TW201406913A - Dicing sheet - Google Patents

Abstract

A dicing sheet in which the possibility of the occurrence of defects can be reduced in all of a dicing step, an expanding step and a pick-up step. As such a dicing sheet, a dicing sheet (1) is provided, which comprises a base (2) and an adhesive agent layer (3) laminated on at least one surface of the base (2), wherein the adhesive agent layer is formed from an adhesive agent composition comprising an acrylic polymer (A) that is an acrylic polymer-based component, an energy-ray-polymerizable compound (B) and an adhesiveness-imparting resin (C), the adhesiveness-imparting resin (C) contains a polymerized rosin ester (C1) and also contains a disproportionated rosin ester (C2) and/or a petroleum-derived resin (C3), the content ratio of the polymerized rosin ester (C1) contained in the adhesive agent composition is 5 parts by mass relative to 100 parts by mass of the acrylic polymer (A), and the ratio of an adhesion force of the dicing sheet as measured after the irradiation with an energy ray to that as measured before the irradiation with the energy ray is 3 or more wherein each of the adhesion forces is measured by carrying out a 180 DEG peeling test in accordance with JIS Z0237:2000 employing an exposed surface of the adhesive agent layer which is opposed to a side of the adhesive agent layer which faces the base as a surface to be measured and a resin-sealed surface of a semiconductor package as a surface which is to be adhered to the adhesive agent layer.

Description

Cutting piece

The present invention relates to a dicing sheet for use in a semiconductor package in which a resin is packaged to encapsulate a plurality of semiconductor wafers.

A semiconductor component in which a semiconductor wafer is encapsulated by a resin (referred to as a "sealing chip" in this specification) is usually produced as follows. First, the semiconductor wafer is mounted on each of the aggregates in which the plurality of bases are connected by a TAB tape or the like, and the semiconductor wafers are resin-sealed together to obtain an electronic component assembly (in the present specification, it is referred to as "semiconductor assembly". ".). Next, an adhesive sheet including a substrate and an adhesive layer (referred to as a "cut sheet" in the present specification) is attached to one side of the semiconductor package to fix the semiconductor structure to the dicing sheet. The semiconductor structure fixed to the dicing sheet is cut (separated) and sliced, and a plurality of members are disposed in the vicinity of the dicing sheet (cutting step). Typically, the adhesive layer of the dicing sheet is designed to reduce the adhesion of the adhesive layer by specific stimuli, specific stimuli such as, for example, energy line illumination. Then, before the following steps are performed, the step of irradiating the dicing sheet with an energy ray to lower the adhesion of the adhesive layer is included. Next, the dicing sheet of the member is expanded (elongated in the main surface direction) to enlarge the interval of the sealing wafer disposed on the dicing sheet (expansion step). The encapsulating wafer in a state in which the dicing sheets are separated from each other in this manner is individually transferred by the dicing sheet separation (pickup step) to the next step. at this time, The picking step can be facilitated by including a step of lowering the adhesiveness of the above adhesive layer.

Among the series of steps, in the subsequent expansion step of the cutting step, the semiconductor package and the encapsulated wafer are required to be maintained in a state of being fixed to the dicing sheet. From the viewpoint of achieving the object, the adhesive layer of the dicing sheet is adhered to the semiconductor component and the energy ray of the sealing wafer (in the present specification, the term "adhesiveness" means before the energy ray irradiation. Adhesion.) High is better. When the object of the dicing sheet is a semiconductor package and a packaged wafer, the unevenness of the surface to be faced tends to be larger than when the semiconductor wafer is used as a substrate. Therefore, when the dicing sheet using the semiconductor wafer as the object is used for the dicing sheet used in the above-described step of mounting the semiconductor, the adhesion to the object is insufficient, and the semiconductor is cut in the dicing step. In the configuration, a chipping of the sealing film is caused by peeling and scattering of the dicing sheet, or an abnormality such as peeling and scattering of the sealing film when the dicing sheet is stretched in the expanding step. Hereinafter, such abnormalities occurring in the cutting step or the expanding step are collectively referred to as "sealing wafer scattering". For the purpose of reducing the possibility of scattering of the sealant wafer, for example, as described in the literature 1, the adhesive layer applied to the dicing sheet contains a resin material that imparts adhesiveness (referred to as "adhesion-imparting resin" in the present specification. ).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-229040

As the adhesion-imparting resin, a general rosin-based material is a good material from the viewpoint of improving the adhesion of the adhesive layer. However, as a result of detailed study by the present inventors, the rosin-based adhesive imparting resin, if the type or content is unduly controlled, the adhesion of the adhesive layer is dispersed, or the adhesion of the adhesive layer is ensured. The picking step cannot be performed properly. Specifically, in the pickup step, there is a case where an abnormality in which the sealant wafer cannot be picked up occurs. Hereinafter, these abnormalities are collectively referred to as "pickup failure".

An object of the present invention is to provide a dicing sheet which can reduce the possibility of occurrence of abnormality in any of the cutting step, the expanding step and the picking step, and a method of manufacturing the sealing wafer using the dicing sheet.

In order to achieve the above object, the inventors have found that the adhesion of the adhesive layer included in the dicing sheet is imparted to the resin by polymerized rosin ester; at least unequalized rosin ester and petroleum resin. In the adhesion-imparting resin, the content of the polymerized rosin ester is equal to or greater than the predetermined amount, and the ratio (pre/post) of the adhesion force before and after the irradiation of the energy ray is 3 or more. Any of the steps of the expansion step and the pick-up step can reduce the likelihood of an abnormality occurring.

According to the present invention, the dicing sheet of the present invention provides a dicing sheet comprising: a substrate and a dicing sheet of an adhesive layer laminated on at least one of the surfaces of the substrate, wherein the adhesive sheet The agent layer is composed of an adhesive containing an acrylic polymer (A), an energy ray polymerizable compound (B), and an adhesion-imparting resin (C), and the adhesion-imparting resin (C) contains a polymerized rosin ester (C1). At the same time, containing at least unequalized rosin ester (C2) and petroleum resin (C3) The content of the polymerized rosin ester (C1) contained in the above-mentioned adhesive composition is 5 parts by mass or more for 100 parts by mass of the acrylic polymer (A), and the dicing sheet is in the above adhesive layer. The exposed surface on the opposite side to the side opposite to the above-mentioned substrate is used as the measurement target surface, and the adhesion is measured in accordance with JIS Z0237:2000 in the 180° peeling test in accordance with JIS Z0237:2000. The ratio of the adhesive force in the state before the irradiation of the energy ray to the state after the irradiation of the energy ray is 3 or more (Invention 1).

The dicing sheet contains the adhesion-imparting resin (C) as appropriate, and since the adhesive force ratio is 3 or more, abnormalities such as scattering of the sealing wafer or pickup failure are less likely to occur.

In the above invention (Invention 1), the content of the polymerized rosin ester (C1) contained in the adhesive composition is not less than 5 parts by mass and not more than 20 parts by mass based on 100 parts by mass of the acrylic polymer (A). Good (Invention 2). By making it in this range, it is possible to reduce the possibility of occurrence of a decrease in the adhesion or adhesion ratio of adhesion, and it is also possible to easily obtain an adhesive layer which improves the adhesion of the adhesive layer.

In the above invention (Inventions 1 and 2), the total content of the content of the uneven rosin ester (C2) and the content of the petroleum resin (C3) contained in the above adhesive composition is the same as the above acrylic polymer (A). It is preferable that the mass portion is 100 mass parts or more (invention 3). The content of the heterogeneous rosin ester (C2) and the petroleum resin (C3) plus the function as an adhesion-imparting resin also have the function of improving the compatibility of the rosin ester (C1) with the acrylic polymer (A). When the above content is satisfied, the function of enhancing such compatibility can be exhibited more stably.

In the above invention (Inventions 1 to 3), in which energy ray polymerization is achieved The compound (B) is preferably a low molecular weight compound (B1) containing an energy ray polymerizable group having a weight average molecular weight (Mw) of 100 or more and 30,000 or less (Invention 4). The low molecular weight compound (B1) is one or more selected from the group consisting of a monofunctional monomer having an energy ray polymerizable group, a polyfunctional monomer, and an oligomer of the monomers. By containing the low molecular weight compound (B1), the possibility of lowering the stability of the composition of the adhesive layer can be reduced, and since the low molecular weight compound (B1) can have the same function as the adhesion imparting resin (C), it is easier to improve. Adhesion of the adhesive layer.

