JP4509666B2 - シート剥離装置及び剥離方法 - Google Patents
シート剥離装置及び剥離方法 Download PDFInfo
- Publication number
- JP4509666B2 JP4509666B2 JP2004187518A JP2004187518A JP4509666B2 JP 4509666 B2 JP4509666 B2 JP 4509666B2 JP 2004187518 A JP2004187518 A JP 2004187518A JP 2004187518 A JP2004187518 A JP 2004187518A JP 4509666 B2 JP4509666 B2 JP 4509666B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- peeling
- plate
- wafer
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 22
- 239000004744 fabric Substances 0.000 claims description 65
- 230000001070 adhesive effect Effects 0.000 claims description 58
- 239000000853 adhesive Substances 0.000 claims description 57
- 230000002093 peripheral effect Effects 0.000 claims description 29
- 238000004804 winding Methods 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 119
- 238000003825 pressing Methods 0.000 description 13
- 230000001681 protective effect Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
Description
本発明は、このような不都合に着目して案出されたものであり、その目的は、板状体に接着シートを貼付した後に、不要な部分を効率良く剥離できるようにし、装置構成を簡単にするとともに、板状体の加工処理工程の短縮化に寄与することのできるシート剥離装置及び剥離方法を提供することにある。
剥離用テープの貼付・巻取部を備え、当該貼付・巻取部は、前記板状体上に位置する剥離シート及び前記外周側に位置する剥離シートに跨るように剥離用テープを貼付した状態で、当該剥離用テープを巻き取ることで前記板状体上に位置する剥離シートを前記外周側に位置する原反部分と共に同時に剥離する、という構成を採っている。
剥離用テープの貼付・巻取部を備え、当該貼付・巻取部は、前記板状体上に位置する剥離シート及び前記外周側に位置する剥離シートに跨るように剥離用テープを貼付した状態で、当該剥離用テープを巻き取ることで前記板状体上に位置する剥離シートを前記外周側に位置する原反部分と共に同時に剥離する、という構成を採ることもできる。
前記板状体上に位置する剥離シート及び前記外周側に位置する剥離シートに跨るように剥離用テープを貼付する工程と、
前記剥離用テープを巻き取って前記板状体上に接着シートを残した状態で前記板状体上に位置する剥離シートを前記外周側に位置する原反部分と共に同時に巻き取りながら剥離する工程とを備える、という手法を採っている。
更に、板状体を支持するテーブルに対して相対移動可能なロールが剥離用テープを貼付する機能と、剥離用テープを巻き取る機能とを併せ持つ構成であるから、この点からも装置部品点数の削減を図ることができる。しかも、ロールが相対移動する場合に生じ易い他の装置構成部分との位置的な干渉も生じ難いものとなり、構造部品のレイアウトの自由度も拡大可能となる。
また、剥離用テープが幅狭のもので足りるため、材料の量的な無駄を少なく抑制することもできる。
すなわち、本発明は、主に特定の実施形態に関して特に図示、説明されているが、本発明の技術的思想及び目的の範囲から逸脱することなく、以上説明した実施形態に対し、形状、位置若しくは配置等に関し、必要に応じて当業者が様々な変更を加えることができるものである。
また、シート剥離装置50は、実質的に同様の作用を生じさせることができるものであれば、装置各部の構成、レイアウト等を任意に変更してもよい。
更に、前記接着シートSは、ダイボンディング用のシートに限定されるものではなく、貼付して保護膜を形成する保護用シートであってもよい。
また、板状体としては、半導体ウエハに限らず、光ディスクや、DVD等の情報記録媒体でもよく、板状体の平面形状は円形の対象物だけでなく、偏光板等の多角形のものでもよい。これらの板状体を処理対象とする場合の接着シートとしては、両面粘着シート等を用いることが考えられる。
50 シート剥離装置
135 貼付・巻取部を構成するロール
PS 剥離シート
S 接着シート(感熱接着性の接着シート)
S1 不要原反部分
LS 原反
W 半導体ウエハ
Claims (7)
- 剥離シートの一方の面に接着シートが積層された原反を繰り出して前記接着シートを板状体に貼付した後に、板状体の外周に沿って原反を切断し、板状体上に位置する剥離シート部分を板状体回りの外周側に位置する原反部分と共に剥離する装置において、
剥離用テープの貼付・巻取部を備え、当該貼付・巻取部は、前記板状体上に位置する剥離シート及び前記外周側に位置する剥離シートに跨るように剥離用テープを貼付した状態で、当該剥離用テープを巻き取ることで前記板状体上に位置する剥離シートを前記外周側に位置する原反部分と共に同時に剥離することを特徴とするシート剥離装置。 - 剥離シートの一方の面に感熱接着性の接着シートが積層された帯状に連なる原反を繰り出して前記接着シートを板状体に貼付した後に、原反を幅方向に切断して枚葉状にするとともに、板状体の外周に沿って原反を切断し、板状体上に位置する剥離シート部分を板状体の外周側に位置する原反部分と共に剥離する装置において、
剥離用テープの貼付・巻取部を備え、当該貼付・巻取部は、前記板状体上に位置する剥離シート及び前記外周側に位置する剥離シートに跨るように剥離用テープを貼付した状態で、当該剥離用テープを巻き取ることで前記板状体上に位置する剥離シートを前記外周側に位置する原反部分と共に同時に剥離することを特徴とするシート剥離装置。 - 前記貼付・巻取部は、前記板状体を支持するテーブルに対して相対移動可能なロールを含み、当該ロールは、外周に剥離用テープが巻き掛けられた状態で原反上を回転して剥離用テープを剥離シート上に貼付する機能と、前記回転方向と反対側に回転して前記剥離を行う機能とを備えたことを特徴とする請求項1又は2記載のシート剥離装置。
