KR102443868B1 - 기판 반송 장치 및 기판 반송 방법 - Google Patents

기판 반송 장치 및 기판 반송 방법 Download PDF

Info

Publication number
KR102443868B1
KR102443868B1 KR1020150177984A KR20150177984A KR102443868B1 KR 102443868 B1 KR102443868 B1 KR 102443868B1 KR 1020150177984 A KR1020150177984 A KR 1020150177984A KR 20150177984 A KR20150177984 A KR 20150177984A KR 102443868 B1 KR102443868 B1 KR 102443868B1
Authority
KR
South Korea
Prior art keywords
substrate
unit
detection
deviation
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020150177984A
Other languages
English (en)
Korean (ko)
Other versions
KR20160078243A (ko
Inventor
토쿠타로 하야시
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20160078243A publication Critical patent/KR20160078243A/ko
Application granted granted Critical
Publication of KR102443868B1 publication Critical patent/KR102443868B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/67778—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67739—
    • H01L21/6779—
    • H01L22/12—
    • H01L27/146—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manipulator (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Multimedia (AREA)
  • Die Bonding (AREA)
  • Geometry (AREA)
  • Robotics (AREA)
KR1020150177984A 2014-12-24 2015-12-14 기판 반송 장치 및 기판 반송 방법 Active KR102443868B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-261085 2014-12-24
JP2014261085A JP6316742B2 (ja) 2014-12-24 2014-12-24 基板搬送装置および基板搬送方法

Publications (2)

Publication Number Publication Date
KR20160078243A KR20160078243A (ko) 2016-07-04
KR102443868B1 true KR102443868B1 (ko) 2022-09-16

Family

ID=56164829

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150177984A Active KR102443868B1 (ko) 2014-12-24 2015-12-14 기판 반송 장치 및 기판 반송 방법

Country Status (5)

Country Link
US (1) US9960063B2 (enExample)
JP (1) JP6316742B2 (enExample)
KR (1) KR102443868B1 (enExample)
CN (2) CN110729215B (enExample)
TW (1) TWI614833B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014028072A1 (en) 2012-08-17 2014-02-20 Flextronics Ap, Llc Interactive channel navigation and switching
JP6802726B2 (ja) 2017-02-14 2020-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、それを備える基板処理装置および基板搬送方法
JP6862903B2 (ja) * 2017-02-23 2021-04-21 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
CN110741239A (zh) 2017-06-06 2020-01-31 三菱重工机械系统株式会社 轮胎输送装置、具备其的轮胎试验系统及轮胎输送方法
TWI660163B (zh) * 2017-06-08 2019-05-21 Mitsubishi Heavy Industries Machinery Systems, Ltd. 輪胎搬運裝置、具備其的輪胎試驗系統及輪胎搬運方法
KR102059567B1 (ko) * 2017-08-21 2019-12-27 피에스케이홀딩스 (주) 기판 반송 장치
JP7023094B2 (ja) * 2017-12-05 2022-02-21 日本電産サンキョー株式会社 ロボット
CN111630637B (zh) * 2018-01-26 2024-10-01 东京毅力科创株式会社 基板处理装置
KR102099115B1 (ko) * 2018-06-08 2020-04-10 세메스 주식회사 기판 이송 장치, 이를 포함하는 기판 처리 장치 및 기판 틀어짐 보정 방법
WO2020100381A1 (ja) * 2018-11-14 2020-05-22 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP7211142B2 (ja) * 2019-02-15 2023-01-24 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7254163B2 (ja) * 2019-03-28 2023-04-07 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN112151429A (zh) * 2019-06-26 2020-12-29 弘塑科技股份有限公司 基板传送设备、半导体制程机台及基板传送方法
CN111063636B (zh) * 2019-11-28 2023-03-24 华虹半导体(无锡)有限公司 晶圆水平偏差检测方法、检测装置和炉管设备
JP7429578B2 (ja) * 2020-03-27 2024-02-08 株式会社ダイヘン アライナ装置およびワークの位置ずれ補正方法
JP7553191B2 (ja) * 2020-08-31 2024-09-18 東京エレクトロン株式会社 基板搬送システムの制御方法及び基板搬送システム
KR102624577B1 (ko) * 2020-10-28 2024-01-15 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7617745B2 (ja) * 2021-01-05 2025-01-20 東京エレクトロン株式会社 プロセスモジュール、基板処理システムおよび処理方法
TWI905688B (zh) * 2023-09-05 2025-11-21 家登精密工業股份有限公司 支撐中柱檢測系統及支撐中柱檢測方法
CN119480700A (zh) * 2024-10-30 2025-02-18 无锡市诺一智能科技有限公司 一种应用于半导体加工的基板输送装置和输送方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483693B2 (ja) * 1995-02-02 2004-01-06 東京エレクトロン株式会社 搬送装置，搬送方法及び処理システム
JP4109733B2 (ja) * 1997-06-06 2008-07-02 キヤノンアネルバ株式会社 基板搬送システム及び半導体製造装置
US6198976B1 (en) * 1998-03-04 2001-03-06 Applied Materials, Inc. On the fly center-finding during substrate handling in a processing system
JP2000357724A (ja) * 1999-06-15 2000-12-26 Hitachi Kokusai Electric Inc 基板搬送部材およびそれの有無検知方法
JP4632590B2 (ja) * 2001-08-30 2011-02-16 キヤノンアネルバ株式会社 基板搬送システム及び基板処理装置
JP4276440B2 (ja) * 2003-01-06 2009-06-10 東京エレクトロン株式会社 基板検出方法及び装置並びに基板処理装置
KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
JP2005101069A (ja) * 2003-09-22 2005-04-14 Dainippon Screen Mfg Co Ltd 搬送装置及び基板処理装置
BRPI0305983B1 (pt) * 2003-12-30 2015-09-22 Brasil Compressores Sa sistema de controle e disparo de um triac e método de controle de disparo de um triac
US7751922B2 (en) * 2004-10-06 2010-07-06 Hitachi Kokusai Electric Inc. Semiconductor manufacturing apparatus and manufacturing of a semiconductor device
JP5058836B2 (ja) * 2007-05-08 2012-10-24 東京エレクトロン株式会社 処理装置、処理方法、被処理体の認識方法および記憶媒体
JP2009049200A (ja) * 2007-08-20 2009-03-05 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2012038922A (ja) * 2010-08-06 2012-02-23 Tokyo Electron Ltd 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
JP5614326B2 (ja) * 2010-08-20 2014-10-29 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
JP5582152B2 (ja) * 2012-02-03 2014-09-03 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
JP5673577B2 (ja) * 2012-02-07 2015-02-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5664570B2 (ja) * 2012-02-09 2015-02-04 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5871845B2 (ja) * 2013-03-12 2016-03-01 東京エレクトロン株式会社 基板搬送装置、基板処理装置、基板取出方法および記憶媒体