According to the invention (Invention 4), the content of the low molecular weight compound (B1) contained in the energy ray polymerizable group of the above-mentioned adhesive composition is 50 parts by mass or more for 100 parts by mass of the acrylic polymer (A). 150 mass parts or less is preferable (Invention 5). By setting the content of the low molecular compound (B1) having an energy ray polymerizable group within the above range, the adhesive layer can be plasticized by irradiating the energy ray, and the adhesive layer can be plasticized. The effect of the adhesion enhancement is more prominently exerted. Further, it is possible to prevent an abnormality due to a decrease in the compatibility of the respective components of the adhesive layer.

In the above invention (Inventions 1 to 5), it is preferred that the above-mentioned adhesive composition contains a bridging agent which can bridge the reaction with the above acrylic polymer (Invention 6). At this time, the adhesive layer formed of the adhesive composition has a functional group which should react with the acrylic polymer (A) as a bridging agent (in the present specification, a functional group which can react with the bridging agent is also referred to as "Reactive functional group". Contains a bridge that can be bridged with a bridging agent. By adjusting the bridging structure of the bridging structure (consisting of reactive functional groups - bridging agent - reactive functional groups), adhesion The presence density in the agent layer (also referred to as "bridge bridging density" in this specification), The characteristics of the adhesiveness before the energy ray of the adhesive layer are controlled.

In the above invention (Inventions 1 to 6), the thickness of the above-mentioned adhesive layer is preferably 5 μm or more and 35 μm or less (Invention 7). When the thickness is within this range, the dispersion of the adhesiveness of the adhesive layer can be reduced, and the adhesion is difficult to be in the above range, and the possibility that the adhesive layer is broken inside during the pickup is likely to occur. .

In the above invention (Inventions 1 to 7), it is preferred that the surface of the base material on the side of the pressure-sensitive adhesive layer has one or more components selected from the group consisting of a carboxyl group and a group of ions and salts thereof. (Invention 8). By the chemical interaction of the component with the component of the adhesive layer, the possibility of peeling between the substrate and the adhesive layer can be reduced.

The surface of the adhesive layer opposite to the substrate is preferably adhered to the resin package surface of the semiconductor package of the resin-molded semiconductor wafer (Invention 9). By adhering the surface of the adhesive layer to the opposite side of the substrate to the above-mentioned surface, a suitable function as a dicing sheet can be achieved.

According to a second aspect of the present invention, in a method of producing a sealant wafer, the surface of the dicing sheet of any one of the inventions (Inventions 1 to 9) is adhered to a semiconductor package. On the resin package surface, the semiconductor package on the dicing sheet is cut and sliced to obtain a plurality of encapsulated wafers (Invention 10).

In this manufacturing method, since the sealing of the sealing wafer and the pickup failure are less likely to occur in the process, it is possible to manufacture a high-quality and cost-effective sealing film.

According to the present invention, it is possible to provide a cutting piece which can reduce the possibility of occurrence of an abnormality in any of the cutting step, the expanding step and the picking step. Further, by using the dicing sheet, it is possible to manufacture a high-quality and cost-effective gelatinized wafer.

1‧‧‧ cutting piece

2‧‧‧Substrate

3‧‧‧Adhesive layer

Figure 1 is a schematic cross-sectional view of a cutting piece according to an embodiment of the present invention

Hereinafter, embodiments of the present invention will be described.

As shown in Fig. 1, a dicing sheet 1 according to an embodiment of the present invention includes a base material 2 and an adhesive layer 3.

Substrate

The base material 2 of the dicing sheet 1 of the present embodiment is not particularly limited as long as the expansion step or the pick-up step is not broken, and is usually composed of a film made of a resin-based material as a main material. Specific examples of the film include a polyethylene film, a polypropylene film, and a polybutylene film of a low density polyethylene (LDPE) film, a linear low density polyethylene (LLDPE) film, a high density polyethylene (HDPE) film, and the like. a polyolefin film such as a polybutadiene film, a polymethylpentene film, an ethylene-norbornene copolymer film, a norbornene resin film, or a polyvinyl chloride film or a vinyl chloride copolymer film. Film; polyester film such as polyethylene terephthalate film or polybutylene terephthalate film; polyurethane film; polyimine film; ionomer resin film, ethylene-vinyl acetate a copolymer film of an ester, an ethylene-(meth)acrylic copolymer film, an ethylene-based (meth)acrylate copolymer film, or the like; a polystyrene film; A polycarbonate film; a fluororesin film; and a film of a hydrogenated product and a denatured product of the resins as a main material. Further, such bridge film or copolymer film can also be used. The base material 2 may be used alone or in combination of two or more layers. In addition, the term "(meth)acrylic acid" as used herein means both of acrylic acid and methacrylic acid. The same is true for other similar terms.

The base material 2 may contain various additives such as a pigment, a flame retardant, a plasticizer, a charge preventing agent, a lubricant, a filler, and the like in the film of the resin material as a main material. The pigment may, for example, be titanium dioxide, carbon black or the like. Further, the filler may, for example, be an organic material such as a melamine resin, an inorganic material such as a vapor phase cerium oxide or a metal material such as nickel particles. The content of such an additive is not particularly limited, and should be retained in a range in which the substrate 2 can exhibit a desired function without losing smoothness and flexibility.

When ultraviolet rays are used as the energy ray for curing the adhesive layer 3, the substrate 2 preferably has transparency to ultraviolet rays. Further, when an electron beam is used as the energy ray, the substrate 2 preferably has electron beam penetration.

Further, the surface of the base material 2 on the side of the adhesive layer 3 (hereinafter also referred to as "the base material is surfaced") has one or two kinds selected from the group consisting of a carboxyl group and its ions and salts. The above ingredients are preferred. This component of the substrate 2 and the component of the adhesive layer 3 (which may be used as a component constituting the adhesive layer 3 and a bridging agent to form the adhesive layer 3) may be chemically interacted. Reduce the likelihood of peeling between these. There is no particular limitation on the specific method in which such a component is present on the substrate. For example, the substrate 2 itself may be a constituent monomer of a resin which is a material of an ethylene-(meth)acrylic copolymer film or an ionomer resin film, and has a carboxyl group, and an ion thereof and a salt thereof. By. The substrate 2 may be, for example, a polyolefin-based film, and the substrate may be subjected to a corona treatment or a primer layer. Further, various coating films may be provided on the surface of the substrate 2 opposite to the surface on which the substrate is placed.

The thickness of the substrate 2 is not limited as long as it can function properly in the above steps as long as the dicing sheet 1 is used. It is preferably 20 to 450 μm, more preferably 25 to 200 μm, and particularly preferably in the range of 50 to 150 μm.

The breaking elongation of the substrate 2 of the present embodiment is preferably 100% or more at 23 ° C and a relative humidity of 50%, particularly preferably 200% or more, and preferably 1000% or less. The base material 2 having a breaking elongation of 100% or more is not easily broken during the expansion step, and it is easy to separate the device wafer formed by the member related to the cutting device. Further, the breaking elongation is in accordance with the tensile test of JIS K7161:1994, and the elongation of the length of the test piece at the time of breaking of the test piece to the original length.

Further, the tensile stress at the 25% deformation measured by the test according to JIS K7161:1994 of the substrate 2 of the present embodiment is preferably 5 N/10 mm or more and 15 N/10 mm or less, and the maximum tensile stress is 15 MPa or more and 50 MPa or less. It is better. When the tensile stress at 25% deformation is less than 5 N/10 mm, or the maximum tensile stress is less than 15 MPa, the semiconductor structure is adhered to the dicing sheet 1, and when it is fixed to a ring frame or the like, it is caused by the softness of the substrate 2 Slack, which is the cause of the transmission error. On the other hand, when the tensile stress at 25% deformation exceeds 15 N/10 mm, or the maximum tensile stress is less than 50 MPa, the load applied during the expansion step becomes large, and the cut piece 1 itself is peeled off by the annular frame. The problem. It is the breaking elongation of the present invention, the tensile stress at 25% deformation, and the maximum The tensile stress is a value measured for the long direction of the substrate.

2. Adhesive layer

The adhesive layer 3 included in the dicing sheet 1 of the present embodiment is an adhesive containing an acrylic polymer (A), an energy ray polymerizable compound (B), and an adhesive resin (C) as described below. The composition of the composition.

(1) Acrylic polymer (A)

The adhesive composition of the adhesive layer 3 of this embodiment is formed, and the acrylic polymer (A) is contained. In the adhesive layer 3 formed of the adhesive composition, the acrylic polymer (A) may also contain a bridge having at least a part of a bridging reaction with a bridging agent to be described later. In the present specification, a functional group capable of bridging a bridging agent is also referred to as a "reactive functional group". The acrylic polymer (A) does not necessarily have to have a reactive functional group. However, when the acrylic polymer (A) has a reactive functional group, it is preferable to form a bridging agent with the bridging agent as described above. Further, the type of the reactive functional group may be set according to the type of the bridging agent.

