to provide a method for manufacturing mold chips using the dicing sheet.
To achieve the above objects, the present inventors had studies and have obtained a knowledge that the possibility of occurrence of the above troubles can be reduced in any of the dicing step, the expanding step and the picking-up step by configuring a dicing sheet such that: a tackifier resin contained in a pressure sensitive adhesive layer of the dicing sheet is made to have a composition comprising a polymerized rosin ester and at least one of a disproportionated rosin ester and a petroleum-based resin; the polymerized rosin ester of the tackifier resin has a content not less than a predetermined amount; and a ratio of peel strengths before and after energy ray irradiation (before/after) is set 3 or more.
The present invention accomplished on the basis of such a knowledge is, first, a dicing sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, and the dicing sheet is characterized in that: the pressure sensitive adhesive layer is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A), an energy ray polymerizable compound (B) and a tackifier resin (C); the tackifier resin (C) contains a polymerized rosin ester (C1) and further contains at least one of a disproportionated rosin ester (C2) and a petroleum-based resin (C3); the polymerized rosin ester (C1) contained in the pressure sensitive adhesive composition has a content of 5 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A);
. v and the dicing sheet has a ratio of a peel strength in a state before energy ray irradiation to a peel strength in a state after the energy ray irradiation of 3 or more wherein the peel strengths are measured when a 180° peeling test is performed in accordance with JIS Z0237: 2000 so that an exposed surface of the pressure sensitive adhesive layer opposite to a surface facing the base material is used as a surface to be measured and a resin sealing surface of a semiconductor package is used as an adherend surface (Invention 1).
Since the dicing sheet appropriately contains the tackifier resin (C) and the peel strength ratio is 3 or more, troubles such as the mold chip fly and the pickup ! failure are unlikely to occur.
In the above invention (Invention 1), it is preferred that the polymerized rosin ester (C1) contained in the pressure sensitive adhesive composition has a content of 5 mass parts or more and 20 mass parts or less relative to 100 mass parts of the acrylic-based polymer (A) (Invention 2). The content of the polymerized rosin ester (C1) being within this range allows to reduce the possibility of occurrence of variation in the pressure sensitive adhesion property and/or deterioration in the peel strength ratio, and it is easy to obtain a pressure sensitive adhesive layer enhanced in its pressure sensitive adhesion property.
In the above invention (Invention 1, 2), it is preferred that a sum of a content of the disproportionated rosin ester (C2) and a content of the petroleum-based resin (C3) contained in the pressure sensitive adhesive composition is 50 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A) (Invention 3). The disproportionated rosin ester (C2) and the petroleum-based resin (C3) have a function to enhance the compatibility between the polymerized rosin ester (C1) and the acrylic-based polymer (A) in addition to the function as the tackifier resin.
Therefore, satisfying the above range for the content makes it possible to more stably exert the function to enhance such compatibility.
In the above invention (Invention 1 to 3), it is preferred that the energy ray polymerizable compound (B) contains a low molecular weight compound (B1) that has a weight-average molecular weight (Mw) of 100 or more and 30,000 or less and that has an energy ray polymerizable group (Invention 4). Such a low molecular weight compound (B1) may comprise one or more types selected from the group consisting of a monofunctional monomer and a multifunctional monomer that have an energy ray polymerizable group, and oligomers of these monomers. This low molecular weight compound (B1) being contained allows to reduce the possibility that the stability of the composition of the pressure sensitive adhesive layer is deteriorated.
Moreover, the pressure sensitive adhesion property of the pressure sensitive adhesive layer may readily be enhanced because the above low molecular weight compound (B1) can have a similar function to that of the tackifier resin (C).
In the above invention (Invention 4), it is preferred that the low molecular weight compound (B1) contained in the pressure sensitive adhesive composition and having the energy ray polymerizable group has a content of 50 mass parts or more and 150 mass parts or less relative to 100 mass parts of the acrylic-based polymer (A) (Invention 5). By adjusting the content of the low molecular weight compound (B1) having the energy ray polymerizable group within the above range, the pressure sensitive adhesion property of the pressure sensitive adhesive layer can be appropriately reduced when the energy ray is irradiated, and the pressure sensitive adhesive layer may be plasticized, so that the effect of enhancing the pressure sensitive adhesion property will be more significantly exerted. In addition, it is possible to prevent the occurrence of troubles due to the compatibility of each component in the pressure sensitive adhesive layer being deteriorated.
