JP5512314B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP5512314B2 JP5512314B2 JP2010025208A JP2010025208A JP5512314B2 JP 5512314 B2 JP5512314 B2 JP 5512314B2 JP 2010025208 A JP2010025208 A JP 2010025208A JP 2010025208 A JP2010025208 A JP 2010025208A JP 5512314 B2 JP5512314 B2 JP 5512314B2
- Authority
- JP
- Japan
- Prior art keywords
- holding
- grinding
- support
- workpiece
- holding table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
2:保持テーブル
20:枠体
200:円形凹部 201:内周壁 202:円環凹部 203:外周壁
204:貫通孔 205:位置決め突起 206:嵌合穴 207:貫通孔
208:吸引孔
21:保持部材
210:円形保持部材 210a:保持面
211:円環保持部材 211a:保持面
3a、3b:研削機構
30:研削工具 300:基台 301:砥石
31:支持マウント 32:回転軸 33:モータ
4:載置台 40:カセット
5:搬出機構
50:保持部 51:回動部 52:アーム部
6:位置合わせ機構
60:長孔 61:突き当て部材
7a、7b:研削送り機構
70:ボールスクリュー 71:ガイドレール 72:パルスモータ 73:摺動基台
74:支持部
8a、8b、8c:回転支持台
80:基台 800:凹部 800a:テーパ面 801:支持板載置部
802、803:吸引孔
81:支持板 810:貫通孔 811:支持面 812:貫通孔
9:搬送機構
90:軸部 91:アーム部
92:テーブル保持部 920:ベース板
921:可動部 921a:エアシリンダ 921b:嵌合部材 921c:吸引孔
10:支持台
Claims (2)
- ワークを保持する保持面を有する保持テーブルと、該保持テーブルを回転可能に支持する回転支持台と、該保持面に保持されたワークに対向配置された研削工具を有する研削機構と、該保持面にワークを保持した該保持テーブルを該回転支持台に搬入搬出する搬送機構と、を有する研削装置であって、
該回転支持台は、
中央部に凹部が形成された基台と、該基台の該凹部の外周側上面に載置される支持板とにより構成され、
該支持板は、該保持テーブルの下面を下側から支持する支持面を有し、
該支持面は、該研削機構が有する研削工具によって研削可能な被研削部材によって形成されている研削装置。 - 該被研削部材はカーボン製又はアルミナセラミック製である請求項1に記載の研削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010025208A JP5512314B2 (ja) | 2010-02-08 | 2010-02-08 | 研削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010025208A JP5512314B2 (ja) | 2010-02-08 | 2010-02-08 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011161546A JP2011161546A (ja) | 2011-08-25 |
JP5512314B2 true JP5512314B2 (ja) | 2014-06-04 |
Family
ID=44592844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010025208A Active JP5512314B2 (ja) | 2010-02-08 | 2010-02-08 | 研削装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5512314B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104526489A (zh) * | 2014-12-24 | 2015-04-22 | 常熟市梅李镇亚贸玻璃配件厂 | 玻璃磨面装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61265265A (ja) * | 1985-05-20 | 1986-11-25 | Toyoda Mach Works Ltd | 研削盤 |
JP2005169592A (ja) * | 2003-12-15 | 2005-06-30 | Okamoto Machine Tool Works Ltd | 非磁性ワ−クのチャック機構 |
JP2009154246A (ja) * | 2007-12-26 | 2009-07-16 | Tokyo Seimitsu Co Ltd | ウェーハを吸着させる吸着部の調整方法 |
JP4989498B2 (ja) * | 2008-01-18 | 2012-08-01 | 株式会社ディスコ | ウェーハ搬送装置および加工装置 |
-
2010
- 2010-02-08 JP JP2010025208A patent/JP5512314B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2011161546A (ja) | 2011-08-25 |
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