As the acrylic polymer (A), a conventionally known acrylic polymer can be used. The weight average molecular weight (Mw) of the acrylic polymer (A) is preferably 10,000 or more and 2,000,000 or less, more preferably 100,000 or more and 1.5 million or less. Further, the glass transition temperature Tg of the acrylic polymer (A) is preferably -70 ° C or more and 30 ° C or less, more preferably -60 ° C or more and 20 ° C or less.

The acrylic polymer (A) may be a single polymer composed of one type of acrylic monomer, or may be a copolymer of a plurality of acrylic monomers, or may be one or more acrylic monomers. a copolymer of a monomer and a monomer other than the acrylic monomer. Specific species of compounds that become acrylic monomers The class is not particularly limited, and specific examples thereof include (meth)acrylic acid, (meth)acrylic acid ester, and a derivative thereof (acrylonitrile or the like). Further, specific examples of the (meth) acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and butyl (meth)acrylate. (meth) acrylate having a chain skeleton such as 2-ethylhexyl acrylate; cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, ( Rings of dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, quinone acrylate, etc. a (meth) acrylate having a hydroxyl group such as 2-hydroxyethyl (meth)acrylate or 2-hydroxypropyl (meth)acrylate; A (meth) acrylate having a reactive functional group other than a hydroxyl group such as glycidyl acrylate or N-methylaminoethyl (meth)acrylate. Further, examples of the monomer other than the acrylic monomer include an olefin such as ethylene or norbornene, vinyl acetate, and styrene. Further, when the acrylic monomer is an alkyl (meth)acrylate, the carbon number of the alkyl group is preferably in the range of 1 to 18.

The adhesive composition of the adhesive layer 3 of the present embodiment is a reactive functional group of the acrylic polymer (A) when the bridging agent capable of bridging the acrylic polymer (A) is contained as will be described later. The type of the base is not particularly limited, and may be appropriately determined based on the type of the bridging agent. For example, when the bridging agent is a polyisocyanate compound, the reactive functional group which the acrylic polymer (A) has may be a hydroxyl group, a carboxyl group, an amine group or the like. The functional groups having such polarities have an effect of improving the compatibility of the acrylic polymer (A) and the adhesion-imparting resin (C) in addition to the function of reacting with the bridging agent. Among these, when the bridging agent is a polyisocyanate compound, a hydroxyl group having high reactivity with an isocyanate group is used as a reactivity. The functional group is preferred. The method of introducing a hydroxyl group into the acrylic polymer (A) as a reactive functional group is not particularly limited. For example, the acrylic polymer (A) may contain a constituent unit of a hydroxy group having a hydroxyl group such as 2-hydroxyethyl (meth)acrylate in the skeleton.

(2) Energy ray polymerizable compound (B)

The energy ray polymerizable compound (B) which is contained in the adhesive composition of the pressure-sensitive adhesive layer 3 of the present embodiment can be polymerized by irradiation with energy rays such as ultraviolet rays or electron beams as long as it has an energy ray polymerizable group. The specific configuration of the reaction is not particularly limited. By polymerizing the energy ray polymerizable compound (B), the adhesiveness of the adhesive layer 3 is lowered, and the workability of the picking step can be improved.

The type of the energy ray polymerizable group is not particularly limited. Specific examples thereof include a functional group such as a vinyl group or an ethylenically unsaturated bond such as a (meth)acryl fluorenyl group. From the viewpoint of excellent polymerization reactivity, the energy ray polymerizable group is preferably a functional group having an ethylenically unsaturated bond, and the (meth) acrylonitrile group is more preferable from the viewpoint of high reactivity when irradiating the energy ray. good.

The energy ray polymerizable compound (B) can be roughly classified into a low molecular weight compound having an energy ray polymerizable group (in the present specification, simply referred to as "low molecular weight compound") (B1), and has a main chain or a side chain. An energy ray-curable polymer (B2) composed of a polymer having an energy ray polymerizable group. Regarding the adhesive layer 3 of the present embodiment, any of these may be used or used in combination.

i) Low molecular weight compound (B1)

When the energy ray polymer (B) contains the low molecular weight compound (B1), the low molecular weight compound (B1) can plasticize the adhesive layer 3 in the same manner as the adhesion imparting resin (C) described later, so that the adhesive can be easily lifted. Adhesion of layer 3. Low molecular weight compound (B1) may be composed of one type of compound or a plurality of types of compounds. The low molecular weight compound (B1) may have one (monofunctional) or one (multifunctional) energy ray polymerizable group in molecular equivalents. Further, the low molecular weight compound (B1) may have a molecular weight called a so-called oligomer (a compound having 10 to 100 constituent units derived from a monomer), and the molecular weight thereof is preferably 100 or more and 30,000 or less. When the molecular weight of the low molecular weight compound (B1) is too small, it is volatilized during the production process, and the stability of the adhesive layer 3 is lowered. On the other hand, when the molecular weight of the low molecular weight compound (B1) is too large, it is difficult to obtain a function of plasticizing the adhesive layer 3. The molecular weight of the low molecular weight compound (B1) is preferably 200 or more and 20,000 or less in terms of weight average molecular weight (Mw), from the viewpoint that the possibility of reducing the volatilization in the production process and the function of improving the plasticization of the adhesive layer 3 are stably performed. It is more preferably 300 or more and 10,000 or less, and particularly preferably 300 or more and 4,000 or less.

The specific composition of the above low molecular weight compound (B1) is not particularly limited. Specific examples thereof include trimethylolpropane tri(meth)acrylate, tetramethylolmethanetetra(meth)acrylate, pentaerythritol tris(meth)acrylate, and penta(meth)acrylic acid. Pentaerythritol monohydroxy ester, diisopentyl hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate An alkyl (meth)acrylate having a chain skeleton such as an ester; a cyclic skeleton having dicyclopentadienyl dimethoxy di(meth)acrylate or isobornyl (meth)acrylate; Alkyl (meth)acrylate; polyethylene glycol di(meth)acrylate, oligoester (meth)acrylate, urethane (meth)acrylate oligomer, epoxy degeneration (A An acrylate-based compound such as an acrylate or a polyether (meth) acrylate. Among these, the acrylate-based compound is polymerized by acrylic acid. The compatibility of the compound (A) is high and preferably.

The low molecular weight compound (B1) is preferably one having three or more energy ray polymerizable groups in one molecule. The adhesive layer 3 of the present invention contains a polymerized rosin ester (C1) as described later, but since the polymerized rosin ester (C1) has an unsaturated carbon-carbon double bond bond, it hinders the low molecular weight compound (B1). The case of polymerization of energy-line polymerizable groups. However, the low molecular weight compound (B1) has an energy ray polymerizable group in one molecule as described above, and can be efficiently polymerized, and it is easy to adjust the adhesion ratio of the dicing sheet 1 to be described later. The scope. In particular, when the low molecular weight compound (B1) has five or more energy ray polymerizable groups in one molecule, even if the blending amount of the low molecular weight compound (B1) is not excessively large, the polymerization can be efficiently carried out. And better.

Further, the number of the energy ray polymerizable groups of the low molecular weight compound (B1) in one molecule is n, the weight average molecular weight of the low molecular weight compound (B1) is M, and n is divided by the value of M by n/M. It is preferably 1 × 10 ^-4 or more. When the n/M is in the range as described above, even if the adhesive layer 3 contains the polymerized rosin ester (C1), the polymerization can be carried out efficiently, and the adhesion ratio of the dicing sheet 1 to be described later can be easily adjusted to a preferable range. In particular, when n/M is 1 × 10 ^-3 or more, even if the amount of the low molecular weight compound (B1) is not excessively large, the polymerization can be carried out efficiently and more preferably. The pressure-sensitive adhesive layer 3 is controlled in terms of handling during storage, and the upper limit of the preferable range of n/M is about 5 × 10 ^-2 .

The content of the low molecular weight compound (B1) of the adhesive composition of the adhesive layer 3 of the present embodiment is preferably 50 parts by mass or more and 300 parts by mass or less based on 100 parts by mass of the acrylic polymer (A). More than 75 mass parts and more than 150 mass parts are better. In addition, in the present specification, the meaning of the "mass portion" of the content of each component is the amount of the solid component. By setting the content of the low molecular weight compound (B1) in such a range, the density of the energy ray polymerizable group in the adhesive layer 3 can be appropriately set, and the adhesiveness of the adhesive layer 3 can be appropriately lowered by irradiating the energy ray. By using this component, the adhesive layer 3 can be plasticized, and the effect of improving the adhesion is more prominently exhibited. On the other hand, an abnormality in the decrease in the compatibility of the acrylic polymer (A) and the adhesion-providing resin (C) to be described later is less likely to occur. As a result, it is possible to prevent the adhesion of the adhesive layer 3 from being dispersed, or to locally generate a portion having a low concentration of the energy ray polymerizable compound (B) in the vicinity of the interface between the adhesive layer 3 and the object, and to cut the later-described portion. The adhesion of the sheet 1 cannot be sufficiently raised. Further, the above n/M is also considered to be a content of the low molecular weight compound (B1) for forming the adhesive composition of the adhesive layer 3 of the present embodiment, and 100 parts by mass for the acrylic polymer (A). The content of the product of the above-mentioned n/M is preferably 1.0 × 10 ^-1 or more and 15 or less, and more preferably 1.5 × 10 ^-1 or more and 5 or less, and more preferably 3.0 × 10 ^-1 or more. The content below 1.0 is particularly good.

