KR102441700B1 - 정반 운반대차 - Google Patents

정반 운반대차 Download PDF

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Publication number
KR102441700B1
KR102441700B1 KR1020177010065A KR20177010065A KR102441700B1 KR 102441700 B1 KR102441700 B1 KR 102441700B1 KR 1020177010065 A KR1020177010065 A KR 1020177010065A KR 20177010065 A KR20177010065 A KR 20177010065A KR 102441700 B1 KR102441700 B1 KR 102441700B1
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KR
South Korea
Prior art keywords
surface plate
holding part
carrier
polishing apparatus
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177010065A
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English (en)
Korean (ko)
Other versions
KR20170072200A (ko
Inventor
미치토 사토
요스케 카나이
Original Assignee
신에쯔 한도타이 가부시키가이샤
후지코시 기카이 고교 가부시키가이샤
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Publication date
Application filed by 신에쯔 한도타이 가부시키가이샤, 후지코시 기카이 고교 가부시키가이샤 filed Critical 신에쯔 한도타이 가부시키가이샤
Publication of KR20170072200A publication Critical patent/KR20170072200A/ko
Application granted granted Critical
Publication of KR102441700B1 publication Critical patent/KR102441700B1/ko
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16MFRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/02Heads
    • F16M11/04Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
    • F16M11/06Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting
    • F16M11/10Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting around a horizontal axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16MFRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/42Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters with arrangement for propelling the support stands on wheels
    • H01L21/304
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3214Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicle
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47BTABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
    • A47B3/00Folding or stowable tables
    • A47B3/10Travelling or trunk tables
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Handcart (AREA)
  • Braking Arrangements (AREA)
  • Robotics (AREA)
KR1020177010065A 2014-10-22 2015-10-02 정반 운반대차 Active KR102441700B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-215583 2014-10-22
JP2014215583A JP6178774B2 (ja) 2014-10-22 2014-10-22 定盤運搬台車
PCT/JP2015/005024 WO2016063464A1 (ja) 2014-10-22 2015-10-02 定盤運搬台車

Publications (2)

Publication Number Publication Date
KR20170072200A KR20170072200A (ko) 2017-06-26
KR102441700B1 true KR102441700B1 (ko) 2022-09-08

Family

ID=55760525

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177010065A Active KR102441700B1 (ko) 2014-10-22 2015-10-02 정반 운반대차

Country Status (8)

Country Link
US (1) US10737365B2 (https=)
JP (1) JP6178774B2 (https=)
KR (1) KR102441700B1 (https=)
CN (1) CN107073682B (https=)
DE (1) DE112015004421B4 (https=)
SG (1) SG11201702264TA (https=)
TW (1) TWI611868B (https=)
WO (1) WO2016063464A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI628132B (zh) * 2016-11-23 2018-07-01 住華科技股份有限公司 可傾式收集裝置
CN112318251A (zh) * 2020-10-15 2021-02-05 温州源利智能科技有限公司 一种钕铁硼磁性件自动打磨机构及其打磨方法
CN112224935B (zh) * 2020-12-10 2021-03-09 万邑通(潍坊)信息科技有限公司 物流轻便辅助卸车设备
JP7746217B2 (ja) * 2022-05-13 2025-09-30 株式会社荏原製作所 処理システムおよびパッド搬送装置
CN120942796B (zh) * 2025-10-17 2025-12-09 江苏裕科新材料有限公司 一种可辅助对齐的塑木地板搬运机器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061832A (ja) * 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd ポリッシング装置のロードカセットチルト機構
CN2795133Y (zh) 2005-04-26 2006-07-12 江苏天奇物流系统工程股份有限公司 气动液压升降台车
JP2009184775A (ja) 2008-02-05 2009-08-20 Hitachi Plant Technologies Ltd 搬送台車
US20130078074A1 (en) 2011-09-28 2013-03-28 Mil-Stak Inc. Rotatable and tiltable receiving table for a mid-size or big bale stack wagon

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813825A (en) * 1969-09-30 1974-06-04 Alliance Tool And Die Corp Polishing machine or the like with a removable platen
US4268201A (en) * 1979-05-07 1981-05-19 Bud Antle, Inc. Unitizing system for produce cartons and the like
US4558648A (en) * 1983-09-20 1985-12-17 Lift-R Technologies, Inc. Energy-recycling scissors lift
JP3620629B2 (ja) * 1998-02-20 2005-02-16 新東工業株式会社 鋳枠・定盤台車移替え設備
JP2000141205A (ja) * 1998-11-10 2000-05-23 Tokyo Seimitsu Co Ltd ウェーハ研磨装置及び研磨定盤調整装置
KR100591269B1 (ko) * 2004-12-09 2006-06-26 주식회사 금화피에스씨 밸브 디스크 연마 가공기
US7255355B2 (en) * 2005-01-03 2007-08-14 Mk Diamond Products, Inc. Portable collapsible stand
JP2008093811A (ja) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
AR060518A1 (es) * 2007-04-18 2008-06-25 Hugo Enrique Chianale Un conjunto carrito-mesa portatil
JP5058853B2 (ja) 2008-03-10 2012-10-24 旭硝子株式会社 板状貨物の輸送用ウイング式コンテナ及びそれを積載するトレーラ
JP5348610B2 (ja) * 2009-01-26 2013-11-20 旭硝子株式会社 板状体の積載装置
TWI366638B (en) * 2009-02-20 2012-06-21 Rexon Ind Corp Ltd Mobile tool stand
JP2011126546A (ja) 2009-12-15 2011-06-30 Shin-Etsu Chemical Co Ltd ガラス基板搬送用ケースおよびガラス基板搬送用台車
JP2012096893A (ja) * 2010-11-02 2012-05-24 Toppan Printing Co Ltd 基板搬送台車
US8910970B2 (en) * 2011-06-10 2014-12-16 Rexon Industrial Corp., Ltd. Rapidly collapsible stand
CN102745458B (zh) 2012-02-10 2014-12-17 湖南吉利汽车部件有限公司 电池装载车
JP6255303B2 (ja) * 2014-05-14 2017-12-27 株式会社荏原製作所 研磨テーブル交換装置および研磨テーブルの取り出し方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061832A (ja) * 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd ポリッシング装置のロードカセットチルト機構
CN2795133Y (zh) 2005-04-26 2006-07-12 江苏天奇物流系统工程股份有限公司 气动液压升降台车
JP2009184775A (ja) 2008-02-05 2009-08-20 Hitachi Plant Technologies Ltd 搬送台車
US20130078074A1 (en) 2011-09-28 2013-03-28 Mil-Stak Inc. Rotatable and tiltable receiving table for a mid-size or big bale stack wagon

Also Published As

Publication number Publication date
WO2016063464A1 (ja) 2016-04-28
SG11201702264TA (en) 2017-05-30
DE112015004421B4 (de) 2026-02-12
CN107073682B (zh) 2020-03-10
DE112015004421T5 (de) 2017-08-10
JP6178774B2 (ja) 2017-08-09
US20170304991A1 (en) 2017-10-26
KR20170072200A (ko) 2017-06-26
US10737365B2 (en) 2020-08-11
TWI611868B (zh) 2018-01-21
TW201636155A (zh) 2016-10-16
JP2016078220A (ja) 2016-05-16
CN107073682A (zh) 2017-08-18

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