JP6178774B2 - Surface plate carriage - Google Patents

Surface plate carriage Download PDF

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Publication number
JP6178774B2
JP6178774B2 JP2014215583A JP2014215583A JP6178774B2 JP 6178774 B2 JP6178774 B2 JP 6178774B2 JP 2014215583 A JP2014215583 A JP 2014215583A JP 2014215583 A JP2014215583 A JP 2014215583A JP 6178774 B2 JP6178774 B2 JP 6178774B2
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Prior art keywords
surface plate
holding
platen
polishing
polishing apparatus
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JP2014215583A
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JP2016078220A5 (en
JP2016078220A (en
Inventor
三千登 佐藤
三千登 佐藤
洋介 金井
洋介 金井
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FUJIKOSHI MACHINE INDUSTRY CO.,LTD.
Shin Etsu Handotai Co Ltd
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FUJIKOSHI MACHINE INDUSTRY CO.,LTD.
Shin Etsu Handotai Co Ltd
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Priority to JP2014215583A priority Critical patent/JP6178774B2/en
Application filed by FUJIKOSHI MACHINE INDUSTRY CO.,LTD., Shin Etsu Handotai Co Ltd filed Critical FUJIKOSHI MACHINE INDUSTRY CO.,LTD.
Priority to CN201580057427.8A priority patent/CN107073682B/en
Priority to PCT/JP2015/005024 priority patent/WO2016063464A1/en
Priority to US15/513,477 priority patent/US10737365B2/en
Priority to KR1020177010065A priority patent/KR102441700B1/en
Priority to SG11201702264TA priority patent/SG11201702264TA/en
Priority to DE112015004421.3T priority patent/DE112015004421T5/en
Priority to TW104134406A priority patent/TWI611868B/en
Publication of JP2016078220A publication Critical patent/JP2016078220A/en
Publication of JP2016078220A5 publication Critical patent/JP2016078220A5/ja
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Publication of JP6178774B2 publication Critical patent/JP6178774B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/02—Heads
    • F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
    • F16M11/06—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting
    • F16M11/10—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting around a horizontal axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/42—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters with arrangement for propelling the support stands on wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
    • A47B3/00—Folding or stowable tables
    • A47B3/10—Travelling or trunk tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Handcart (AREA)
  • Braking Arrangements (AREA)

Description

本発明は、半導体ウェーハなどを研磨する研磨装置から取り外した定盤、又は研磨装置に取り付けるための定盤を運搬するための定盤運搬台車に関する。   The present invention relates to a surface plate transport carriage for transporting a surface plate removed from a polishing apparatus for polishing a semiconductor wafer or the like, or a surface plate to be attached to the polishing apparatus.

シリコンウェーハに代表される半導体ウェーハ（以下、単にウェーハともいう）の研磨は、ウェーハの両面を同時に研磨する方法や、ウェーハの片面を研磨する方法で行われている。   Polishing of a semiconductor wafer typified by a silicon wafer (hereinafter also simply referred to as a wafer) is performed by a method of simultaneously polishing both surfaces of the wafer or a method of polishing one surface of the wafer.

ウェーハの片面の研磨は、図７に示すような、研磨布１２が張り付けられた定盤２と、研磨布１２上に研磨剤１３を供給する研磨剤供給機構１４と、ウェーハＷを保持する研磨ヘッド１５等から構成された研磨装置を用いて行われる。研磨ヘッド１５でウェーハＷを保持し、研磨剤供給機構１４から研磨布１２上に研磨剤１３を供給するとともに、定盤２と研磨ヘッド１５をそれぞれ回転させてウェーハＷの表面を研磨布１２に摺接させることによりウェーハＷを研磨する（例えば、特許文献１参照）。   As shown in FIG. 7, the polishing of one surface of the wafer is performed by a surface plate 2 on which a polishing cloth 12 is attached, an abrasive supply mechanism 14 for supplying an abrasive 13 on the polishing cloth 12, and a polishing for holding the wafer W. The polishing is performed using a polishing apparatus including the head 15 and the like. The wafer W is held by the polishing head 15, the polishing agent 13 is supplied from the polishing agent supply mechanism 14 onto the polishing cloth 12, and the surface of the wafer W is moved to the polishing cloth 12 by rotating the surface plate 2 and the polishing head 15. The wafer W is polished by sliding contact (see, for example, Patent Document 1).

また、ウェーハＷの研磨は、研磨布の種類や研磨剤の種類を換えて、多段で行われることが多く、インデックス方式と呼ばれる、２つの定盤ないし３つの定盤を持つ研磨装置が多く用いられている。   In addition, the polishing of the wafer W is often performed in multiple stages by changing the type of polishing cloth and the type of polishing agent, and a polishing apparatus having two or three surface plates called an index method is often used. It has been.

ここで、インデックス方式で３つの定盤を持つ研磨装置の一例を図８に示す。図８に示すようなインデックス方式の研磨装置１１は、３つの定盤２を有し、各定盤１つあたり、２つの研磨ヘッド１５が割り当てられている。そのため、１バッチ当たり２枚のウェーハの研磨が可能となり、特に生産性に優れる。 Here, an example of a polishing apparatus having three surface plates by the index method is shown in FIG. An index-type polishing apparatus 11 as shown in FIG. 8 has three surface plates 2 , and two polishing heads 15 are assigned to each surface plate. Therefore, it is possible to polish two wafers per batch, which is particularly excellent in productivity.

このような研磨装置でウェーハを研磨する際に使用する研磨布は、使用する前にシーズニングと呼ばれる立上作業が行われる。シーズニングの方法は、使用する研磨布によって異なるが、一般的には軟質のナイロンブラシを用いたブラッシングや、セラミックスやダイヤモンドのドレッサーを用いたドレッシングが行われる。また、研磨対象となるようなウェーハ（ダミーウェーハ）を実際に研磨するような、シーズニングも行われている。   A polishing cloth used when polishing a wafer with such a polishing apparatus is subjected to a rising operation called seasoning before use. The seasoning method varies depending on the polishing cloth to be used. Generally, brushing using a soft nylon brush or dressing using a ceramic or diamond dresser is performed. In addition, seasoning is performed to actually polish a wafer (dummy wafer) to be polished.

シーズニングは、交換した直後の新しい研磨布の表面の品質を安定させるため、長時間行われることが多い。特に、ダミーウェーハを用いたシーズニングは、研磨布の種類によっては、数時間行われることもある。そのため、実際に研磨を行う研磨装置内でシーズニングを行う場合、その間、研磨を一旦停止する必要がある。そのため、ウェーハの生産性が大幅に低下してしまう。   Seasoning is often performed for a long time in order to stabilize the quality of the surface of a new polishing cloth immediately after replacement. In particular, seasoning using a dummy wafer may be performed for several hours depending on the type of polishing cloth. For this reason, when seasoning is performed in a polishing apparatus that actually performs polishing, it is necessary to temporarily stop the polishing. For this reason, the productivity of the wafer is greatly reduced.