- 前記剥離用テープは、板状体の直径よりも小さい幅に設けられていることを特徴とする請求項1,2又は3記載のシート剥離装置。
- 前記板状体は半導体ウエハであることを特徴とする請求項1,2,3又は4記載のシート剥離装置。
- 剥離シートの一方の面に接着シートが積層された原反を繰り出して前記接着シートを板状体に貼付した後に、板状体の外周に沿って原反を切断し、板状体上に位置する剥離シート部分を板状体回りに位置する外周側の原反部分と共に剥離する方法において、
前記板状体上に位置する剥離シート及び前記外周側に位置する剥離シートに跨るように剥離用テープを貼付する工程と、
前記剥離用テープを巻き取って前記板状体上に接着シートを残した状態で前記板状体上に位置する剥離シートを前記外周側に位置する原反部分と共に同時に巻き取りながら剥離する工程とを備えたことを特徴とするシート剥離方法。 - 前記板状体は半導体ウエハであることを特徴とする請求項6記載のシート剥離方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004187518A JP4509666B2 (ja) | 2004-06-25 | 2004-06-25 | シート剥離装置及び剥離方法 |
US11/629,863 US20080011412A1 (en) | 2004-06-25 | 2005-06-22 | Sheet Peeling Apparatus and Peeling Method |
KR1020067025573A KR20070032950A (ko) | 2004-06-25 | 2005-06-22 | 시트 박리장치 및 박리방법 |
CNA2005800212841A CN1977371A (zh) | 2004-06-25 | 2005-06-22 | 片材剥离装置以及剥离方法 |
PCT/JP2005/011408 WO2006001289A1 (ja) | 2004-06-25 | 2005-06-22 | シート剥離装置及び剥離方法 |
EP05753439A EP1760773A1 (en) | 2004-06-25 | 2005-06-22 | Sheet peeling device and method |
TW094121242A TW200618130A (en) | 2004-06-25 | 2005-06-24 | Sheet peeling device and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004187518A JP4509666B2 (ja) | 2004-06-25 | 2004-06-25 | シート剥離装置及び剥離方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006013104A JP2006013104A (ja) | 2006-01-12 |
JP4509666B2 true JP4509666B2 (ja) | 2010-07-21 |
Family
ID=35779978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004187518A Expired - Fee Related JP4509666B2 (ja) | 2004-06-25 | 2004-06-25 | シート剥離装置及び剥離方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080011412A1 (ja) |
EP (1) | EP1760773A1 (ja) |
JP (1) | JP4509666B2 (ja) |
KR (1) | KR20070032950A (ja) |
CN (1) | CN1977371A (ja) |
TW (1) | TW200618130A (ja) |
WO (1) | WO2006001289A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4746002B2 (ja) * | 2007-05-07 | 2011-08-10 | リンテック株式会社 | 移載装置及び移載方法 |
EP2003184A1 (de) * | 2007-06-16 | 2008-12-17 | Scheuten Glasgroep B.V. | Verfahren zur Herstellung eines Brandschutzmittels |
WO2009092646A2 (en) * | 2008-01-25 | 2009-07-30 | Oerlikon Assembly Equipment Ag, Steinhausen | Method and apparatus for mounting a piece of foil on a substrate |
KR101476849B1 (ko) * | 2008-07-18 | 2014-12-30 | 엘지전자 주식회사 | 박리 및 안착 통합 장치와, 이를 이용한 액정표시장치의제조방법 |
JP2010080838A (ja) | 2008-09-29 | 2010-04-08 | Lintec Corp | シート貼付装置及び貼付方法 |
JP5441516B2 (ja) * | 2009-06-25 | 2014-03-12 | ジェーシーシーエンジニアリング株式会社 | シート切断方法およびシート切断装置 |
JP2012143846A (ja) * | 2011-01-13 | 2012-08-02 | Disco Corp | シートカット装置 |
AT510561B1 (de) * | 2011-02-21 | 2012-05-15 | Inova Lisec Technologiezentrum | Verfahren und vorrichtung zum handhaben von folien-zuschnitten |
KR101981639B1 (ko) * | 2012-11-13 | 2019-05-27 | 삼성디스플레이 주식회사 | 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법 |
