SG11201702264TA - Turn table transport carriage - Google Patents

Turn table transport carriage

Info

Publication number
SG11201702264TA
SG11201702264TA SG11201702264TA SG11201702264TA SG11201702264TA SG 11201702264T A SG11201702264T A SG 11201702264TA SG 11201702264T A SG11201702264T A SG 11201702264TA SG 11201702264T A SG11201702264T A SG 11201702264TA SG 11201702264T A SG11201702264T A SG 11201702264TA
Authority
SG
Singapore
Prior art keywords
transport carriage
turn table
table transport
turn
carriage
Prior art date
Application number
SG11201702264TA
Inventor
Michito Sato
Yosuke Kanai
Original Assignee
Shinetsu Handotai Kk
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk, Fujikoshi Machinery Corp filed Critical Shinetsu Handotai Kk
Publication of SG11201702264TA publication Critical patent/SG11201702264TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/02—Heads
    • F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
    • F16M11/06—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting
    • F16M11/10—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting around a horizontal axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/42—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters with arrangement for propelling the support stands on wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
    • A47B3/00—Folding or stowable tables
    • A47B3/10—Travelling or trunk tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Handcart (AREA)
  • Braking Arrangements (AREA)
SG11201702264TA 2014-10-22 2015-10-02 Turn table transport carriage SG11201702264TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014215583A JP6178774B2 (en) 2014-10-22 2014-10-22 Surface plate carriage
PCT/JP2015/005024 WO2016063464A1 (en) 2014-10-22 2015-10-02 Surface plate transport dolly

Publications (1)

Publication Number Publication Date
SG11201702264TA true SG11201702264TA (en) 2017-05-30

Family

ID=55760525

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702264TA SG11201702264TA (en) 2014-10-22 2015-10-02 Turn table transport carriage

Country Status (8)

Country Link
US (1) US10737365B2 (en)
JP (1) JP6178774B2 (en)
KR (1) KR102441700B1 (en)
CN (1) CN107073682B (en)
DE (1) DE112015004421T5 (en)
SG (1) SG11201702264TA (en)
TW (1) TWI611868B (en)
WO (1) WO2016063464A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI628132B (en) * 2016-11-23 2018-07-01 住華科技股份有限公司 Tiltable collecting device
TWI600601B (en) * 2016-11-23 2017-10-01 住華科技股份有限公司 Tiltable collecting device
CN112318251A (en) * 2020-10-15 2021-02-05 温州源利智能科技有限公司 Automatic polishing mechanism and polishing method for neodymium iron boron magnetic part
CN112224935B (en) * 2020-12-10 2021-03-09 万邑通(潍坊)信息科技有限公司 Portable auxiliary unloading equipment for logistics

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813825A (en) * 1969-09-30 1974-06-04 Alliance Tool And Die Corp Polishing machine or the like with a removable platen
US4268201A (en) * 1979-05-07 1981-05-19 Bud Antle, Inc. Unitizing system for produce cartons and the like
US4558648A (en) * 1983-09-20 1985-12-17 Lift-R Technologies, Inc. Energy-recycling scissors lift
JP3620629B2 (en) * 1998-02-20 2005-02-16 新東工業株式会社 Casting frame and surface plate carriage transfer equipment
JP2000061832A (en) * 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd Load cassette tilting mechanism for polishing device
JP2000141205A (en) * 1998-11-10 2000-05-23 Tokyo Seimitsu Co Ltd Wafer polishing device and polishing surface plate adjusting device
KR100591269B1 (en) * 2004-12-09 2006-06-26 주식회사 금화피에스씨 Valve disc lapping device
US7255355B2 (en) * 2005-01-03 2007-08-14 Mk Diamond Products, Inc. Portable collapsible stand
CN2795133Y (en) * 2005-04-26 2006-07-12 江苏天奇物流系统工程股份有限公司 Pneumatic hydraulic lifting trolley
JP2008093811A (en) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd Polishing head and polishing device
AR060518A1 (en) * 2007-04-18 2008-06-25 Hugo Enrique Chianale A PORTABLE CART-TABLE SET
JP5142077B2 (en) * 2008-02-05 2013-02-13 株式会社日立プラントテクノロジー Transport cart
JP5058853B2 (en) * 2008-03-10 2012-10-24 旭硝子株式会社 Wing-type container for transporting plate-like cargo and trailer for loading it
JP5348610B2 (en) * 2009-01-26 2013-11-20 旭硝子株式会社 Plate body loading device
TWI366638B (en) * 2009-02-20 2012-06-21 Rexon Ind Corp Ltd Mobile tool stand
JP2011126546A (en) * 2009-12-15 2011-06-30 Shin-Etsu Chemical Co Ltd Case for conveying glass substrate and cart for conveying glass substrate
JP2012096893A (en) * 2010-11-02 2012-05-24 Toppan Printing Co Ltd Substrate carriage
US8910970B2 (en) * 2011-06-10 2014-12-16 Rexon Industrial Corp., Ltd. Rapidly collapsible stand
US9022713B2 (en) * 2011-09-28 2015-05-05 Mil-Stak Inc. Rotatable and tiltable receiving table for a mid-size or big bale stack wagon
CN102745458B (en) * 2012-02-10 2014-12-17 湖南吉利汽车部件有限公司 Battery loading vehicle
JP6255303B2 (en) * 2014-05-14 2017-12-27 株式会社荏原製作所 Polishing table changer and polishing table removal method

Also Published As

Publication number Publication date
TW201636155A (en) 2016-10-16
KR102441700B1 (en) 2022-09-08
CN107073682B (en) 2020-03-10
CN107073682A (en) 2017-08-18
TWI611868B (en) 2018-01-21
JP6178774B2 (en) 2017-08-09
DE112015004421T5 (en) 2017-08-10
JP2016078220A (en) 2016-05-16
US10737365B2 (en) 2020-08-11
KR20170072200A (en) 2017-06-26
US20170304991A1 (en) 2017-10-26
WO2016063464A1 (en) 2016-04-28

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