そこで、シーズニングを行うことによって、ウェーハの生産性が低下することを抑制するため、研磨布を張り付ける定盤を脱着可能にして、シーズニングのみを別の簡易研磨装置（以下、外段取り装置という）を用いて行う方法がとられている。   Therefore, in order to suppress the decrease in wafer productivity by performing seasoning, the surface plate to which the polishing cloth is attached is removable, and only seasoning is performed by another simple polishing device (hereinafter referred to as an external setup device). The method of using is taken.

外段取り装置を用いた研磨布のシーズニングを行うために、まず、外段取り装置に研磨布が張り付けられた定盤を取り付ける。次に、研磨布のシーズニングを行う。研磨布のシーズニングが終了したら、シーズニングを行った研磨布が張り付けられた定盤を外段取り装置から取り外す。その後、実際にウェーハの研磨を行う研磨装置へ定盤を取り付ける。   In order to season the polishing cloth using the outer setup device, first, a surface plate on which the polishing cloth is attached is attached to the outer setup device. Next, seasoning of the polishing cloth is performed. When seasoning of the polishing cloth is completed, the surface plate on which the polishing cloth subjected to seasoning is attached is removed from the outer setup device. Thereafter, the surface plate is attached to a polishing apparatus that actually polishes the wafer.

定盤は、ステンレス製やセラミックス製のものが多く用いられている。直径が８００ｍｍ、厚さが２０ｍｍの定盤の場合、ステンレス製の定盤の重量は約８０ｋｇ、セラミックス製の定盤の重量は約４０ｋｇとなる。このように、ステンレス製の定盤は、セラミックス製の定盤と比べて重量が重い。さらに、ステンレス製の定盤の場合、定盤が熱によって変形してしまい、これによって研磨品質に影響が生じることがある。このため、セラミックス製の定盤を用いる方が好ましい。   Many platens made of stainless steel or ceramics are used. In the case of a platen having a diameter of 800 mm and a thickness of 20 mm, the weight of the stainless steel platen is about 80 kg and the weight of the ceramic platen is about 40 kg. Thus, the stainless steel platen is heavier than the ceramic platen. Further, in the case of a stainless steel platen, the platen is deformed by heat, which may affect the polishing quality. For this reason, it is preferable to use a ceramic surface plate.

外段取り装置で研磨布のシーズニングを行う場合、上記のような重量物である定盤を頻繁に脱着する必要がある。このような重量物である定盤の脱着を容易に、且つ安全に行うため、図９に示すような定盤２を水平な状態で保持しながら運搬することができる定盤運搬台車１０１が用いられている。定盤運搬台車１０１は、定盤２を保持するための定盤保持部１０３と、定盤保持部を昇降させる昇降機構を具備している。   When seasoning a polishing cloth with an external setup device, it is necessary to frequently detach the surface plate which is a heavy object as described above. In order to easily and safely attach and detach such a heavy surface plate, a surface plate transport carriage 101 that can be transported while holding the surface plate 2 in a horizontal state as shown in FIG. 9 is used. It has been. The surface plate carriage 101 includes a surface plate holding portion 103 for holding the surface plate 2 and a lifting mechanism for moving the surface plate holding portion up and down.

定盤保持部１０３は、保持した定盤２が落下することを防止するための、定盤２を水平状態で保持してロックする定盤落下防止機構１０９を有している。定盤保持部１０３の定盤２と接する側の面には、ローラー１１０や、フリーベアリングを設置し、重量物である定盤２を容易にスライド移動できるようになっている。
昇降機構として、油圧方式や、チェーン、ボールねじ等を用いた機構が使用されている。 The surface plate holding unit 103 includes a surface plate fall prevention mechanism 109 that holds and locks the surface plate 2 in a horizontal state to prevent the held surface plate 2 from falling. A roller 110 and a free bearing are installed on the surface of the surface plate holding unit 103 on the side in contact with the surface plate 2 so that the surface plate 2 that is a heavy object can be easily slid.
As a lifting mechanism, a mechanism using a hydraulic system, a chain, a ball screw, or the like is used.

ここで、定盤２を研磨装置から取り外し、上記のような定盤運搬台車１０１へ移動する際の一般的な手順を示す。   Here, a general procedure for removing the surface plate 2 from the polishing apparatus and moving the surface plate 2 to the surface plate carriage 101 as described above will be described.

研磨装置内に設置されていた、取り外す定盤２の正面に定盤運搬台車１０１を配置する。
研磨装置のドアを開け、定盤運搬台車１０１の定盤保持部１０３の高さを定盤２の高さと同じか、若干低い位置に調整する。この時、定盤２と定盤運搬台車１０１の位置によっては、その距離が離れている場合がある。このような場合には、定盤２と定盤運搬台車１０１の間にガイド板を設置する。 The surface plate transport cart 101 is disposed in front of the surface plate 2 to be removed, which has been installed in the polishing apparatus.
The door of the polishing apparatus is opened, and the height of the surface plate holder 103 of the surface plate carriage 101 is adjusted to a position that is the same as or slightly lower than the height of the surface plate 2. At this time, depending on the positions of the surface plate 2 and the surface plate carriage 101, the distance may be increased. In such a case, a guide plate is installed between the surface plate 2 and the surface plate carriage 101.

一般的に定盤２は、ウェーハを研磨する際などの回転による飛び出しを防止するための機械的なロック機構と、真空吸着によって研磨装置内の所定の場所に固定されている。研磨装置から定盤２を取り外すために、まず、機械的なロック機構を外す。さらに、真空吸着を停止させる。このとき、真空吸着のラインを利用して、エアを供給する事により、定盤２を浮き上がらせることで、定盤２を容易に動かすことが可能となる。また、定盤２が滑りやすいように、水を供給しながら研磨装置から定盤２の取り外しを行ってもよい。   In general, the surface plate 2 is fixed at a predetermined location in the polishing apparatus by a mechanical lock mechanism for preventing popping out by rotation such as when polishing a wafer and vacuum suction. In order to remove the surface plate 2 from the polishing apparatus, the mechanical locking mechanism is first removed. Further, the vacuum suction is stopped. At this time, it is possible to easily move the surface plate 2 by raising the surface plate 2 by supplying air using a vacuum suction line. Moreover, you may remove the surface plate 2 from a grinding | polishing apparatus, supplying water so that the surface plate 2 may slip easily.