Ii) energy line hardening polymer (B2)

The specific structure of the energy ray-curable polymer (B2) is not limited, and the acrylic polymer has an acrylic polymer (A) when it has a constituent unit of an energy ray-polymerizable group in a main chain or a side chain. nature. Therefore, the manufacturing steps of the adhesive layer 3 can be simplified, and there is an advantage that it is easy to control the existence density of the energy ray polymerizable group of the adhesive layer 3 and the like. Further, in this case, an acrylic polymer (A) may be additionally contained. In addition, when the energy ray-curable polymer (B2) has the properties of the acrylic polymer (A), it is used to specify the low molecular weight compound (B1) or an adhesion-providing resin (C) to be described later, and the like. The content of the components other than the acrylic polymer (A) of the adhesive composition of the adhesive layer 3 is in an appropriate range In the meantime, the "acrylic polymer (A) 100 parts by mass" means the content of the acrylic polymer (A) and the energy ray-curable polymer (B2) having the properties as the acrylic polymer (A). The total content is 100 parts by mass. When the energy ray-curable polymer (B2) has properties as the acrylic polymer (A), the total amount of the acrylic polymer (A) may be an energy ray-curable polymer (B2). At this time, the energy ray-curable polymer (B2) and the energy ray polymerizable group may have a reactive functional group. At least a portion of the reactive functional groups possessed by the energy ray-curable polymer (B2) may also be bridged with a bridging agent.

The energy ray-curable polymer (B2) is a polymer having an energy ray-polymerizable group, and has a weight average molecular weight (Mw) of more than 30,000. In the same manner as the acrylic polymer (A), the energy ray-curable polymer (B2) has an effect of maintaining the agglomeration property of the adhesive layer which is a general function of the adhesive main component, and the effect is higher in molecular weight. Can be more played. On the other hand, when the molecular weight of the energy ray-curable polymer (B2) is too large, there is a possibility that the problem that it is difficult to form a thin layer when the pressure-sensitive adhesive layer 3 is produced becomes high. Therefore, the weight average molecular weight of the energy ray-curable polymer (B2) is preferably from 100,000 to 2,000,000, and more preferably from about 150,000 to about 1.5 million.

When the energy ray-curable polymer (B2) has a constituent unit based on (meth) acrylate, it can be prepared, for example, by the following method. A functional group containing a hydroxyl group, a carboxyl group, an amine group, a substituted amino group, an epoxy group or the like, and a copolymer of a (meth) acrylate-based constituent unit and a copolymer containing a constituent unit based on an alkyl (meth) acrylate. a polymer having a substituent reactive with the above functional group and an energy ray-polymerizable group (for example, a group having an ethylenic double bond) having 1 to 5 compounds per molecule, which can be added to the above acrylic polymer An energy line polymerizable group.

The energy rays for curing the energy ray polymerizable compound (B) include ionizing radiation, X-rays, ultraviolet rays, and electron beams. Among these, it is preferable to use ultraviolet rays of an irradiation device which is relatively easy to introduce.

When ultraviolet rays are used as the ionizing radiation, it is sufficient to use near-ultraviolet rays including ultraviolet rays having a wavelength of about 200 to 380 nm from the ease of handling. Amount of ultraviolet light, according to the kind as long as energy ray-polymerizable compound (B), or the thickness of the adhesive agent layer 3 is appropriately selected, generally 50 ~ 500mJ / cm ² or so, to 100 ~ 450mJ / cm ² preferably, 200 to 400 mJ/cm ^{2 is more} preferable. Further, the intensity of ultraviolet, generally 50 ~ 500mW / cm ^2, and at 100 ~ 450mW / cm ² preferably, to 200 ~ 400mW / cm ² more preferably. The ultraviolet source is not particularly limited, and for example, a high pressure mercury lamp, a metal halide lamp, or the like can be used.

When an electron beam is used as the ionizing radiation, the acceleration voltage is preferably selected in accordance with the type of the energy ray polymerizable compound (B) or the thickness of the adhesive layer 3, and the acceleration voltage is usually preferably from 10 to 1000 kV. In addition, the irradiation dose may be set in a range in which the energy ray polymerizable compound (B) is appropriately cured, and is usually selected in the range of 10 to 1000 krad. There are no special restrictions on the source of the electron, such as the Cockcroft-Walton type, the Van-de-Graaff type, the resonant transformer type, the insulated core transformer type or the linear type. Various electron line accelerators such as Dynamitron type and high frequency wave type.

(3) Adhesion-imparting resin (C)

The adhesive composition for the adhesive layer 3 of the present embodiment may contain a polymerized rosin ester (C1) as the adhesion-imparting resin (C), and may contain a heterogeneous rosin ester (C2) and a petroleum resin (C3). At least one of them. Adhesive imparting resin (C) composed of an oligomer containing a molecular weight of several hundreds to several thousands, an adhesive The adhesion of layer 3 will increase.

The content of the adhesion-imparting resin (C) of the adhesive composition of the adhesive layer 3 of the present embodiment can be appropriately set according to the adhesiveness of the adhesive layer 3 or the like. In the basic tendency, when the content of the adhesion-imparting resin (C) is too small, it is difficult to improve the adhesion, and when the content is too large, the compatibility with the acrylic polymer (A) or the energy ray-polymerizable compound (B) is lowered. The adhesion to the adhesive layer is dispersed, or the possibility of an abnormality such as a decrease in the adhesive force ratio of the dicing sheet 1 is increased. The content of the adhesion-imparting resin (C) of the adhesive composition of the adhesive layer 3 is formed so that the adhesiveness is easily in an appropriate range, and the mass of the acrylic polymer (A) is 100 mass parts, and the mass is 55 mass parts or more. The following is preferred, and it is better to have a mass of 100 or more and 175 mass or less.

The specific type of the polymerized rosin ester (C1) is not particularly limited. As long as it is a rosin polymerization (dimerization) in which a mixture of rosin acid and a mixture thereof is a main component, and chemically stabilized by partial esterification of a carboxyl group, the type of the esterified alcohol (exemplified by glycerin) , isopentaerythritol, etc.) etc. are arbitrary. Specific examples of the polymerized rosin ester (C1) include "PENSEL D125", "PENSEL D135", and "PENSEL D160" manufactured by Arakawa Chemical Industries Co., Ltd.

The content of the polymerized rosin ester (C1) of the adhesive composition of the adhesive layer 3 of the present embodiment is formed from the viewpoint of stably increasing the adhesion of the adhesive layer containing the adhesion-imparting resin (C). The acrylic polymer (A) has a mass portion of 100 parts by mass or more. When the content is less than 5 parts by mass, it is difficult to obtain an effect of improving the adhesion based on the polymerized rosin ester (C1). On the other hand, when the content of the polymerized rosin ester (C1) is too large, the compatibility between the polymerized rosin ester (C1) and the acrylic polymer (A) is likely to be lowered, and the adhesive is added. The adhesion of the layer 3 is discrete, or the adhesion of the dicing sheet 1 is liable to decrease. Therefore, the content of the polymerized rosin ester (C1) of the adhesive composition of the adhesive layer 3 of the present embodiment is preferably 20 parts by mass or less for 100 parts by mass of the acrylic polymer (A). The content of the polymerized rosin ester (C1) of the adhesive composition of the adhesive layer 3 is formed by the possibility of reducing the possibility of dispersion of adhesion and the improvement of adhesion more stably, and the acrylic polymer (A) The mass portion is preferably 8 parts by mass or more and 18 parts by mass or less, and more preferably 10 parts by mass or more and 15 parts by mass or less.

Both the heterogeneous rosin ester (C2) and the petroleum resin (C3) have a function as an adhesion-imparting resin, and also have a function of improving the compatibility of the polymerized rosin ester (C1) with the acrylic polymer (A). Therefore, when the difference between the SP values of the acrylic polymer (A) and the polymerized rosin ester (C1) is large, both of the uneven rosin ester (C2) and the petroleum resin (C3) are contained, and the adhesive layer 3 is provided. The adhesion of the adhesive sheet is small, and the adhesion of the dicing sheet 1 is improved.