Also Published As

Publication number Publication date
JP6316742B2 (ja) 2018-04-25
CN110729215B (zh) 2023-10-13
CN105742208A (zh) 2016-07-06
CN110729215A (zh) 2020-01-24
US9960063B2 (en) 2018-05-01
US20160189390A1 (en) 2016-06-30
KR20160078243A (ko) 2016-07-04
CN105742208B (zh) 2019-11-08
TWI614833B (zh) 2018-02-11
JP2016122710A (ja) 2016-07-07
TW201633442A (zh) 2016-09-16

Similar Documents

Publication Publication Date Title
KR102443868B1 (ko) 기판 반송 장치 및 기판 반송 방법
JP5582152B2 (ja) 基板搬送装置、基板搬送方法及び記憶媒体
US12074048B2 (en) Substrate processing apparatus and substrate processing method
KR102046705B1 (ko) 기판 처리 장치 및 기판 처리 방법
EP2304769B1 (en) Method for automatic measurement and for teaching-in of location positions of objects within a substrate processing system by means of sensor carriers and associated sensor carrier
CN102779771B (zh) 机器人系统
TWI588926B (zh) Substrate transfer apparatus, substrate processing apparatus, substrate removal method, and recording medium
US9373531B2 (en) Substrate transfer device, substrate processing apparatus, and substrate accommodation method
JP6506984B2 (ja) 基板検出装置、基板検出方法及び基板処理システム
KR20150093670A (ko) 기판 처리 장치, 기판 장치의 운용 방법 및 기억 매체
TW201448087A (zh) 基板運送裝置、基板運送方法及記憶媒體
KR102397110B1 (ko) 기판 반송 장치 및 기판 반송 방법
KR20200134154A (ko) 기판 처리 장치 및 기판 처리 방법
US20170125279A1 (en) Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
JP5884624B2 (ja) 基板処理装置、調整方法及び記憶媒体
JP6442596B2 (ja) 基板搬送装置および基板搬送方法
JP5889814B2 (ja) 基板搬送装置、基板処理装置および基板収容方法
JP5858103B2 (ja) 基板搬送装置、基板搬送方法及び記憶媒体
KR20160072879A (ko) 유량 측정 유닛, 이를 가지는 기판 처리 장치, 그리고 유량 측정 방법
JP6311639B2 (ja) 基板処理装置、基板処理装置の運転方法及び記憶媒体
KR20250025427A (ko) 기판 처리 장치 및 기판 처리 방법

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 4

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000