KR102391268B1 - 박리 방법 및 박리 장치 - Google Patents

박리 방법 및 박리 장치 Download PDF

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Publication number
KR102391268B1
KR102391268B1 KR1020160090555A KR20160090555A KR102391268B1 KR 102391268 B1 KR102391268 B1 KR 102391268B1 KR 1020160090555 A KR1020160090555 A KR 1020160090555A KR 20160090555 A KR20160090555 A KR 20160090555A KR 102391268 B1 KR102391268 B1 KR 102391268B1
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KR
South Korea
Prior art keywords
peeling
sheet
plate
holding
peeled
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KR1020160090555A
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English (en)
Korean (ko)
Other versions
KR20170015156A (ko
Inventor
도루 다카자와
Original Assignee
가부시기가이샤 디스코
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Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20170015156A publication Critical patent/KR20170015156A/ko
Application granted granted Critical
Publication of KR102391268B1 publication Critical patent/KR102391268B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020160090555A 2015-07-30 2016-07-18 박리 방법 및 박리 장치 KR102391268B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015150397A JP6580408B2 (ja) 2015-07-30 2015-07-30 剥離方法および剥離装置
JPJP-P-2015-150397 2015-07-30

Publications (2)

Publication Number Publication Date
KR20170015156A KR20170015156A (ko) 2017-02-08
KR102391268B1 true KR102391268B1 (ko) 2022-04-26

Family

ID=57986353

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160090555A KR102391268B1 (ko) 2015-07-30 2016-07-18 박리 방법 및 박리 장치

Country Status (4)

Country Link
JP (1) JP6580408B2 (ja)
KR (1) KR102391268B1 (ja)
CN (1) CN106409745B (ja)
TW (1) TWI720992B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6875161B2 (ja) * 2017-03-22 2021-05-19 株式会社ディスコ テープ剥離装置
JP6960626B2 (ja) 2017-06-20 2021-11-05 トヨタ自動車九州株式会社 フィルム貼付装置およびフィルム貼付方法
JP6975056B2 (ja) * 2018-01-29 2021-12-01 株式会社ディスコ 搬送機構
JP7132742B2 (ja) * 2018-04-26 2022-09-07 株式会社ディスコ テープ剥離装置
JP6916223B2 (ja) * 2019-01-30 2021-08-11 日機装株式会社 剥離装置
KR102369893B1 (ko) * 2021-09-29 2022-03-03 오토이엠 주식회사 전기차 배터리케이스에 사용되는 탑커버용 절연시트 부착장치
CN115339219B (zh) * 2022-08-16 2024-03-19 迈为技术(珠海)有限公司 一种剥离装置及其剥离方法
CN115458468B (zh) * 2022-11-11 2023-03-24 扬州韩思半导体科技有限公司 一种半导体晶圆激光切割装置及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295757A (ja) * 2008-06-04 2009-12-17 Tateyama Machine Kk 保護テープ剥離方法と装置
JP2010206088A (ja) 2009-03-05 2010-09-16 Tateyama Machine Kk テープ剥離装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09309664A (ja) * 1996-05-20 1997-12-02 Sony Corp 保護シートの剥離方法及びそれに用いられる剥離装置
JP4204653B2 (ja) * 1997-06-20 2009-01-07 リンテック株式会社 シート剥離装置および方法
CN1260779C (zh) * 2001-06-11 2006-06-21 日东电工株式会社 从半导体晶片上清除无用物质的方法和装置
JP4060641B2 (ja) * 2002-05-22 2008-03-12 株式会社ディスコ テープ剥離方法
JP4509666B2 (ja) * 2004-06-25 2010-07-21 リンテック株式会社 シート剥離装置及び剥離方法
JP2007109927A (ja) * 2005-10-14 2007-04-26 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離方法および表面保護フィルム剥離装置
JP4698517B2 (ja) * 2006-04-18 2011-06-08 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
US7846288B2 (en) * 2006-05-10 2010-12-07 Micron Technology, Inc. Methods and systems for removing protective films from microfeature workpieces
JP4851414B2 (ja) * 2007-10-04 2012-01-11 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
JP2012224469A (ja) * 2011-04-22 2012-11-15 Mitsubishi Electric Corp フィルム剥離方法およびフィルム剥離装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295757A (ja) * 2008-06-04 2009-12-17 Tateyama Machine Kk 保護テープ剥離方法と装置
JP2010206088A (ja) 2009-03-05 2010-09-16 Tateyama Machine Kk テープ剥離装置

Also Published As

Publication number Publication date
CN106409745A (zh) 2017-02-15
JP6580408B2 (ja) 2019-09-25
JP2017034015A (ja) 2017-02-09
TW201724337A (zh) 2017-07-01
KR20170015156A (ko) 2017-02-08
CN106409745B (zh) 2021-10-29
TWI720992B (zh) 2021-03-11

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