The acrylic polymer is polymerized by the sum of the content of the uneven rosin ester (C2) and the content of the petroleum resin (C3) contained in the adhesive composition forming the adhesive layer 3 from the viewpoint of more stably exhibiting the above functions. The mass of the object (A) is preferably 50 parts by mass or more, more preferably 80 parts by mass or more, and particularly preferably 100 parts by mass or more. The upper limit of the sum of the content of the uneven rosin ester (C2) and the content of the petroleum resin (C3) contained in the adhesive composition for forming the adhesive layer 3 is based on the adhesive layer 3 which should satisfy the adhesiveness or the like. In the case where the amount of the acrylic polymer (A) is 100 parts by mass, it is preferably 200 parts by mass or less, and more preferably 170 parts by mass or less. The range of the content of the uneven rosin ester (C2) and the petroleum resin (C3) which form the adhesive composition of the adhesive layer 3 is not particularly limited. In any one of the 100 parts of the acrylic system polymer (A), it is preferably 25 parts by mass or more and 140 parts by mass or less.

The specific composition and the like of the heterogeneous rosin ester (C2) are not particularly limited. Specific examples thereof include "Super Ester A100" and "KE656" manufactured by Arakawa Chemical Industries Co., Ltd. On the other hand, the specific type of the petroleum-based resin (C3) is not particularly limited, and is a C ₅ -based petroleum resin, a C ₉ -based petroleum resin, a C ₅ /C ₉ -based petroleum resin, and the like. Further, as a specific example, Mitsui Chemicals Co., Ltd. manufactures "FTR6100", "FTR7100", and "FTR8100".

When the adhesive composition of the adhesive layer 3 is formed, including the low molecular weight compound (B1) having an energy ray polymerizable group, the compound can exhibit adhesion and adhesion to the resin due to the adhesive layer 3 formed of the adhesive composition. In the case of the same function (plasticization of the adhesive layer 3), the sum of the content of the low molecular weight compound (B1) having the energy ray polymerizable group and the content of the adhesion imparting resin (C), and the acrylic polymer (for the acrylic polymer ( A) The mass portion of 100 parts is preferably 165 parts by mass or more and 400 parts by mass or less, more preferably 190 parts by mass or more and 300 parts by mass or less, and more preferably 200 parts by mass or more and 275 parts by mass or less.

(4) bridging agent

The adhesive composition for forming the adhesive layer 3 of the present embodiment may contain a bridging agent reactive with the acrylic polymer (A) as described above. At this time, the adhesive layer 3 of the present embodiment contains a bridge material obtained by bridging the acrylic polymer (A) and the bridging agent. Examples of the bridging agent include a polyethylenimine compound such as an epoxy compound, an isocyanate compound, a metal chelate compound, or an aziridine compound, a melamine resin, a urea resin, a dialdehyde, and a methylol group. A polymer, a metal alkoxide, a metal salt or the like. The Among them, the bridging agent is preferably a polyisocyanate compound for the reason that the bridging reaction or the like is easily controlled.

Here, the polyisocyanate compound will be described in some detail. The polyisocyanate compound is a compound having two isocyanate groups per molecule, and examples thereof include aromatic polyisocyanates such as tolyl diisocyanate, diphenyl diisocyanate, and xylyl diisocyanate; and dicyclohexylmethane-4, 4' - an alicyclic isocyanate compound such as diisocyanate, dicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexene diisocyanate, methyl cyclohexylene diisocyanate or hydrogenated xylylene diisocyanate; An isocyanate having a chain skeleton such as methylene diisocyanate, trimethylhexamethylene diisocyanate or lysine diisocyanate.

Further, a biuret or isocyanurate of these compounds or a compound thereof may be used, and a non-aromatic low molecular active hydrogen such as ethylene glycol, trimethylolpropane or castor oil may be contained. A denatured product such as an adduct of a reactant of a compound. The polyisocyanate compound may be used singly or in combination of plural kinds.

When the adhesive layer 3 of the present embodiment has a bridging material based on the acrylic polymer (A) and the bridging agent, it is possible to control the adhesiveness of the adhesive layer 3 before the irradiation of the energy ray by adjusting the bridging density. Therefore, the bridging density can be appropriately set according to the characteristics of the adhesive layer 3 as required. Further, when the adhesive composition for forming the adhesive layer 3 of the present embodiment contains a bridging agent, it is preferred to contain an appropriate bridging promoter depending on the type of the bridging agent. For example, when the bridging agent is a polyisocyanate compound, the adhesive composition for forming the adhesive layer 3 contains an organometallic compound such as an organometallic compound. The agent is better.

(5) Other ingredients

The adhesive composition for forming the adhesive layer 3 included in the dicing sheet 1 of the present embodiment, and the above-mentioned components may also contain a coloring material such as a photopolymerization initiator, a dye or a pigment, and a flame retardant. Various additives such as fillers.

Here, the photopolymerization initiator is explained in some detail. The photopolymerization initiator may, for example, be a photoinitiator such as a benzoin compound, an acetophenone compound, a mercaptophosphine oxide compound, a titanocene compound, a thioxanthone compound or a peroxide compound, or an amine or an anthracene. A sensitizer or the like, specifically, 1-hydroxycyclohexyl benzophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide Benzene oxime isobutyronitrile, dibenzyl, hydrazine, β-chloropurine, 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, and the like. When ultraviolet rays are used as the energy ray, the irradiation time and the amount of irradiation can be reduced by blending the photopolymerization initiator.

(6) physical properties, shape, etc.

i) adhesion ratio

In the present specification, the adhesive force ratio is a semiconductor-mounted surface in which the exposed surface on the opposite side to the side facing the substrate 2 of the adhesive layer 3 included in the dicing sheet 1 of the present embodiment is used as a measurement target surface. The adhesive surface of the resin packaged surface is the adhesion of the dicing sheet 1 measured by the peeling test at 180° in accordance with JIS Z0237:2000, and the adhesion force before the energy ray irradiation (hereinafter, also referred to as "adhesion before irradiation" """) The ratio of the adhesion (hereinafter, also referred to as "adhesion after irradiation") to the state after the irradiation of the energy ray (previous/post). The adhesive force ratio of the dicing sheet 1 of the present embodiment is 3 or more. By making the adhesion ratio in the van In addition, it is possible to reduce the possibility that the sealing film is scattered in the cutting step or the expanding step, and the possibility of picking up in the picking step may be reduced. When the adhesion is less than 3, it is difficult to maintain the high adhesion force before the irradiation, so that the sealing film is likely to be scattered, or it is difficult to maintain the low adhesion after the irradiation, and the pickup failure is likely to occur. From the viewpoint of more stably reducing the scattering of the sealant wafer and/or the possibility of picking up defects, the adhesive force ratio is preferably 4.5 or more, more preferably 8.0 or more. The adhesive force is not particularly set, and the degree of volume shrinkage of the adhesive layer 3 by hardening by the energy ray is positively correlated with the adhesive force ratio, so when the adhesive force ratio is too high, The abnormality of the movement of the sealant wafer during the hardening of the adhesive layer 3 occurs. Therefore, in general, the adhesive force is preferably 20 or less, more preferably 13 or less, and particularly preferably 10 or less.

Furthermore, the appropriate range of adhesion before irradiation and adhesion after irradiation should be appropriately set according to the material of the semiconductor structure or the surface state (degree of unevenness, etc.) according to the specific conditions of the cutting step, the expanding step and the picking step. . Generally, the adhesion before irradiation is preferably 2000 mN/25 mm or more, more preferably 2500 mN/25 mm or more. Further, the adhesion after the irradiation is preferably 600 mN/25 mm or less, more preferably 400 mN/25 mm or less, and particularly preferably 300 mN/25 mm or less.

Ii) thickness

The thickness of the adhesive layer 3 included in the dicing sheet 1 of the present embodiment is not particularly limited. When it is too thin, there is a problem that the dispersion of the adhesiveness of the adhesive layer becomes large. When the thickness is too thick, the adhesion is too high, and it is difficult to control the adhesion ratio of the dicing sheet 1 to the above range, or at the time of picking up. The possibility of agglomeration failure inside the adhesive layer 3 becomes high, and the adhesive residue rate (the definition of the definition etc. will be It is described in the examples. ) become higher. The thickness of the adhesive layer 3 is preferably 2 μm or more and 50 μm or less, more preferably 5 μm or more and 35 μm or less, more preferably 5 μm or more and 20 μm or less, and more preferably 5 μm or more and 15 μm or less from the viewpoint of stably reducing the possibility of such a problem. Especially good. When the thickness of the adhesive layer 3 is 20 μm or less, the adhesive residue ratio can be made particularly low, and when the thickness of the adhesive layer 3 is 15 μm or less, the adhesive retention rate can be made 20% or less.