定盤運搬台車１０１の定盤保持部１０３にはローラー１１０やフリーベアリングが設けられているため、定盤２を安全にスライド移動することができる。定盤保持部１０３の所定の位置まで定盤をスライド移動し、定盤保持部１０３で定盤を保持する。そして、定盤落下防止機構１０９にて定盤２を固定し、運搬する。   Since the surface plate holding portion 103 of the surface plate carriage 101 is provided with a roller 110 and a free bearing, the surface plate 2 can be slid and moved safely. The surface plate is slid to a predetermined position of the surface plate holding unit 103, and the surface plate is held by the surface plate holding unit 103. Then, the surface plate 2 is fixed and transported by the surface plate fall prevention mechanism 109.

外段取り装置で定盤上に張り付けた研磨布のシーズニングを終えた定盤を研磨装置に取り付ける際には、定盤運搬台車の定盤保持部を研磨装置内の定盤受けの高さと同じか、若干高い位置に調整すること以外は、上記した研磨装置から定盤の取り出しと逆の手順で、定盤を定盤運搬台車から研磨装置内にスライド移動し、取り付けを行うことができる。   When attaching a surface plate that has been seasoned with a polishing cloth affixed to the surface plate using an external setup device, make sure that the surface plate holder of the surface plate carriage is the same as the height of the surface plate holder in the polishing device. Except for adjusting to a slightly higher position, the surface plate can be slid from the surface plate carriage into the polishing device and attached in the reverse procedure of taking out the surface plate from the polishing device.

しかしながら、研磨装置が大型になると使用する定盤の直径も大きくなるため、定盤運搬台車で定盤を運搬するための通路も広くしなければならない。また、定盤の脱着用にはさらに広いスペースが必要となるため、研磨装置周辺のスペース効率がますます低下するという問題があった。   However, since the diameter of the surface plate to be used increases as the polishing apparatus becomes large, the passage for transporting the surface plate by the surface plate transport cart must also be widened. Further, since a larger space is required for detaching the surface plate, there is a problem that the space efficiency around the polishing apparatus is further reduced.

特に、図８に示すようなインデックス方式の研磨装置の場合、３方向から定盤を脱着することになるため、研磨装置の周辺のスペース効率が大幅に低下してしまう。   In particular, in the case of an index-type polishing apparatus as shown in FIG. 8, since the surface plate is detached from three directions, the space efficiency around the polishing apparatus is greatly reduced.

このため、定盤を脱着するためのスペースを隣合う研磨装置で共用するようにレイアウトすることによって、スペース効率の向上が図られている。
また、図９に示す定盤運搬台車１０１は、定盤２に対し正面からアクセスして、定盤２を脱着する縦脱着方式であるが、定盤運搬台車１０１の側面から定盤を脱着する定盤運搬台車も使用されている。図１０に縦脱着方式の定盤運搬台車１０１と、横脱着方式の定盤運搬台車１０１ａによる研磨装置１１へ定盤を取り付ける際の様子を示す。 For this reason, the space efficiency is improved by laying out the space for detaching the surface plate so as to be shared by the adjacent polishing apparatuses.
9 is a vertical detachment method in which the surface plate 2 is accessed from the front and the surface plate 2 is detached, but the surface plate is detached from the side surface of the surface plate transportation vehicle 101. A platen carriage is also used. FIG. 10 shows a state in which the surface plate is attached to the polishing apparatus 11 by the vertical detachable type surface plate carrier trolley 101 and the horizontal detachable type surface plate carrier trolley 101a.

研磨装置１１の周囲には電源配線や給排水配管類（図示しない）がある。このため、横脱着方式の定盤運搬台車１０１ａは、縦脱着方式の定盤運搬台車１０１に比べ、研磨装置１１の側面に近づけにくく作業性が劣る。しかしながら、図１０に示すように、横脱着方式の定盤運搬台車１０１ａでは、研磨装置１１に定盤を脱着する際のスペースを小さくすることができる。このため、隣合う研磨装置同士の間隔を狭めることができるため、スペース効率に優れる。   Around the polishing apparatus 11, there are power supply wiring and water supply / drainage piping (not shown). For this reason, the horizontal detachable surface plate transport cart 101a is less close to the side surface of the polishing apparatus 11 and is less workable than the vertical detachable surface plate transport cart 101. However, as shown in FIG. 10, in the horizontal detachable surface plate carrier cart 101 a, the space for attaching and detaching the surface plate to the polishing apparatus 11 can be reduced. For this reason, since the space | interval of adjacent grinding | polishing apparatuses can be narrowed, it is excellent in space efficiency.

しかしながら、図１０に示すような横脱着方式の定盤運搬台車１０１ａの場合でも、定盤運搬台車１０１ａは定盤を水平の状態で運搬し、脱着作業を行う。このため、隣合う研磨装置同士の間隔は、定盤運搬台車で運搬する定盤の直径以上のスペースが必ず必要となる。さらに、定盤運搬台車で定盤を運搬する際や、研磨装置から定盤を脱着する際などの作業性も考慮すると、少なくとも、定盤の直径プラス２００ｍｍ以上のスペースが必要となる。   However, even in the case of the horizontal detachable platen carrier 101a as shown in FIG. 10, the platen carrier 101a conveys the platen in a horizontal state and performs detachment work. For this reason, as for the space | interval of adjacent grinding | polishing apparatuses, the space more than the diameter of the surface plate conveyed by a surface plate conveyance trolley is necessarily required. Furthermore, when workability such as when the surface plate is transported by the surface plate carriage or when the surface plate is detached from the polishing apparatus is taken into consideration, at least a space of the surface plate diameter plus 200 mm or more is required.

研磨装置でウェーハを研磨した際のウェーハの表面品質を均一化するためには、研磨布とウェーハが常に接触した状態で研磨を行うことが望ましい。そのため、研磨する対象のウェーハの直径よりも定盤の直径は大きいことが好ましい。また、生産性を上げるため、図８のように１つの定盤２に対して２つの研磨ヘッド１５が割り当てられたような研磨装置１１が多く使用されている。   In order to make the surface quality of the wafer uniform when the wafer is polished by the polishing apparatus, it is desirable to perform the polishing while the polishing cloth and the wafer are always in contact with each other. Therefore, the diameter of the surface plate is preferably larger than the diameter of the wafer to be polished. Further, in order to increase productivity, a polishing apparatus 11 in which two polishing heads 15 are assigned to one surface plate 2 as shown in FIG. 8 is often used.

このような研磨装置では、１つの定盤上で２枚のウェーハを同時に研磨するため、例えば直径３００ｍｍのウェーハを研磨する場合、定盤の直径が８００ｍｍの定盤が多く使用されている。上記したように、隣合う研磨装置同士を設置する間隔は、少なくとも定盤の直径プラス２００ｍｍ程度のスペースが必要となるので、定盤の直径が８００ｍｍの場合、１０００ｍｍ以上とする必要があった。このように、直径３００ｍｍ以上のウェーハを研磨する研磨装置では、スペース効率を上げることが難しかった。   In such a polishing apparatus, since two wafers are simultaneously polished on one surface plate, for example, when polishing a wafer having a diameter of 300 mm, a surface plate having a surface plate diameter of 800 mm is often used. As described above, the space between adjacent polishing apparatuses needs to be at least a space of about 200 mm in diameter of the surface plate, and therefore, when the diameter of the surface plate is 800 mm, it is necessary to set it to 1000 mm or more. Thus, in a polishing apparatus that polishes a wafer having a diameter of 300 mm or more, it is difficult to increase the space efficiency.

