JPWO2021065070A1 - - Google Patents

Info

Publication number
JPWO2021065070A1
JPWO2021065070A1 JP2021551128A JP2021551128A JPWO2021065070A1 JP WO2021065070 A1 JPWO2021065070 A1 JP WO2021065070A1 JP 2021551128 A JP2021551128 A JP 2021551128A JP 2021551128 A JP2021551128 A JP 2021551128A JP WO2021065070 A1 JPWO2021065070 A1 JP WO2021065070A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021551128A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021065070A1 publication Critical patent/JPWO2021065070A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Plasma & Fusion (AREA)
JP2021551128A 2019-10-04 2020-05-22 Pending JPWO2021065070A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019183566 2019-10-04
PCT/JP2020/020327 WO2021065070A1 (ja) 2019-10-04 2020-05-22 粘着シート及び粘着シートの製造方法

Publications (1)

Publication Number Publication Date
JPWO2021065070A1 true JPWO2021065070A1 (ja) 2021-04-08

Family

ID=75337973

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2021551131A Pending JPWO2021065073A1 (ja) 2019-10-04 2020-05-22
JP2021551128A Pending JPWO2021065070A1 (ja) 2019-10-04 2020-05-22
JP2021551132A Pending JPWO2021065074A1 (ja) 2019-10-04 2020-05-22
JP2021551130A Pending JPWO2021065072A1 (ja) 2019-10-04 2020-05-22
JP2021551129A Pending JPWO2021065071A1 (ja) 2019-10-04 2020-05-22

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2021551131A Pending JPWO2021065073A1 (ja) 2019-10-04 2020-05-22

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2021551132A Pending JPWO2021065074A1 (ja) 2019-10-04 2020-05-22
JP2021551130A Pending JPWO2021065072A1 (ja) 2019-10-04 2020-05-22
JP2021551129A Pending JPWO2021065071A1 (ja) 2019-10-04 2020-05-22

Country Status (5)

Country Link
JP (5) JPWO2021065073A1 (ja)
KR (3) KR20220080093A (ja)
CN (3) CN114514295B (ja)
TW (5) TW202122534A (ja)
WO (5) WO2021065073A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023047592A1 (ja) * 2021-09-27 2023-03-30 株式会社レゾナック 半導体装置の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3723278B2 (ja) * 1996-05-21 2005-12-07 日東電工株式会社 レジスト除去用接着シ―ト類とレジスト除去方法
JP2006152072A (ja) * 2004-11-26 2006-06-15 Teijin Chem Ltd 半導体製造用帯電防止性フィルムおよびその製造方法
JP2009064975A (ja) * 2007-09-06 2009-03-26 Nitto Denko Corp ダイシング用粘着シート及びダイシング方法
JP5069662B2 (ja) * 2007-11-12 2012-11-07 リンテック株式会社 粘着シート
WO2010058646A1 (ja) 2008-11-21 2010-05-27 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体パッケージおよびその製造方法
JP2010229342A (ja) * 2009-03-27 2010-10-14 Lintec Corp 光学用粘着剤、光学用粘着シート及び粘着剤付き光学部材
WO2012124389A1 (ja) * 2011-03-17 2012-09-20 リンテック株式会社 エネルギー線硬化型粘着剤および粘着シート
JP2014043548A (ja) * 2012-07-31 2014-03-13 Nitto Denko Corp 粘着剤組成物、粘着剤層、粘着シート及び光学フィルム
JP6207192B2 (ja) * 2013-03-25 2017-10-04 リンテック株式会社 半導体加工用粘着シート
JP6377322B2 (ja) * 2013-05-30 2018-08-22 住友化学株式会社 光学フィルム積層体及びそれを用いた複合偏光板
SG11201600047XA (en) * 2013-07-05 2016-02-26 Lintec Corp Dicing sheet
DE112015001075T5 (de) * 2014-03-03 2016-11-24 Lintec Corporation Verarbeitungsfolie für ein halbleiterbezogenes Element und Verfahren zur Herstellung von Chips unter Verwendung der Folie
JP6156443B2 (ja) * 2014-08-13 2017-07-05 Jsr株式会社 積層体および基材の処理方法
KR102449502B1 (ko) * 2015-03-03 2022-09-30 린텍 가부시키가이샤 반도체 가공용 시트
WO2018003312A1 (ja) 2016-06-30 2018-01-04 リンテック株式会社 半導体加工用シート
WO2018105413A1 (ja) * 2016-12-07 2018-06-14 三菱ケミカル株式会社 粘着シート及びその製造方法
JP6791792B2 (ja) * 2017-03-23 2020-11-25 リンテック株式会社 粘着フィルムおよびその製造方法
WO2018181511A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 粘着シートの剥離方法
JP6350845B1 (ja) * 2018-01-29 2018-07-04 サイデン化学株式会社 粘着剤組成物、粘着シート、及び粘着剤の製造方法
WO2019172219A1 (ja) * 2018-03-07 2019-09-12 リンテック株式会社 粘着シート
JP2018115331A (ja) * 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法
JP2018115333A (ja) * 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法

Also Published As

Publication number Publication date
TW202122532A (zh) 2021-06-16
JPWO2021065072A1 (ja) 2021-04-08
TW202122533A (zh) 2021-06-16
CN114514296B (zh) 2024-03-29
CN114514296A (zh) 2022-05-17
WO2021065070A1 (ja) 2021-04-08
JPWO2021065074A1 (ja) 2021-04-08
WO2021065072A1 (ja) 2021-04-08
KR20220080093A (ko) 2022-06-14
TW202115214A (zh) 2021-04-16
KR20220075341A (ko) 2022-06-08
JPWO2021065073A1 (ja) 2021-04-08
TW202116947A (zh) 2021-05-01
WO2021065073A1 (ja) 2021-04-08
CN114514295B (zh) 2024-02-06
KR20220080092A (ko) 2022-06-14
CN114502679A (zh) 2022-05-13
JPWO2021065071A1 (ja) 2021-04-08
TW202122534A (zh) 2021-06-16
WO2021065071A1 (ja) 2021-04-08
CN114514295A (zh) 2022-05-17
WO2021065074A1 (ja) 2021-04-08

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