Iii) peeling sheet

The dicing sheet 1 of the present embodiment may be applied to the side opposite to the substrate with the adhesive layer 3 for the purpose of protecting the adhesive layer 3 until the adhesive 3 is adhered to the semiconductor package of the object. The opposite side of the face, adhered to the peeling surface of the release sheet. The configuration of the release sheet is arbitrary, and a case where the plastic film is applied as a release agent or the like can be exemplified. Specific examples of the plastic film include a polyester film such as polyethylene terephthalate, polybutylene terephthalate or polyethylene naphthalate, or polyethylene or polypropylene. Polyolefin film. As the release agent, an anthrone, a fluorine-based or a long-chain alkyl group is used, and among these, an anthrone which is inexpensive and stable can be preferably used. Instead of the plastic film of the release sheet, a paper substrate such as cellophane, coated paper, or high-quality paper may be used, or a laminated paper of a thermoplastic resin such as polyethylene may be laminated on the paper substrate. The thickness of the release sheet is not particularly limited, but is usually about 20 μm or more and 250 μm or less.

3. Manufacturing method of cutting piece

The method for producing the dicing sheet 1 is not particularly limited as long as the adhesive layer 3 formed of the above-described adhesive composition can be laminated on the substrate 2. As an example, a coating liquid containing the above-described adhesive composition and further containing a solvent as desired is prepared on one side of the substrate 2 by a die coater, The coating liquid is applied to form a coating film by a curtain coater, a spray coater, a slit coater, a knife coater, etc., and the coating film on the one side is dried to form the adhesive layer 3. The coating liquid is not particularly limited as long as it can be applied, and the component for forming the adhesive layer 3 may be contained as a solute, or may be contained as a dispersoid.

When the adhesive composition contains a bridging agent, the acrylic polymer (A) in the coating film is bridged with the bridging agent by changing the drying conditions (temperature, time, etc.) or by additionally providing heat treatment for bridging. The bridging structure may be formed in the adhesive layer 3 at a desired density of existence. In order to sufficiently carry out the bridging reaction, the adhesive sheet 3 may be laminated on the substrate 2 by the above method, and the obtained dicing sheet 1 may be allowed to stand for several days, for example, at 23 ° C and a relative humidity of 50%. Mature.

Alternatively, the coating liquid may be applied to the release surface of the release sheet to form a coating film, which is dried to form a laminate composed of the adhesive layer 3 and the release sheet, and the adhesive layer of the laminate is placed. 3 The substrate adhered to the substrate 2 on the side opposite to the side opposite to the release sheet was faced, and a laminate of the dicing sheet 1 and the release sheet was obtained. The release sheet in the laminate may be peeled off as a step material or may be adhered to the adhesive layer 3 until it is adhered to the semiconductor package.

4. Method for manufacturing gelatinized wafer

A method of manufacturing a sealant wafer from a semiconductor package using the dicing sheet 1 of the present embodiment will be described below.

In the semiconductor package, a semiconductor wafer is mounted on each of the bases of the base assembly as described above, and the semiconductor wafers are collectively made of resin-packed electronic components, and generally have a substrate surface and a resin package surface. Thickness is 200~2000μm degree. The arithmetic mean roughness Ra of the surface of the resin package surface is as rough as about 0.5 to 10 μm, and in addition, it is easy to be taken out from the mold of the packaging device, and the sealing material contains a mold release component. Therefore, when the adhesive sheet is adhered to the resin package surface, the fixing performance tends not to be sufficiently exhibited. The dicing sheet 1 of the present embodiment is used by adhering the surface on the side of the adhesive layer 3 (that is, the surface of the adhesive layer 3 opposite to the substrate 2) to the semiconductor package resin package surface. When the release sheet is adhered to the surface of the dicing sheet 1 on the side of the adhesive layer 3, the release sheet is peeled off to expose the surface on the side of the adhesive layer 3, and the surface can be adhered to the resin package surface of the semiconductor package. . The peripheral portion of the dicing sheet 1 is usually adhered to a ring-shaped jig called a ring frame for transporting or for fixing to the device by the adhesive layer 3 provided in the portion. Since the adhesive layer 3 contains the adhesive-imparting resin (C) in an appropriate amount, the adhesive force before irradiation is sufficiently high. Therefore, even if the semiconductor package adhered to the dicing sheet 1 is supplied to the dicing step, the possibility that the encapsulating wafer obtained by laminating the semiconductor structure is scattered during processing can be reduced. Further, the size of the sealant wafer formed by the dicing step is usually 5 mm × 5 mm or less, and in recent years, it is also about 1 mm × 1 mm, but the adhesive layer 3 of the dicing sheet 1 of the present embodiment is irradiated. It has excellent adhesion before, and it can also fully correspond to the cutting of such fine pitch.

By performing the above cutting steps, a plurality of encapsulated wafers can be obtained from a semiconductor package. After the dicing step is completed, in order to easily pick up a plurality of sealant wafers disposed adjacent to the dicing sheet 1, an expansion step of elongating the dicing sheet 1 in the main surface direction is performed. The degree of elongation may be appropriately set in consideration of the interval which the adjacent sealing wafer should have, the tensile strength of the substrate 2, and the like.

By implementing an expansion step, the adjacently disposed encapsulated wafers are mutually When properly separated, the sealing of the sealing wafer on the adhesive layer 3 is performed by a general means such as a vacuum chuck. The glued wafer that is picked up will be supplied to the next step such as the transport step.

After the completion of the dicing step, the dicing sheet 1 of the present embodiment is subjected to energy ray irradiation from the side of the substrate 2 to cause the inside of the adhesive layer 3 included in the dicing sheet 1 to be contained therein. The linear polymerizable compound (B) is subjected to a polymerization reaction so that the adhesion after the irradiation becomes 1/3 or less of the adhesion force before the irradiation. Therefore, it is not easy to pick up badly. The implementation period of the energy ray irradiation is not particularly limited as long as the pickup step is started after the end of the dicing step. From the viewpoint of reducing the possibility of scattering of the sealant wafer at the expansion step, it is preferably carried out after the expansion step, but since the layer is slightly shrunk as the adhesive layer 3 is hardened by the energy ray irradiation, based on the shrinkage The displacement will be a problem, etc., and the energy line illumination may be performed before the implementation of the expansion step.

As described above, in the method for producing a sealing wafer of the present embodiment, scattering of the sealing wafer is less likely to occur, and in the subsequent steps, picking failure is less likely to occur. Therefore, it is not easy to reduce the yield by dividing the semiconductor package through a plurality of steps of cutting, expanding, and picking up the plurality of encapsulated wafers to the next step. Therefore, the use of the sealant wafer obtained by the production method of the present embodiment of the dicing sheet 1 of the present embodiment is advantageous in terms of cost. In addition, the scattering or pick-up of the sealant wafer is not directly related to the abnormality of the sealant wafer, and there is a problem that the other sealant wafers produced in the same batch are defective due to wafer impact or the like. . Therefore, the sealant wafer manufactured by the method for producing a sealant wafer of the present embodiment has a possibility of reducing such a problem and is excellent in quality.

The embodiments described above are described for easy understanding of the present invention, and are not intended to limit the present invention. Therefore, the various elements of the above-described embodiments are intended to encompass all design changes or equivalents of the technical scope of the invention.

[Examples]

Hereinafter, the present invention will be specifically described by way of Examples and the like, but the scope of the present invention is not limited to the Examples and the like.

[Example 1]

(1) Modulation of coating liquid

A coating liquid having the following composition was prepared.

i) a copolymer obtained by copolymerizing 100 parts by mass of butyl acrylate, 2 parts by mass of acrylic acid and 0.5 part by mass of 2-hydroxyethyl acrylate as the acrylic polymer (A) (weight average molecular weight 600,000, solid concentration) 40% by mass), 100 parts by mass of solid content; ii) As an energy ray polymerizable compound (B), a 6-functional urethane acrylate oligomer (SEIKABEAM 14-29B, manufactured by Daisei Seiki Co., Ltd., weight average molecular weight 2000) , an acrylate compound having a solid concentration of 80% by mass, n/M = 3 × 10 ^-3 ), a solid content of 100 parts by weight; iii) a polymerized rosin ester (C1) as an adhesion-imparting resin (C), Arakawa Chemical Industry Co., Ltd. made PENSEL D125 (solid concentration: 100% by mass), with a solid content of 12.5 parts by mass; iv) as an adhesion-imparting resin (C), a heterogeneous rosin ester (C2), and Arakawa Chemical Industry Co., Ltd. SUPERESTER A100 (solid The concentration is 100% by mass), and the solid content is 62.5 parts by mass; v) the petroleum resin (C3) as the adhesion-imparting resin (C), FTR6100 (solid concentration: 100% by mass) manufactured by Mitsui Chemicals Co., Ltd., and the solid content is 62.5 mass. Department; vi) a bridging agent that reacts with the acrylic polymer (A), A polyisocyanate compound composed of CORONATE L manufactured by Nippon Polyurethane Co., Ltd. (trimethylolpropane adduct of tolyl diisocyanate, 3 isocyanate groups in 1 molecule, solid concentration: 75% by mass), and 9 parts by mass And vii) as a photopolymerization initiator, IRGACURE 184 (manufactured by Ciba. Specialty. Chemicals, solid concentration: 100% by mass), and has a solid content of 7.5 mass parts.