ところで、ウェーハの直径が３００ｍｍを超える大直径のウェーハとして、直径が４５０ｍｍのウェーハが検討されている。直径が４５０ｍｍのウェーハを２枚同時に研磨することができる定盤として、例えば直径が１２００ｍｍのものを使用することができる。このような大きさの定盤の重量は、セラミックス製の場合、約９０ｋｇとなる。定盤の直径が１２００ｍｍの研磨装置の場合、従来の定盤運搬台車を用いて定盤の脱着作業及び運搬を行うためのスペースとして、１４００ｍｍ以上が必要となる。   By the way, a wafer having a diameter of 450 mm has been studied as a large diameter wafer having a diameter exceeding 300 mm. As a surface plate capable of simultaneously polishing two wafers having a diameter of 450 mm, for example, a plate having a diameter of 1200 mm can be used. The weight of the surface plate having such a size is about 90 kg in the case of ceramics. In the case of a polishing apparatus having a surface plate having a diameter of 1200 mm, a space for removing and attaching the surface plate using a conventional surface plate carrier is required to be 1400 mm or more.

このように、従来の定盤運搬台車で、定盤の脱着作業及び運搬を行う場合、定盤が常に水平な状態で行うため、スペース効率が良くなかった。   As described above, when performing the detaching operation and transportation of the surface plate with the conventional surface plate transport cart, the surface plate is always in a horizontal state, and thus the space efficiency is not good.

半導体工場に設置される研磨装置は、異物による微小なスクラッチや欠陥を抑制するため、クリーンルーム内に設置されることが多く、研磨装置を設置する際のスペース効率は、工場の建設コストや、ユーティリティのランニングコストに影響する。このため、研磨装置の周辺のスペース効率の改善が求められていた。   Polishing equipment installed in a semiconductor factory is often installed in a clean room to suppress minute scratches and defects caused by foreign matter, and space efficiency when installing the polishing equipment depends on the construction cost of the factory and utility Affects the running cost of For this reason, improvement in space efficiency around the polishing apparatus has been demanded.

特開２００８−９３８１１号公報JP 2008-93811 A

本発明は上記のような問題に鑑みてなされたもので、定盤を運搬する際の幅が狭く、定盤を運搬するための通路の幅を狭くすることができる定盤運搬台車を提供することを目的とする。   The present invention has been made in view of the above-described problems, and provides a surface plate transport cart that has a narrow width when transporting a surface plate and can narrow a width of a passage for transporting the surface plate. For the purpose.

上記目的を達成するために、本発明によれば、研磨装置から取り外した定盤、又は前記研磨装置に取り付けるための前記定盤を運搬するための定盤運搬台車であって、該定盤運搬台車は、前記定盤を保持するための定盤保持部と、該定盤保持部を下側から支持する支持台と、前記定盤保持部の昇降を行う昇降機構と、前記定盤を保持した前記定盤保持部を傾ける傾け機構を具備し、
前記定盤を保持した前記定盤保持部を前記傾け機構で傾けた状態で、前記定盤を運搬できるものであることを特徴とする定盤運搬台車を提供する。 In order to achieve the above object, according to the present invention, there is provided a surface plate removed from a polishing apparatus, or a surface plate transport carriage for transporting the surface plate to be attached to the polishing apparatus. The carriage holds the platen, a platen holding unit for holding the platen, a support table for supporting the platen holding unit from below, a lifting mechanism for moving the platen holding unit up and down, and holding the platen Provided with a tilting mechanism for tilting the surface plate holder,
There is provided a surface plate transport cart characterized in that the surface plate can be transported in a state where the surface plate holding portion holding the surface plate is tilted by the tilt mechanism.

このようなものであれば、定盤を運搬する際の定盤運搬台車の幅を狭くすることができる。そのため、定盤を運搬するための通路の幅を狭くすることができる。   If it is such, the width | variety of the surface plate carrying cart at the time of conveying a surface plate can be narrowed. Therefore, the width of the passage for carrying the surface plate can be reduced.

このとき、前記定盤運搬台車を側面から見た時、前記定盤保持部の横方向の長さが前記支持台の横方向の長さよりも長く、前記支持台に対して上記定盤保持部が偏心して配置されたものであることが好ましい。
このようなものであれば、定盤保持部を斜めの状態から、定盤を着脱するために、水平な状態に変える際に、偏心して配置された定盤保持部の長い方を研磨装置内に差し込んだ状態になるようにすることができるので、定盤を脱着する時に必要なスペースを小さくすることができる。これにより、隣合う研磨装置同士の間隔を一層狭くすることができる。さらに、定盤を水平にした際、定盤の一部が研磨装置内に入り込んだ状態となるため、ガイド板の設置も必要なくなるので、作業性に優れる。 At this time, when the surface plate carriage is viewed from the side, the horizontal length of the surface plate holding portion is longer than the horizontal length of the support base, and the surface plate holding portion with respect to the support base. Are preferably arranged eccentrically.
If this is the case, when the platen holding part is changed from a slanted state to a horizontal state in order to attach or detach the platen, the longer one of the platen holding parts that are arranged eccentrically is placed in the polishing apparatus. Therefore, the space required for attaching and detaching the surface plate can be reduced. Thereby, the space | interval of adjacent grinding | polishing apparatuses can be narrowed further. Further, when the surface plate is leveled, a part of the surface plate enters the polishing apparatus, so that it is not necessary to install a guide plate.

このとき、前記傾け機構は、前記定盤保持部の外周部に取り付けられた内側方向に収納可能な少なくとも１つの傾け板と、該傾け板の下方に配置された少なくとも１つのストッパーを有し、前記定盤保持部を下降させた時、前記ストッパーにより前記傾け板の下降を妨げることで、前記定盤保持部の前記傾け板が配置されている部分が下降せず、前記定盤保持部を傾けることができるものであることが好ましい。
このような簡単な機構で定盤を保持した定盤保持部を傾けることができるので、コストを節約することができる。 At this time, the tilt mechanism has at least one tilt plate that can be accommodated in the inner direction attached to the outer peripheral portion of the surface plate holding portion, and at least one stopper disposed below the tilt plate, When the surface plate holding portion is lowered, the tilt plate is prevented from being lowered by the stopper, so that the portion of the surface plate holding portion where the inclined plate is disposed does not descend, and the surface plate holding portion is It is preferable that it can be tilted.
Since the platen holding part holding the platen can be tilted with such a simple mechanism, cost can be saved.

