KR102447392B1 - 전자장치 적용을 위한 무연 땜납 합금 - Google Patents

전자장치 적용을 위한 무연 땜납 합금 Download PDF

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KR102447392B1
KR102447392B1 KR1020177033626A KR20177033626A KR102447392B1 KR 102447392 B1 KR102447392 B1 KR 102447392B1 KR 1020177033626 A KR1020177033626 A KR 1020177033626A KR 20177033626 A KR20177033626 A KR 20177033626A KR 102447392 B1 KR102447392 B1 KR 102447392B1
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solder
alloy
alloys
die
joints
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Korean (ko)
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KR20180006928A (ko
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웨이핑 리우
닝-청 리
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인듐 코포레이션
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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    • H01L23/492—Bases or plates or solder therefor
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  • Engineering & Computer Science (AREA)
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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KR102286739B1 (ko) * 2017-08-17 2021-08-05 현대자동차 주식회사 무연 솔더 조성물
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JP6349615B1 (ja) 2017-10-03 2018-07-04 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
JP6427752B1 (ja) * 2018-03-06 2018-11-28 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
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JP6731034B2 (ja) * 2018-12-25 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
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