(2) Production of cutting sheets

A release sheet (SP-PET 381031 manufactured by LINTEC Co., Ltd.) obtained by forming an oxime-based release agent layer on one of the main surfaces of a polyethylene terephthalate base film having a thickness of 38 μm was prepared. On the release surface of the release sheet, the coating liquid was applied by a knife coater so that the thickness of the finally obtained adhesive layer was 10 μm. The obtained coating film was dried for 1 minute in an environment of 80 ° C for each of the release sheets, and subjected to a bridging reaction to obtain a laminate of a release sheet and an adhesive layer (thickness: 10 μm).

A substrate composed of an ethylene-methacrylic acid copolymer (EMAA) film having a thickness of 140 μm (tensile stress at 2% deformation: 10.8 N/10 mm, maximum tensile stress: 25.5 MPa, breaking elongation: 525%) One of the faces is covered as a substrate, and the surface of the laminate on the side of the adhesive layer is adhered to the surface, and a dicing sheet composed of the substrate and the adhesive layer shown in Fig. 1 is obtained. The surface of the adhesive layer is laminated to the state of the release sheet.

[Example 2]

In the first embodiment, the acrylic polymer (A) contained in the coating liquid was changed to 100 parts by mass of butyl acrylate, 5 parts by mass of acrylic acid, and 0.2 part by mass of acrylic acid 2 contained in the copolymerization coating liquid. A dicing sheet was obtained in the same manner as in Example 1 except that the polymer of hydroxyethyl ester (weight average molecular weight: 600,000, solid content concentration: 40% by mass) was used.

[Example 3]

In the first embodiment, the adhesion of the coating liquid is applied to the resin (C), and the content of the uneven rosin ester (C2) is divided into 125 parts by solid content, and the content of the petroleum resin (C3) is The solid content was changed to 50 parts by mass, and the content of the adhesion-imparting resin (C) was changed from 137.5 mass parts of the first embodiment to 182.5 mass parts, and the same operation as in the first example was carried out to obtain a dicing sheet.

[Example 4]

In the same manner as in Example 1, except that the thickness of the pressure-sensitive adhesive layer was changed from 10 μm to 15 μm, the dicing sheet was obtained.

[Example 5]

In the same manner as in Example 1, except that the thickness of the pressure-sensitive adhesive layer was changed from 10 μm to 30 μm in the first embodiment, a dicing sheet was obtained.

[Example 6]

In the first embodiment, the adhesion-imparting resin (C) contained in the coating liquid does not contain the petroleum-based resin (C3), and the content of the adhesion-imparting resin (C) in the solid content is changed from the 137.5 mass portion of the first embodiment. A dicing sheet was obtained in the same manner as in Example 1 except that the mass portion was 75 mass parts.

[Example 7]

In the first embodiment, the adhesion of the coating liquid to the resin (C) is not The content of the petroleum-based resin (C3) is 75 parts by mass, and the content of the solid content of the adhesion-imparting resin (C) is changed from 137.5 parts of the first embodiment to 87.5 mass of the first embodiment. A dicing sheet was obtained in the same manner as in Example 1 except for the portion.

[Example 8]

In the first embodiment, the type of the energy ray polymerizable compound (B) contained in the coating liquid was changed from a 6-functional urethane acrylate to a trifunctional urethane acrylate oligomer (SEIKABEAM EXL manufactured by Daisei Seiki Co., Ltd.) -810TL, weight average molecular weight: 5000, solid content concentration: 60 mass%, n/M = 6 × 10 ^-4 ), and the content was changed to 250 mass parts, and the same operation as in Example 1 was carried out to obtain a dicing sheet.

[Comparative Example 1]

In the first embodiment, the adhesive layer contained in the coating liquid is supplied to the resin (C), and the polymerized rosin ester (C1) is not contained, and the content of the solid content of the adhesion-imparting resin (C) is changed from the 137.5 mass portion of the first embodiment. A dicing sheet was obtained in the same manner as in Example 1 except that the amount was 125 parts by mass.

[Comparative Example 2]

In the first embodiment, the adhesion of the coating liquid to the resin (C) is contained, and both of the polymerized rosin ester (C1) and the uneven rosin ester (C2) are not contained, and the adhesion imparting resin (C) is solid. The content was changed from 137.5 mass parts of the first embodiment to 62.5 mass parts, and the same operation as in the first example was carried out to obtain a dicing sheet.

[Comparative Example 3]

In the first embodiment, the adhesion of the coating liquid is imparted to the resin (C), and the polymerized rosin ester (C1), the heterogeneous rosin ester (C2), and the petroleum resin (C3) are used. In any case, the content of the adhesive-imparting resin (C) was changed to 135% by mass from the 137.5 mass portion of the first embodiment, and the content of the solid content was changed to 375 mass portions in the first embodiment, and the same operation as in the first embodiment was carried out to obtain a cut. sheet.

[Comparative Example 4]

In the same manner as in Example 1, except that both the energy ray-polymerizable compound (B) and the photopolymerization initiator were not contained in the coating liquid, a dicing sheet was obtained.

[Comparative Example 5]

In the first embodiment, the content of the adhesion-imparting resin (C) contained in the coating liquid is as follows, and the content of the solid content of the adhesion-imparting resin (C) is changed from 137.5 mass parts of the first embodiment to 52.5 mass parts, and In the same manner as in Example 1, a cut piece was obtained.

Polymerized rosin ester (C1): 2.5 parts by mass, Uneven rosin ester (C2): 25 parts by mass, and Petroleum resin (C3): 25 parts by mass.

[Comparative Example 6]

In the first embodiment, the adhesive contained in the coating liquid is applied to the resin (C), and the content of the polymerized rosin ester (C1) is divided into 50 parts by mass and the content of petroleum resin (C3) by solid content. The dicing sheet was obtained in the same manner as in Example 1 except that the content of the solid content of the adhesion-imparting resin (C) was changed from 137.5 mass parts of the first embodiment to 187.5 mass parts.

[Comparative Example 7]

In the first embodiment, the adhesive contained in the coating liquid is applied to the resin (C), and the content of the polymerized rosin ester (C1) is divided into 50 parts by solid content, and does not contain unevenness. Both the rosin ester (C2) and the petroleum resin (C3) were changed from the 137.5 mass portion of the first embodiment to the 50 mass portion in terms of the solid content of the adhesive imparting resin (C). Except for the above changes, the same operation as in Example 1 was carried out to obtain a dicing sheet.

[Comparative Example 8]

In the first embodiment, the type of the energy ray polymerizable compound (B) contained in the coating liquid was changed from a 6-functional urethane acrylate to a trifunctional urethane acrylate oligomer (SEIKABEAM EXL manufactured by Daisei Seiki Co., Ltd.) A dicing sheet was obtained in the same manner as in Example 1 except that -810TL, a weight average molecular weight of 5,000, a solid concentration of 60% by mass, and n/M = 6 × 10 ^-4 .

The composition of the coating liquid prepared by the production of the dicing sheets of the above examples and comparative examples and the thickness of the obtained dicing sheet were collectively shown in Table 1. In addition, the energy ray polymerizable compound (B) contained in the coating liquid of the examples and the comparative examples is a urethane acrylate oligomer, and therefore, the type of the energy ray polymerizable compound (B) in Table 1 Column, indicating the number of functional groups.

[Table 1]

[Test Example 1] <Measurement of adhesion ratio>

The dicing sheet produced in the above examples and comparative examples was cut to obtain a sheet for measuring the adhesion force having a width of 25 mm. A sheet-like member having a thickness of 600 μm and an arithmetic mean roughness Ra of one main surface of 2 μm was produced using a resin for semiconductor assembly (KE-G1250, manufactured by KYOCERA CHEMICALS Co., Ltd.). The surface of the one side of the adhesive force measuring sheet was adhered to the main surface of the sheet-like member, and a laminate composed of the sheet member and the sheet for measuring adhesion was obtained. The obtained laminate was allowed to stand in an atmosphere of 23 ° C and a relative humidity of 50% for 20 minutes. A laminate tensile tester (TENSILON/UTM-4-100, manufactured by ORIENTEC Co., Ltd.) was used, and a 180° peeling test (a member on the sheet side for peeling adhesion measurement) was carried out in accordance with JIS Z0237:2000. ), the adhesion before irradiation (unit: mN / 25 mm) was measured.