本発明の定盤運搬台車であれば、定盤を運搬する際の定盤運搬台車の幅を小さくすることができるので、定盤を運搬するための通路の幅を狭くすることができる。   In the case of the surface plate transport cart of the present invention, the width of the surface plate transport cart when transporting the surface plate can be reduced, so that the width of the passage for transporting the surface plate can be reduced.

本発明の定盤運搬台車の一例を示した概略図である。It is the schematic which showed an example of the surface plate carrier cart of this invention. 本発明の定盤運搬台車で、定盤を定盤保持部を斜めに保持した状態と水平に保持した状態の中間の状態での様子を示した概略図である。It is the schematic which showed the mode in the intermediate | middle state of the state which hold | maintained the surface plate holding | maintenance part diagonally with the surface plate conveyance trolley | bogie of this invention, and the state hold | maintained horizontally. 本発明の定盤運搬台車で、定盤を定盤保持部で水平に保持した際の様子を示した概略図である。It is the schematic which showed the mode at the time of holding the surface plate horizontally with the surface plate holding | maintenance part by the surface plate carrier trolley | bogie of this invention. 本発明の定盤運搬台車で、定盤を定盤保持部で水平な状態で保持した際の概略上面図である。It is a schematic top view at the time of hold | maintaining a surface plate in a horizontal state with a surface plate holding | maintenance part with the surface plate carrying trolley | bogie of this invention. 本発明の定盤運搬台車で、定盤を定盤保持部で斜めに保持した際の概略上面図である。It is a schematic top view at the time of hold | maintaining a surface plate diagonally with a surface plate holding | maintenance part with the surface plate carrying trolley | bogie of this invention. 本発明の定盤運搬台車を用いて、定盤を研磨装置へ取り付ける際の様子を示した概略図である。It is the schematic which showed the mode at the time of attaching a surface plate to a grinding | polishing apparatus using the surface plate carrier cart of this invention. 一般的なウェーハの片面研磨装置の一例を示した概略図である。It is the schematic which showed an example of the general single-sided polisher of a wafer. 一般的なインデックス方式のウェーハの研磨装置の一例を示した概略図である。It is the schematic which showed an example of the polishing apparatus of the general index system wafer. 従来の定盤運搬台車の一例を示した概略上面図である。It is the schematic top view which showed an example of the conventional surface plate carrier. 従来の定盤運搬台車を用いて研磨装置へ定盤を取り付ける様子を示した概略図である。It is the schematic which showed a mode that the surface plate was attached to a grinding | polishing apparatus using the conventional surface plate carrier cart.

上述したように、定盤運搬台車で定盤を運搬する際に、定盤を水平な状態で運搬すると、定盤運搬用の通路幅を広くしなければならず、スペース効率が悪いという問題があった。そこで、本発明者らはこのような問題を解決すべく鋭意検討を重ねた。その結果、定盤を保持した定盤保持部を傾けた状態で、定盤を運搬することで、運搬する際の通路の幅を狭めることができるということに想到した。そして、これらを実施するための最良の形態について精査し、本発明を完成させた。以下に図面を参照しながら本発明の定盤運搬台車について詳細に説明する。   As mentioned above, when transporting a surface plate with a surface plate transport cart, if the surface plate is transported in a horizontal state, the width of the passage for transporting the surface plate must be widened, resulting in a problem of poor space efficiency. there were. Therefore, the present inventors have intensively studied to solve such problems. As a result, the inventors have conceived that the width of the passage when transporting can be narrowed by transporting the surface plate with the surface plate holding portion holding the surface plate tilted. And the best form for implementing these was scrutinized and the present invention was completed. Hereinafter, the surface plate carrier of the present invention will be described in detail with reference to the drawings.

本発明の定盤運搬台車は、研磨装置から取り外した定盤、又は研磨装置に取り付けるための定盤を運搬するためのものである。図１に示すように、本発明の定盤運搬台車１は、定盤２を保持するための定盤保持部３と、定盤保持部３を下側から支持する支持台４と、定盤保持部３の昇降を行う昇降機構５と、定盤２を保持した定盤保持部３を傾ける傾け機構８を具備している。
The surface plate transport cart of the present invention is for transporting a surface plate removed from the polishing apparatus or a surface plate to be attached to the polishing apparatus. As shown in FIG. 1, a surface plate carrier 1 of the present invention includes a surface plate holding portion 3 for holding a surface plate 2, a support table 4 for supporting the surface plate holding portion 3 from below, and a surface plate. An elevating mechanism 5 for elevating the holding unit 3 and a tilting mechanism 8 for inclining the surface plate holding unit 3 holding the surface plate 2 are provided.

定盤保持部３の形状は特に限定されず、例えば図４に示すように、長方形を組み合わせたような形状とすることができる。定盤保持部の横幅は、保持する定盤の直径よりも短くすることが好ましく、このようにすれば、定盤を保持した定盤保持部を傾けた際の幅を最小限にすることができる。   The shape of the surface plate holding unit 3 is not particularly limited, and for example, as shown in FIG. The horizontal width of the surface plate holding part is preferably shorter than the diameter of the surface plate to be held, and in this way, the width when the surface plate holding part holding the surface plate is tilted can be minimized. it can.

図４に示すように、定盤保持部３の定盤２と接する面には、ローラー１０やフリーベアリングを配置することが好ましい。このようなものであれば、研磨装置から定盤２を取り外し、定盤保持部３へと移動する際、又は定盤２を研磨装置へ取り付けるために、定盤保持部３から研磨装置へと移動させる際に、容易にスライド移動することができ、操作性に優れる。 As shown in FIG. 4, it is preferable to dispose a roller 10 or a free bearing on the surface of the surface plate holder 3 that contacts the surface plate 2. If it is such, when the surface plate 2 is removed from the polishing apparatus and moved to the surface plate holding part 3, or in order to attach the surface plate 2 to the polishing apparatus, from the surface plate holding part 3 to the polishing apparatus. When moving, it can be easily slid and has excellent operability.

定盤保持部３は、図５に示すように、定盤２を保持した定盤保持部３を斜めに傾けた際に定盤２が落下しないようなものであることが好ましく、例えば、定盤の落下防止機構９を設けることができる。定盤の落下防止機構は、落下防止機構をロックした状態では定盤が定盤保持部から離脱しないように定盤を固定しており、ロックを解除した状態では、定盤を保持部から自在に離脱させることができるようなものとすることができる。このようなものであれば、定盤２を保持した定盤保持部３を傾けた状態にしても、安全に定盤を運搬することができる。   As shown in FIG. 5, the surface plate holding part 3 is preferably such that the surface plate 2 does not fall when the surface plate holding part 3 holding the surface plate 2 is tilted. A board fall prevention mechanism 9 can be provided. The fall prevention mechanism of the surface plate is fixed so that the surface plate does not come off the surface plate holding part when the fall prevention mechanism is locked, and the surface plate can be freely moved from the holding part when the lock is released. It can be made to be able to be detached. If it is such, even if the surface plate holding | maintenance part 3 which hold | maintained the surface plate 2 was inclined, a surface plate can be conveyed safely.