In the above invention (Invention 1 to 5), it is preferred that the pressure sensitive adhesive composition contains a cross-linker that is reactive in cross-linking with the acrylic-based polymer (Invention 6). In this case, the pressure sensitive adhesive layer formed of the pressure sensitive adhesive composition may contain a cross-linked product obtained by the cross-linking reaction of the cross-linker with a functional group possessed by the acrylic-based polymer (A) to react with the cross-linker (a functional group that is reactive with the cross-linker may also be referred to as a "reactive functional group" in the present description). The cross-linked product may have a cross-linked structure (which may be configured of (reactive functional group)-(cross-linker)-(reactive functional group)), and the ee — = t » existing density thereof in the pressure sensitive adhesive layer (which may also be referred to as a "cross-linking density” in the present description) may be adjusted thereby to allow to control the properties, such as the pressure sensitive adhesion property of the pressure sensitive adhesive layer before the energy ray irradiation.
In the above invention (Invention 1 to 6), it is preferred that the pressure sensitive adhesive layer has a thickness of 5 pm or more and 35 pm or less (Invention 7). The thickness being within this range allows to reduce the possibility of occurrence of problems such as that the variation in the pressure sensitive adhesion property of the pressure sensitive adhesive layer becomes large, the peel strength ratio becomes difficult to be within the previously described range, and cohesive fracture occurs in the pressure sensitive adhesive layer at the time of picking-up.
In the above invention (Invention 1 to 7), it is preferred that a component having one or more types selected from the group consisting of a carboxyl group and ion and salt thereof is present on a surface of the base material at the side of the pressure sensitive adhesive layer (Invention 8). Such a component may interact chemically with components of the pressure sensitive adhesive layer thereby to reduce the possibility that delamination occurs between the base material and the pressure sensitive adhesive layer.
It is preferred that a surface of the pressure sensitive adhesive layer opposite j to the base material is to be applied to a resin sealing surface of a semiconductor package obtained by sealing a semiconductor chip with resin (Invention 9). The surface of the pressure sensitive adhesive layer opposite to the base material may be applied to the above adherend surface thereby to allow the product to appropriately function as a dicing sheet.
Second, the present invention provides a method for manufacturing mold chips, comprising: applying a surface at the side of the pressure sensitive adhesive layer of the dicing sheet as described in any one of the above inventions (Inventions 1 to 9) to a resin sealing surface of a semiconductor package; and cutting the semiconductor package on the dicing sheet into pieces to obtain a plurality of mold chips (Invention 10).
ee —————————— TN ‘ ’
Such a manufacturing method is unlikely to cause the mold chip fly and the pickup failure during the process, and mold chips of high quality and having an advantage in cost can be manufactured.
According to the present invention, a dicing sheet can be provided which has a reduced possibility of occurrence of troubles in any of the dicing step, the expanding step and the picking-up step. Moreover, such a dicing sheet can be used thereby to manufacture mold chips of high quality and having an advantage in cost.
FIG 1 is a schematic cross-sectional view of a dicing sheet according to an embodiment of the present invention.
Embodiments of the present invention will be described hereinafter.
As shown in FIG. 1, a dicing sheet 1 according to an embodiment of the present invention comprises a base material 2 and a pressure sensitive adhesive layer 3. 1. Base material
Constitutional materials for the base material 2 of the dicing sheet 1 according to the present embodiment are not particularly limited as long as the base material 2 does not fracture in the expanding step and the picking-up step. The base material 2 may ordinarily be constituted of a film that comprises a resin-based material as the main material. Specific examples of the film include: polyolefin-based film such as low-density polyethylene (LDPE) film, linear low-density polyethylene (LLDPE) film, high-density polyethylene (HDPE) film and other polyethylene films, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, ethylene-norbornene copolymer film and norbornene resin film; polyvinyl chloride-based film such as polyvinyl chloride film and vinyl chloride copolymer film; polyester-based film such as polyethylene terephthalate film and
Claims (12)
1. A dicing sheet comprising a base material and a pressurésensitive adticsioce layer laminated on at least one surface of the base material, whergin; i. TT CARI PY 2: py the pressure sensitive adhesive layer is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A), an energy ray polymerizable compound (B) and a tackifier resin (C); the tackifier resin (C) contains a polymerized rosin ester (C1) and further contains at least one of a disproportionated rosin ester (C2) and a petroleum-based resin (C3); the polymerized rosin ester (C1) contained in the pressure sensitive adhesive composition has a content of 5 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A); and the dicing sheet has a ratio of a peel strength in a state before energy ray irradiation to a peel strength in a state after the energy ray irradiation of 3 or more wherein the peel strengths are measured when a 180° peeling test is performed in accordance with JIS Z0237: 2000 so that an exposed surface of the pressure sensitive adhesive layer opposite to a surface facing the base material is used as a surface to be measured and a resin sealing surface of a semiconductor package is used as an adherend surface.
