DE112015004421B4 - Drehtischtransportwagen - Google Patents

Drehtischtransportwagen

Info

Publication number
DE112015004421B4
DE112015004421B4 DE112015004421.3T DE112015004421T DE112015004421B4 DE 112015004421 B4 DE112015004421 B4 DE 112015004421B4 DE 112015004421 T DE112015004421 T DE 112015004421T DE 112015004421 B4 DE112015004421 B4 DE 112015004421B4
Authority
DE
Germany
Prior art keywords
rotary table
holding section
turntable
transport
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112015004421.3T
Other languages
German (de)
English (en)
Other versions
DE112015004421T5 (de
Inventor
Michito Sato
Yosuke Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Original Assignee
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp, Shin Etsu Handotai Co Ltd filed Critical Fujikoshi Machinery Corp
Publication of DE112015004421T5 publication Critical patent/DE112015004421T5/de
Application granted granted Critical
Publication of DE112015004421B4 publication Critical patent/DE112015004421B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/02—Heads
    • F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
    • F16M11/06—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting
    • F16M11/10—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting around a horizontal axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/42—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters with arrangement for propelling the support stands on wheels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3214—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicle
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
    • A47B3/00—Folding or stowable tables
    • A47B3/10—Travelling or trunk tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Handcart (AREA)
  • Braking Arrangements (AREA)
  • Robotics (AREA)
DE112015004421.3T 2014-10-22 2015-10-02 Drehtischtransportwagen Active DE112015004421B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-215583 2014-10-22
JP2014215583A JP6178774B2 (ja) 2014-10-22 2014-10-22 定盤運搬台車
PCT/JP2015/005024 WO2016063464A1 (ja) 2014-10-22 2015-10-02 定盤運搬台車

Publications (2)

Publication Number Publication Date
DE112015004421T5 DE112015004421T5 (de) 2017-08-10
DE112015004421B4 true DE112015004421B4 (de) 2026-02-12

Family

ID=55760525

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112015004421.3T Active DE112015004421B4 (de) 2014-10-22 2015-10-02 Drehtischtransportwagen

Country Status (8)

Country Link
US (1) US10737365B2 (https=)
JP (1) JP6178774B2 (https=)
KR (1) KR102441700B1 (https=)
CN (1) CN107073682B (https=)
DE (1) DE112015004421B4 (https=)
SG (1) SG11201702264TA (https=)
TW (1) TWI611868B (https=)
WO (1) WO2016063464A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI628132B (zh) * 2016-11-23 2018-07-01 住華科技股份有限公司 可傾式收集裝置
CN112318251A (zh) * 2020-10-15 2021-02-05 温州源利智能科技有限公司 一种钕铁硼磁性件自动打磨机构及其打磨方法
CN112224935B (zh) * 2020-12-10 2021-03-09 万邑通(潍坊)信息科技有限公司 物流轻便辅助卸车设备
JP7746217B2 (ja) * 2022-05-13 2025-09-30 株式会社荏原製作所 処理システムおよびパッド搬送装置
CN120942796B (zh) * 2025-10-17 2025-12-09 江苏裕科新材料有限公司 一种可辅助对齐的塑木地板搬运机器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120313351A1 (en) 2011-06-10 2012-12-13 Rexon Industrial Corp., Ltd. Rapidly collapsible stand
US20130078074A1 (en) 2011-09-28 2013-03-28 Mil-Stak Inc. Rotatable and tiltable receiving table for a mid-size or big bale stack wagon
JP2015217446A (ja) 2014-05-14 2015-12-07 株式会社荏原製作所 研磨テーブル交換装置および研磨テーブルの交換方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813825A (en) * 1969-09-30 1974-06-04 Alliance Tool And Die Corp Polishing machine or the like with a removable platen
US4268201A (en) * 1979-05-07 1981-05-19 Bud Antle, Inc. Unitizing system for produce cartons and the like
US4558648A (en) * 1983-09-20 1985-12-17 Lift-R Technologies, Inc. Energy-recycling scissors lift
JP3620629B2 (ja) * 1998-02-20 2005-02-16 新東工業株式会社 鋳枠・定盤台車移替え設備
JP2000061832A (ja) * 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd ポリッシング装置のロードカセットチルト機構
JP2000141205A (ja) * 1998-11-10 2000-05-23 Tokyo Seimitsu Co Ltd ウェーハ研磨装置及び研磨定盤調整装置
KR100591269B1 (ko) * 2004-12-09 2006-06-26 주식회사 금화피에스씨 밸브 디스크 연마 가공기
US7255355B2 (en) * 2005-01-03 2007-08-14 Mk Diamond Products, Inc. Portable collapsible stand
CN2795133Y (zh) 2005-04-26 2006-07-12 江苏天奇物流系统工程股份有限公司 气动液压升降台车
JP2008093811A (ja) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
AR060518A1 (es) * 2007-04-18 2008-06-25 Hugo Enrique Chianale Un conjunto carrito-mesa portatil
JP5142077B2 (ja) * 2008-02-05 2013-02-13 株式会社日立プラントテクノロジー 搬送台車
JP5058853B2 (ja) 2008-03-10 2012-10-24 旭硝子株式会社 板状貨物の輸送用ウイング式コンテナ及びそれを積載するトレーラ
JP5348610B2 (ja) * 2009-01-26 2013-11-20 旭硝子株式会社 板状体の積載装置
TWI366638B (en) * 2009-02-20 2012-06-21 Rexon Ind Corp Ltd Mobile tool stand
JP2011126546A (ja) 2009-12-15 2011-06-30 Shin-Etsu Chemical Co Ltd ガラス基板搬送用ケースおよびガラス基板搬送用台車
JP2012096893A (ja) * 2010-11-02 2012-05-24 Toppan Printing Co Ltd 基板搬送台車
CN102745458B (zh) 2012-02-10 2014-12-17 湖南吉利汽车部件有限公司 电池装载车

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120313351A1 (en) 2011-06-10 2012-12-13 Rexon Industrial Corp., Ltd. Rapidly collapsible stand
US20130078074A1 (en) 2011-09-28 2013-03-28 Mil-Stak Inc. Rotatable and tiltable receiving table for a mid-size or big bale stack wagon
JP2015217446A (ja) 2014-05-14 2015-12-07 株式会社荏原製作所 研磨テーブル交換装置および研磨テーブルの交換方法

Also Published As

Publication number Publication date
WO2016063464A1 (ja) 2016-04-28
SG11201702264TA (en) 2017-05-30
KR102441700B1 (ko) 2022-09-08
CN107073682B (zh) 2020-03-10
DE112015004421T5 (de) 2017-08-10
JP6178774B2 (ja) 2017-08-09
US20170304991A1 (en) 2017-10-26
KR20170072200A (ko) 2017-06-26
US10737365B2 (en) 2020-08-11
TWI611868B (zh) 2018-01-21
TW201636155A (zh) 2016-10-16
JP2016078220A (ja) 2016-05-16
CN107073682A (zh) 2017-08-18

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: B24B0037340000

Ipc: B65G0049050000

R016 Response to examination communication
R018 Grant decision by examination section/examining division