このとき、図３のように、定盤運搬台車１を側面から見た時、定盤保持部３の横方向の長さが支持台４の横方向の長さよりも長く、支持台４に対して定盤保持部３が偏心して配置されたものであることが好ましい。このような定盤保持部３で、定盤２を保持した場合、保持した定盤も支持台４に対して偏心した状態となる。そのため、定盤保持部３の支持台４に対して偏心して配置され、長く出っ張った方の側では、定盤２は支持台４から大きくせり出した状態になる。   At this time, as shown in FIG. 3, when the surface plate carrier 1 is viewed from the side, the horizontal length of the surface plate holding portion 3 is longer than the horizontal length of the support 4, and It is preferable that the surface plate holding part 3 is arranged eccentrically. When the surface plate 2 is held by such a surface plate holding unit 3, the held surface plate is also eccentric with respect to the support base 4. For this reason, the surface plate 2 is arranged eccentrically with respect to the support base 4 of the surface plate holding portion 3, and the surface plate 2 protrudes largely from the support base 4 on the side that protrudes longer.

このようなものであれば、図６に示すように、定盤２を保持した定盤保持部３を斜めにした状態から、定盤２を着脱するために、水平な状態に変える際に、偏心して配置された定盤保持部３の長く出っ張った方の側を研磨装置１１内に差し込んだ状態になるようにすることができるので、定盤２を脱着する時に必要なスペースを小さくすることができる。これにより、隣合う研磨装置同士の間隔を狭くすることができる。さらに、定盤２を水平にした際、定盤２の一部が研磨装置１１内に入り込んだ状態となるため、ガイド板を設置する必要がない。また、定盤２を水平にした時の高さが、定盤受け１６よりも少し高い位置になるように、ストッパー６の位置を調整することにより、定盤２と定盤受け１６の接触を防止できるため、作業性に優れる。   If this is the case, as shown in FIG. 6, when the platen holding part 3 holding the platen 2 is tilted, the platen 2 is attached to and detached from the horizontal state in order to attach and detach the platen 2. Since the longer protruding side of the platen holding part 3 arranged eccentrically can be inserted into the polishing apparatus 11, the space required when removing the platen 2 can be reduced. Can do. Thereby, the space | interval of adjacent grinding | polishing apparatuses can be narrowed. Furthermore, when the surface plate 2 is leveled, a part of the surface plate 2 enters the polishing apparatus 11, so that it is not necessary to install a guide plate. Further, by adjusting the position of the stopper 6 so that the height when the surface plate 2 is leveled is slightly higher than the surface plate receiver 16, the contact between the surface plate 2 and the surface plate receiver 16 is maintained. Since it can prevent, it is excellent in workability.

図１、図２、図３に示すように、支持台４は定盤保持部３を下側から支持している。
支持台４の横幅は、定盤保持部の横方向の長さよりも短いことが好ましい。定盤保持部で保持した定盤２を傾けた際の横方向の長さよりも短いことが好ましい。このようにすれば、定盤２を保持した定盤保持部３を傾けた際の幅を最小限にすることができる。 As shown in FIGS. 1, 2, and 3, the support 4 supports the surface plate holder 3 from below.
The lateral width of the support base 4 is preferably shorter than the lateral length of the surface plate holder. It is preferable that the length of the surface plate 2 held by the surface plate holding part is shorter than the lateral length when the platen 2 is tilted. In this way, the width when the platen holding part 3 holding the platen 2 is tilted can be minimized.

支持台４の下部には、定盤運搬台車１が移動自在となるように、複数の車輪１８を配置することができる。車輪１８には、ホイールロックが配置されており、定盤の取り付けや取り外しなどの際に、定盤運搬台車が勝手に動かないようにすることができる。
図１に示すように、支持台４の高さは、定盤２を保持した定盤保持部３を傾けた際に、定盤保持部及び定盤が地面と接触しないような高さであることが好ましい。 A plurality of wheels 18 can be arranged at the lower part of the support base 4 so that the surface plate carrier 1 can move freely. A wheel lock is arranged on the wheel 18 so that the surface plate carriage can be prevented from moving freely when the surface plate is attached or detached.
As shown in FIG. 1, the height of the support table 4 is such that when the surface plate holding portion 3 holding the surface plate 2 is tilted, the surface plate holding portion and the surface plate are not in contact with the ground. It is preferable.

昇降機構５は、定盤保持部３の下部に配置されたものとすることができる。昇降機構５は、定盤保持部３を任意の高さに昇降させることができるものであることが好ましく、例えば、油圧方式による構成や、チェーン、ボールねじ等を用いた機構とすることができる。   The elevating mechanism 5 can be disposed below the surface plate holding unit 3. The elevating mechanism 5 is preferably capable of elevating the surface plate holding unit 3 to an arbitrary height, and can be a mechanism using a hydraulic system, a chain, a ball screw, or the like, for example. .

昇降機構５による定盤保持部３の昇降は手動操作で行うことができる。このようにすれば、昇降のためにほかの装置を搭載する必要がないので、コストがかからない。
昇降機構５による定盤保持部３の昇降をバッテリー駆動で行うためのバッテリー装置を定盤運搬台車１に搭載することができる。昇降機構５をバッテリー駆動にした場合、定盤保持部３の昇降を容易に行うことができるので好ましい。 The raising / lowering of the surface plate holding part 3 by the raising / lowering mechanism 5 can be performed manually. In this way, there is no need to install another device for raising and lowering, and therefore no cost is incurred.
A battery device for moving the platen holding unit 3 up and down by the elevating mechanism 5 by battery drive can be mounted on the platen carriage 1. When the elevating mechanism 5 is battery-driven, it is preferable because the surface plate holder 3 can be easily moved up and down.

傾け機構８は、定盤保持部３の外周部に取り付けられた内側方向に収納可能な少なくとも１つの傾け板７と、傾け板７の下方に配置された少なくとも１つのストッパー６を有すものとすることができる。例えば、ストッパー６は、ローラー付きストッパーを用いることができる。   The tilting mechanism 8 has at least one tilting plate 7 attached to the outer peripheral portion of the surface plate holding unit 3 and can be accommodated in the inward direction, and has at least one stopper 6 disposed below the tilting plate 7. can do. For example, the stopper 6 can be a stopper with a roller.