2. The dicing sheet as recited in claim 1, wherein the pressure sensitive adhesive layer has energy ray curability.
3. The dicing sheet as recited in claim 1, wherein the dicing sheet has the peel strength in a state after the energy ray irradiation of 600 mN/25 mm or less.
4. The dicing sheet as recited in claim 1, wherein the polymerized rosin ester (C1) contained in the pressure sensitive adhesive composition has a content of 5 mass parts or more and 20 mass parts or less relative to 100 mass parts of the acrylic-based ec! 1 polymer (A).
5. The dicing sheet as recited in claim 1, wherein a sum of a content of the disproportionated rosin ester (C2) and a content of the petroleum-based resin (C3) contained in the pressure sensitive adhesive composition is 50 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A).
6. The dicing sheet as recited in claim 1, wherein the energy ray polymerizable compound (B) contains a low molecular weight compound (Bl) that has a weight-average molecular weight of 100 or more and 30,000 or less and that has an energy ray polymerizable group.
7. The dicing sheet as recited in claim 6, wherein the low molecular weight compound (B1) contained in the pressure sensitive adhesive composition and having the energy ray polymerizable group has a content of 50 mass parts or more and 300 mass parts or less relative to 100 mass parts of the acrylic-based polymer (A).
8. The dicing sheet as recited in claim 1, wherein the pressure sensitive adhesive composition contains a cross-linker that is reactive in cross-linking with the acrylic-based polymer.
9. The dicing sheet as recited in claim 1, wherein the pressure sensitive adhesive layer has a thickness of 5 um or more and 35 pm or less.
10. The dicing sheet as recited in claim 1, wherein a component having one or more types selected from the group consisting of a carboxyl group and ion and salt thereof is present on a surface of the base material at the side of the pressure sensitive adhesive layer.
11. The dicing sheet as recited in claim 1, wherein a surface of the pressure sensitive adhesive layer opposite to the base material is to be applied to a resin sealing surface of a semiconductor package obtained by sealing a semiconductor chip with resin.
ss! > N
12. A method for manufacturing mold chips, comprising: applying a surface at the side of the pressure sensitive adhesive layer of the dicing sheet as recited in claim 1 to a resin sealing surface of a semiconductor package; and cutting the semiconductor package on the dicing sheet into pieces to obtain a plurality of mold chips.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012119884 | 2012-05-25 | ||
| PCT/JP2013/063305 WO2013175987A1 (en) | 2012-05-25 | 2013-05-13 | Dicing sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PH12014502606B1 true PH12014502606B1 (en) | 2015-01-21 |
| PH12014502606A1 PH12014502606A1 (en) | 2015-01-21 |
Family
ID=49623681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12014502606A PH12014502606A1 (en) | 2012-05-25 | 2014-11-21 | Dicing sheet |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6139515B2 (en) |
| CN (1) | CN104303271B (en) |
| MY (1) | MY186486A (en) |
| PH (1) | PH12014502606A1 (en) |
| TW (1) | TWI580755B (en) |
| WO (1) | WO2013175987A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106462056A (en) * | 2014-06-04 | 2017-02-22 | 道康宁公司 | Imprinting process of hot-melt type curable silicone composition for optical devices |
| JP6506756B2 (en) * | 2014-07-14 | 2019-04-24 | デンカ株式会社 | Adhesive sheet, manufacturing method of electronic parts |