Further, a laminate composed of the above-mentioned sheet member and the sheet for measuring adhesion was prepared, and allowed to stand in an atmosphere of 23 ° C and a relative humidity of 50% for 20 minutes. Thereafter, the ultraviolet irradiation device (of LINTEC Corporation, RAD-2000m / 12), under nitrogen atmosphere, the dicing sheet is irradiated with ultraviolet rays (illuminance of 230mW / cm ^2, UV radiation dose of 190mJ / cm ^2), so that said laminate of The energy ray polymerizable compound (B) contained in the adhesive layer is polymerized. The laminate after the ultraviolet ray irradiation was subjected to a peeling test under the same conditions as the peeling test for measuring the adhesion before the irradiation, and the adhesion after irradiation (unit: mN/25 mm) was measured.

From the adhesion force before irradiation and the adhesion after irradiation, the adhesion ratio was determined. The results of these are shown in the second table.

[Test Example 2] <The dissolution rate of the encapsulated wafer in the cutting step Measurement>

Using a resin for semiconductor assembly (KE-G1250, manufactured by KYOCERA CHEMICALS Co., Ltd.), an analog semiconductor package having a 50 mm × 50 mm thickness and a thickness of 600 μm and an arithmetic mean roughness Ra of one main surface of 2 μm was produced. The dicing sheet produced by the above examples and comparative examples was cut into a circular shape having a diameter of 207 mm, and the surface of the obtained circular dicing sheet on the side of the adhesive layer was applied by a filming machine (Adwill RAD 2500 manufactured by LINTEC Co., Ltd.). The fabricated analog semiconductor structure is adhered to one of the above faces. The laminate of the dicing sheet and the analog semiconductor package thus obtained was attached to a ring frame (2-6-1, manufactured by DISCO Corporation), and the scissors (DFD651, manufactured by DISCO Corporation) were used to carry out the side of the analog semiconductor package. The cutting step of cutting is divided into a sealing wafer of 1 mm × 1 mm size (division number 2500). Furthermore, the cutting conditions are as follows.

Cutting blade: ZBT-5074 (Z1110LS3) manufactured by DISCO Corporation

Blade thickness: 0.17mm

Tip exposure: 3.3mm

Number of blade rotations: 30000rpm

Cutting speed: 50mm / min

Cutting depth of the cutting piece to the substrate: 50μm

Cutting water volume: 1.0L/min

Cutting water temperature: 20 ° C

Obtaining the member obtained by the cutting step, the sealing film is attached to the side of the adhesive layer side of the dicing sheet, and the number is the number of the sealing wafer which is detached from the dicing sheet in the cutting step, and the number is cut by the cutting step. The number of divisions is divided by 2,500, and the scattering rate of the encapsulated wafer is obtained (unit: %). The results are shown in the second table.

[Test Example 3] <Pickup Test>

A semiconductor package resin (KE-G1250 manufactured by KYOCERA CHEMICALS Co., Ltd.) was used to produce an analog semiconductor package having a 50 mm × 50 mm thickness and a thickness of 600 μm and an arithmetic mean roughness Ra of one main surface of 2 μm. The dicing sheet produced in the above-mentioned Examples and Comparative Examples was cut into a diameter of 207 mm, and the surface of the obtained dicing sheet on the side of the adhesive layer was adhered to the above by using a film coater (Adwi11 RAD-2500m manufactured by Lintec Co., Ltd.). The surface of the above one of the semiconductor structures is simulated. The laminate of the dicing sheet and the analog semiconductor package thus obtained was attached to a dicing ring frame (2-6-1, manufactured by DISCO Corporation), and was molded by an analog semiconductor using a dicing device (DFD651, manufactured by DISCO Corporation). The cutting step of the side cutting was divided into a sealing wafer of 1 mm × 1 mm size (division number 2500). Further, the cutting conditions were the same as those of Test Example 3.

The dicing sheet of the member obtained by attaching the sealing wafer to the surface of the adhesive layer side of the dicing sheet by the dicing step was carried out at a speed of 300 mm/min using an expansion device (ME-300B model manufactured by JAM Corporation). The sheet is extended by 20 mm in the direction of the main surface.

Of said member after the expanding step, using an ultraviolet irradiation device (of LINTEC Corporation RAD-2000m g / 12), under nitrogen atmosphere, the dicing sheet is irradiated with ultraviolet rays (illuminance of 230mW / cm ^2, the amount of ultraviolet 190mJ / cm ^2), the dicing sheet The energy ray polymerizable compound (B) contained in the adhesive layer is polymerized.

Next, a pick-up test was performed on 100 sealant wafers located near the center of the main face of the dicing sheet. That is, the dicing sheet is attached to the portion of the encapsulating wafer to be picked up, and the substrate is lifted by 1.5 mm from the substrate side, and the surface opposite to the side opposite to the dicing sheet of the protruding sealing wafer is attached to the vacuum nip. Head, will be attached to The sealing wafer of the vacuum chuck is lifted. At this time, the number of the seal wafers picked up by the vacuum chuck was measured, and the pick-up ratio (unit: %) was determined by dividing the number of tests (100). The results are shown in the second table.

In addition, the surface of the opposite side of the encapsulating film and the dicing sheet are observed by an optical microscope, and it is confirmed whether or not there is a material constituting the adhesive layer remaining, and the number of remaining sealing dies is determined by the number of tests (100). In addition to the adhesive residue rate (unit: %). The results are shown in the second table.

It is apparent from the second table that the dicing sheet of the embodiment satisfying the conditions of the present invention is less likely to cause an abnormality in any of the cutting step, the expanding step, and the picking step.

[Industry profitability]

The dicing sheet of the present invention can be suitably used for a dicing sheet which is coated with a semiconductor having a large unevenness.

1‧‧‧ cutting piece

2‧‧‧Substrate

3‧‧‧Adhesive layer

Claims (10)

A dicing sheet comprising: a substrate and an adhesive layer laminated on at least one of the surfaces of the substrate, wherein the adhesive layer contains an acrylic polymer (A) and an energy ray polymerizable compound (B) and the adhesive composition of the resin (C), the adhesive-imparting resin (C) contains a polymerized rosin ester (C1) and contains a homogenized rosin ester (C2) and a petroleum resin (C3). The content of the polymerized rosin ester (C1) contained in the adhesive composition is at least 5 parts by mass for 100 parts by mass of the acrylic polymer (A), and the dicing sheet is bonded thereto. The exposed surface of the agent on the side opposite to the side opposite to the substrate is used as the measurement target surface, and the resin package surface of the semiconductor package is used as the surface to be coated, and the adhesion measured by the 180° peeling test in accordance with JIS Z0237:2000 is performed. The ratio of the adhesion force in the state before the irradiation of the energy ray to the state after the irradiation of the energy ray is 3 or more. The dicing sheet according to the first aspect of the invention, wherein the content of the polymerized rosin ester (C1) contained in the adhesive composition is 100 mass parts or more and 20 mass parts to the acrylic polymer (A). Below. The dicing sheet according to the first aspect of the patent application, which comprises the sum of the content of the uneven rosin ester (C2) and the content of the petroleum resin (C3) in the above adhesive composition, and the acrylic polymer (A) ) 100 mass parts, more than 50 mass parts. The dicing sheet according to the first aspect of the invention, wherein the energy ray polymerizable compound (B) comprises a weight average molecular weight (Mw) of 100 or more and 30,000. The following energy ray polymerizable group of low molecular weight compounds (B1) The dicing sheet according to the fourth aspect of the invention, wherein the content of the low molecular compound (B1) contained in the energy ray polymerizable group of the above adhesive composition is 100 parts by mass of the acrylic polymer (A). More than 300 parts by mass of the mass. The dicing sheet according to the first aspect of the invention, wherein the adhesive composition comprises a bridging agent capable of bridging reaction with the acrylic polymer. The dicing sheet according to the first aspect of the invention, wherein the thickness of the adhesive layer is 5 μm or more and 35 μm or less. The dicing sheet according to the first aspect of the invention, wherein the surface of the substrate on the side of the adhesive layer has one or more components selected from the group consisting of a carboxyl group and a group of ions and salts thereof. The dicing sheet according to the first aspect of the invention, wherein the surface of the adhesive layer opposite to the substrate is adhered to a resin package surface of a semiconductor package of a resin-encapsulated semiconductor wafer. A method for producing a sealant wafer, the surface of the adhesive layer side of the dicing sheet according to any one of claims 1 to 9 is adhered to a resin package surface of a semiconductor package, and the semiconductor on the dicing sheet is attached The structure is cut and sliced to obtain a plurality of encapsulated wafers.