水平な状態で定盤２を保持した定盤保持部３（図３）を昇降機構５で下降させた時、ストッパー６が傾け板７の背面に接触することで下降を妨げる（図２）。これにより、定盤保持部３の傾け板７が配置されている部分が下降しないので、定盤保持部３を傾けることができる（図１）。このようして、傾け機構８で、定盤２を保持した定盤保持部３を斜めにすることができるので、定盤２を水平な状態で保持しているときと比べて定盤運搬台車１の幅を狭めることができる。   When the platen holding part 3 (FIG. 3) holding the platen 2 in a horizontal state is lowered by the elevating mechanism 5, the stopper 6 comes into contact with the back surface of the inclined plate 7 to prevent the descent (FIG. 2). Thereby, since the part in which the inclined plate 7 of the surface plate holding | maintenance part 3 is arrange | positioned does not descend | fall, the surface plate holding | maintenance part 3 can be inclined (FIG. 1). In this manner, the tilting mechanism 8 can tilt the surface plate holding portion 3 that holds the surface plate 2, so that the surface plate transport cart is compared to when the surface plate 2 is held in a horizontal state. The width of 1 can be reduced.

一方、傾け板７を定盤保持部３の内側方向に収納した状態で、定盤２を保持した定盤保持部３を昇降機構５で降下させた場合は、傾き板７がストッパー６と接触しないので、定盤２を保持した定盤保持部３を水平な状態のままで降下させることができる。 On the other hand, when the platen holding unit 3 holding the platen 2 is lowered by the elevating mechanism 5 in a state where the inclined plate 7 is housed inside the platen holding unit 3, the inclined plate 7 contacts the stopper 6. does not, can Ru lowers the platen holder 3 holding the platen 2 while the horizontal state.

このような簡単な機構で定盤２を保持した定盤保持部３を傾けることができるので、コストを節約することができる。   Since the platen holding part 3 holding the platen 2 can be tilted with such a simple mechanism, the cost can be saved.

次に、図６を参照しながら、研磨装置１１に定盤２を取り付ける際の動作を説明する。
定盤２を保持した定盤保持部３を斜めに傾けた状態で運搬し、定盤２を取り付ける定盤受け１６の正面に定盤運搬台車１を停車させ、ホイールロックなどで固定する。 Next, the operation when attaching the surface plate 2 to the polishing apparatus 11 will be described with reference to FIG.
The surface plate holding part 3 holding the surface plate 2 is transported in an inclined state, and the surface plate carriage 1 is stopped in front of the surface plate receiver 16 to which the surface plate 2 is attached, and fixed with a wheel lock or the like.

定盤２を保持した定盤保持部３を、傾け機構で水平な状態になるように操作すると、定盤２は水平になりながら研磨装置１１の内部に定盤２が入り込んだ状態となる。
傾け板を定盤保持部３の内側に収納して、定盤保持部３で保持した定盤２を水平な状態のまま下降させて、定盤２を定盤受け１６の位置と同じか若干高い位置になるように調整する。 When the surface plate holding part 3 holding the surface plate 2 is operated so as to be in a horizontal state by the tilting mechanism, the surface plate 2 is in a state where the surface plate 2 enters the polishing apparatus 11 while being horizontal.
The inclined plate is stored inside the surface plate holding unit 3, and the surface plate 2 held by the surface plate holding unit 3 is lowered in a horizontal state so that the surface plate 2 is the same as the position of the surface plate receiver 16 or slightly. Adjust to a higher position.

定盤保持部３の、定盤２の落下防止機構のロックを解除し、定盤２を定盤保持部３から研磨装置１１側にスライド移動させる。定盤保持部３は、ローラーやフリーベアリングを有しているため、容易に定盤２をスライド移動することができる。また、定盤受け１６の真空吸着用の穴を利用してエアを供給することで、定盤２を浮上させることができるので、容易に定盤２をスライドさせることができる。この時、重量物である定盤２が滑りやすいように、定盤受け１６に水を供給してもよい。   The lock of the fall prevention mechanism for the platen 2 of the platen holding unit 3 is released, and the platen 2 is slid from the platen holding unit 3 to the polishing apparatus 11 side. Since the surface plate holding part 3 has a roller and a free bearing, the surface plate 2 can be easily slid. Moreover, since the surface plate 2 can be floated by supplying air using the vacuum suction hole of the surface plate receiver 16, the surface plate 2 can be easily slid. At this time, water may be supplied to the surface plate receiver 16 so that the surface plate 2, which is a heavy object, is slippery.

以下、本発明の実施例及び比較例を示して本発明をより具体的に説明するが、本発明はこれらに限定されるものではない。   EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples of the present invention, but the present invention is not limited to these.

（実施例）
傾け機構を有する本発明の定盤運搬台車に、直径が８００ｍｍ、１２００ｍｍの定盤を定盤保持部に保持させ、傾け機構で、定盤を保持した定盤保持部を傾けた。このときの、定盤運搬台車の幅を測定した。該測定した定盤運搬台車の幅に２００ｍｍを加算して、運搬通路幅を算出した。それぞれの測定結果及び計算結果を表１及び表２に示した。なお、表１、表２には、後述する比較例の結果についても併せて示した。 (Example)
A platen having a diameter of 800 mm and 1200 mm was held on a platen holding part on the platen carriage of the present invention having an inclination mechanism, and the platen holding part holding the platen was inclined by the inclination mechanism. At this time, the width of the surface plate carriage was measured. 200 mm was added to the measured width of the surface plate transport carriage to calculate the transport passage width. The respective measurement results and calculation results are shown in Tables 1 and 2. Tables 1 and 2 also show the results of comparative examples described later.

定盤の直径が８００ｍｍの場合、定盤を保持した定盤保持部を傾けた際の定盤運搬台車の幅は５００ｍｍであった。運搬通路の幅は、７００ｍｍと算出された。   When the diameter of the surface plate was 800 mm, the width of the surface plate carriage was 500 mm when the surface plate holding part holding the surface plate was tilted. The width of the conveyance passage was calculated as 700 mm.

Figure 0006178774
Figure 0006178774

表２に示したように、定盤の直径が１２００ｍｍの場合、定盤を保持した定盤保持部を傾けた際の定盤運搬台車の幅は８００ｍｍであった。運搬通路の幅は、１０００ｍｍと算出された。   As shown in Table 2, when the diameter of the surface plate was 1200 mm, the width of the surface plate carriage was 800 mm when the surface plate holding part holding the surface plate was tilted. The width of the conveyance passage was calculated as 1000 mm.

Figure 0006178774
Figure 0006178774

（比較例）
傾け機構を有さない従来の定盤運搬台車に、実施例と同様の直径が８００ｍｍ、１２００ｍｍの定盤を搭載して、このときの定盤運搬台車の幅と、運搬通路の幅を求め表１、表２に示した。運搬通路の幅は、実施例と同様に、定盤運搬台車の幅に２００ｍｍを加算した値とした。 (Comparative example)
A table with the same diameter of 800 mm and 1200 mm as in the example is mounted on a conventional surface plate transport cart that does not have a tilt mechanism, and the width of the surface plate transport cart and the width of the transport passage at this time are obtained and listed. 1 and shown in Table 2. The width of the transport passage was a value obtained by adding 200 mm to the width of the surface plate transport cart as in the example.