| JP6470944B2 (en) * | 2014-11-04 | 2019-02-13 | リンテック株式会社 | Conductive adhesive composition and conductive adhesive sheet |
| SG11201707934QA (en) * | 2015-03-26 | 2017-10-30 | Lintec Corp | Dicing sheet, method for producing dicing sheet, and method for producing mold chips |
| JP6782237B2 (en) * | 2015-07-24 | 2020-11-11 | デンカ株式会社 | Adhesive tape for semiconductor processing and manufacturing method of semiconductor chips or semiconductor parts using it |
| WO2017038914A1 (en) * | 2015-09-01 | 2017-03-09 | リンテック株式会社 | Adhesive sheet |
| JP6572800B2 (en) | 2016-02-26 | 2019-09-11 | 株式会社村田製作所 | Vacuum equipment |
| WO2018003565A1 (en) * | 2016-06-28 | 2018-01-04 | 日本ゼオン株式会社 | Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packages |
| KR102326621B1 (en) * | 2016-09-20 | 2021-11-15 | 린텍 가부시키가이샤 | Adhesive sheet for semiconductor processing |
| JP2020043150A (en) * | 2018-09-06 | 2020-03-19 | 株式会社ディスコ | Wafer processing method |
| JP7254669B2 (en) * | 2019-09-20 | 2023-04-10 | リンテック株式会社 | Work processing sheet and method for manufacturing semiconductor device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4461359B2 (en) * | 2003-09-24 | 2010-05-12 | Ｄｉｃ株式会社 | Adhesive tape for LCD module |
| JP2009246216A (en) * | 2008-03-31 | 2009-10-22 | Sumitomo Bakelite Co Ltd | Semiconductor processing adhesive tape |
| JP4994429B2 (en) * | 2008-08-04 | 2012-08-08 | 日東電工株式会社 | Dicing die bond film |
| JP5370811B2 (en) * | 2008-09-30 | 2013-12-18 | 荒川化学工業株式会社 | Active energy ray-curable pressure-sensitive adhesive composition |
| JP2010258408A (en) * | 2009-03-31 | 2010-11-11 | Sumitomo Bakelite Co Ltd | Adhesive film for processing semiconductor, semiconductor wafer, semiconductor element, and semiconductor device |
-
2013
- 2013-05-13 MY MYPI2014703439A patent/MY186486A/en unknown
- 2013-05-13 CN CN201380025930.6A patent/CN104303271B/en active Active
- 2013-05-13 JP JP2014516754A patent/JP6139515B2/en active Active
- 2013-05-13 WO PCT/JP2013/063305 patent/WO2013175987A1/en active Application Filing
- 2013-05-20 TW TW102117704A patent/TWI580755B/en active
-
2014
- 2014-11-21 PH PH12014502606A patent/PH12014502606A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MY186486A (en) | 2021-07-22 |
| JPWO2013175987A1 (en) | 2016-01-12 |
| TW201406913A (en) | 2014-02-16 |
| CN104303271A (en) | 2015-01-21 |
| TWI580755B (en) | 2017-05-01 |
| CN104303271B (en) | 2017-02-22 |
| JP6139515B2 (en) | 2017-05-31 |
| PH12014502606A1 (en) | 2015-01-21 |
| WO2013175987A1 (en) | 2013-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PH12014502606B1 (en) | Dicing sheet | |
| EP2975098B1 (en) | Adhesive sheet, and production method for processed device-related members | |
| JP6744930B2 (en) | Dicing sheet and chip manufacturing method using the dicing sheet | |
| JP6081094B2 (en) | Dicing sheet | |
| KR102394517B1 (en) | Sheet for semiconductor-related-member processing and process for producing chip using said sheet | |
| JP5414953B1 (en) | Dicing sheet and device chip manufacturing method | |
| JP6317744B2 (en) | Dicing sheet | |
| KR102394516B1 (en) | Dicing sheet, method for producing dicing sheet, and method for producing molded chip | |
| JPWO2015141555A6 (en) | Dicing sheet and chip manufacturing method using the dicing sheet | |
| JPWO2016017265A1 (en) | Dicing sheet, dicing sheet manufacturing method, and mold chip manufacturing method | |
| KR102429606B1 (en) | Dicing sheet, method for producing dicing sheet, and method for producing molded chip | |
| JP6087122B2 (en) | Dicing sheet | |
| JP6190134B2 (en) | Dicing sheet base film, dicing sheet, dicing sheet base film manufacturing method, and chip-shaped member manufacturing method |