表１に示したように、定盤の直径が８００ｍｍの場合、定盤を定盤保持部で保持した際の定盤運搬台車の幅は８００ｍｍであった。運搬通路の幅は、１０００ｍｍと算出された。   As shown in Table 1, when the diameter of the surface plate was 800 mm, the width of the surface plate transport cart when the surface plate was held by the surface plate holding portion was 800 mm. The width of the conveyance passage was calculated as 1000 mm.

表２に示したように、定盤の直径が１２００ｍｍの場合、定盤を定盤保持部で保持した際の定盤運搬台車の幅は１２００ｍｍであった。運搬通路の幅は、１４００ｍｍと算出された。   As shown in Table 2, when the diameter of the surface plate was 1200 mm, the width of the surface plate carriage was 1200 mm when the surface plate was held by the surface plate holding part. The width of the conveyance passage was calculated as 1400 mm.

以上のように、実施例では、定盤を保持した定盤保持部を傾けることができる傾け機構を有する本発明の定盤運搬台車を用いたので、８００ｍｍの定盤の場合、運搬通路の幅を比較例に比べて、３００ｍｍ省スペース化することができた。また、１２００ｍｍの定盤の場合、実施例では、運搬通路の幅と、研磨装置の間隔を比較例に比べて４００ｍｍ省スペース化することができた。   As described above, in the embodiment, since the surface plate transport carriage of the present invention having the tilt mechanism that can tilt the surface plate holding portion that holds the surface plate is used, in the case of the 800 mm surface plate, the width of the transport passage As compared with the comparative example, a space saving of 300 mm could be achieved. In the case of a 1200 mm surface plate, in the example, the width of the conveyance path and the interval between the polishing apparatuses could be reduced by 400 mm compared to the comparative example.

なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。   The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

１、１０１、１０１ａ…定盤運搬台車、 ２…定盤、 ３、１０３…定盤保持部、
４…支持台、 ５…昇降機構、 ６…ストッパー、 ７…傾け板、 ８…傾け機構、
９、１０９…定盤落下防止機構、 １０、１１０…ローラー、 １１…研磨装置、
１２…研磨布、 １３…研磨剤、 １４…研磨剤供給機構、 １５…研磨ヘッド、
１６…定盤受け、 １８…車輪。 1, 101, 101a ... surface plate transport cart, 2 ... surface plate, 3, 103 ... surface plate holder,
4 ... support base, 5 ... elevating mechanism, 6 ... stopper, 7 ... tilting plate, 8 ... tilting mechanism,
9, 109: Surface plate fall prevention mechanism, 10, 110: Roller, 11: Polishing device,
12 ... Abrasive cloth, 13 ... Abrasive, 14 ... Abrasive supply mechanism, 15 ... Abrasive head,
16 ... Surface plate, 18 ... Wheels.

Claims (3)

研磨装置から取り外した定盤、又は前記研磨装置に取り付けるための前記定盤を運搬するための定盤運搬台車であって、該定盤運搬台車は、前記定盤を保持するための定盤保持部と、該定盤保持部を下側から支持する支持台と、前記定盤保持部の昇降を行う昇降機構と、前記定盤を保持した前記定盤保持部を傾ける傾け機構を具備し、
前記定盤を保持した前記定盤保持部を前記傾け機構で傾けた状態で、前記定盤を運搬できるものであることを特徴とする定盤運搬台車。 A surface plate transporting carriage for transporting a surface plate removed from a polishing apparatus or the surface plate for attaching to the polishing apparatus, the surface plate transporting carriage holding a surface plate for holding the surface plate A support base that supports the surface plate holding portion from below, a lifting mechanism that lifts and lowers the surface plate holding portion, and a tilt mechanism that tilts the surface plate holding portion that holds the surface plate,
A platen carriage that can carry the platen in a state where the platen holding unit holding the platen is tilted by the tilt mechanism. 前記定盤運搬台車を側面から見た時、前記定盤保持部の横方向の長さが前記支持台の横方向の長さよりも長く、前記支持台に対して上記定盤保持部が偏心して配置されたものであることを特徴とする請求項１に記載の定盤運搬台車。   When the surface plate carriage is viewed from the side, the horizontal length of the surface plate holding part is longer than the horizontal length of the support base, and the surface plate holding part is eccentric with respect to the support base. The surface plate carrier cart according to claim 1, which is arranged. 前記傾け機構は、前記定盤保持部の外周部に取り付けられた内側方向に収納可能な少なくとも１つの傾け板と、該傾け板の下方に配置された少なくとも１つのストッパーを有し、前記定盤保持部を下降させた時、前記ストッパーにより前記傾け板の下降を妨げることで、前記定盤保持部の前記傾け板が配置されている部分が下降せず、前記定盤保持部を傾けることができるものであることを特徴とする請求項１または請求項２に記載の定盤運搬台車。   The tilt mechanism includes at least one tilt plate that can be accommodated in an inward direction attached to an outer peripheral portion of the surface plate holding portion, and at least one stopper that is disposed below the tilt plate. When the holding portion is lowered, the tilt plate is prevented from being lowered by the stopper, so that the portion of the surface plate holding portion where the inclined plate is disposed does not descend, and the surface plate holding portion can be inclined. The surface plate carrier cart according to claim 1 or 2, characterized in that it can be made.
JP2014215583A 2014-10-22 2014-10-22 Surface plate carriage Active JP6178774B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2014215583A JP6178774B2 (en) 2014-10-22 2014-10-22 Surface plate carriage
PCT/JP2015/005024 WO2016063464A1 (en) 2014-10-22 2015-10-02 Surface plate transport dolly
US15/513,477 US10737365B2 (en) 2014-10-22 2015-10-02 Turn table transport carriage
KR1020177010065A KR102441700B1 (en) 2014-10-22 2015-10-02 Surface plate transport dolly
CN201580057427.8A CN107073682B (en) 2014-10-22 2015-10-02 Platform carrying trolley
SG11201702264TA SG11201702264TA (en) 2014-10-22 2015-10-02 Turn table transport carriage
DE112015004421.3T DE112015004421T5 (en) 2014-10-22 2015-10-02 Turntable trolley
TW104134406A TWI611868B (en) 2014-10-22 2015-10-20 Platform handling trolley

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CN107073682A (en) 2017-08-18
TW201636155A (en) 2016-10-16
CN107073682B (en) 2020-03-10
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US20170304991A1 (en) 2017-10-26
JP2016078220A (en) 2016-05-16

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