US9613845B2 (en) | 2014-01-17 | 2017-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion de-taping |
JP6378910B2 (ja) * | 2014-03-19 | 2018-08-22 | 日東電工株式会社 | 剥離装置及び剥離方法 |
JP6580408B2 (ja) * | 2015-07-30 | 2019-09-25 | 株式会社ディスコ | 剥離方法および剥離装置 |
JP6597082B2 (ja) * | 2015-09-07 | 2019-10-30 | 株式会社村田製作所 | シート付与装置およびそれを用いた電子部品の製造方法 |
KR20170029395A (ko) * | 2015-09-07 | 2017-03-15 | 주식회사 엘지화학 | 판상 물질의 박리 장치 |
DE102017105195A1 (de) | 2017-03-10 | 2018-09-13 | Leibniz-Institut Für Polymerforschung Dresden E.V. | Verfahren zur differenzierten Sequestrierung von Stoffen verschiedener Stoffgruppen mit Hilfe von sulfatierte oder sulfonierte Komponenten enthaltenden Hydrogelen |
CN106935534B (zh) * | 2017-04-28 | 2019-11-05 | 京东方科技集团股份有限公司 | 封装装置及显示面板封装方法 |
KR102448726B1 (ko) | 2017-08-14 | 2022-09-28 | 삼성전자주식회사 | 라미네이팅 장치 및 그를 이용하는 반도체 패키지 제조 방법 |
EP3598480B1 (en) | 2018-07-18 | 2020-09-23 | Infineon Technologies AG | Device and method for debonding a structure from a main surface region of a carrier |
CN110676207B (zh) * | 2019-09-27 | 2021-11-16 | 云谷(固安)科技有限公司 | 分离装置以及分离方法 |
CN112743963B (zh) * | 2020-12-29 | 2023-02-28 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种膜片剥离装置 |
CN113844156B (zh) * | 2021-09-08 | 2023-05-12 | 四川轻化工大学 | 一种复合钢板上下钢皮剥离装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0648642A (ja) * | 1992-07-27 | 1994-02-22 | Nitto Denko Corp | 粘着体転写装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6080263A (en) * | 1997-05-30 | 2000-06-27 | Lintec Corporation | Method and apparatus for applying a protecting film to a semiconductor wafer |
JP3837320B2 (ja) * | 2001-11-07 | 2006-10-25 | リンテック株式会社 | 光ディスクの貼合装置 |
-
2004
- 2004-06-25 JP JP2004187518A patent/JP4509666B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-22 US US11/629,863 patent/US20080011412A1/en not_active Abandoned
- 2005-06-22 EP EP05753439A patent/EP1760773A1/en not_active Withdrawn
- 2005-06-22 WO PCT/JP2005/011408 patent/WO2006001289A1/ja not_active Application Discontinuation
- 2005-06-22 CN CNA2005800212841A patent/CN1977371A/zh active Pending
- 2005-06-22 KR KR1020067025573A patent/KR20070032950A/ko not_active Application Discontinuation
- 2005-06-24 TW TW094121242A patent/TW200618130A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0648642A (ja) * | 1992-07-27 | 1994-02-22 | Nitto Denko Corp | 粘着体転写装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20070032950A (ko) | 2007-03-23 |
CN1977371A (zh) | 2007-06-06 |
EP1760773A1 (en) | 2007-03-07 |
US20080011412A1 (en) | 2008-01-17 |
WO2006001289A1 (ja) | 2006-01-05 |
TW200618130A (en) | 2006-06-01 |
JP2006013104A (ja) | 2006-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4509666B2 (ja) | シート剥離装置及び剥離方法 | |
JP4452549B2 (ja) | ウエハ処理装置 | |
JP4795743B2 (ja) | 貼付装置 | |
TWI388024B (zh) | 工件貼付支持方法及利用該方法之工件貼附支持裝置 | |
JP4485248B2 (ja) | 剥離装置及び剥離方法 | |
JP4740297B2 (ja) | マウント装置及びマウント方法 | |
JP2006187862A (ja) | 切断装置及び切断方法 | |
JP5261522B2 (ja) | 貼付装置及び貼付方法 | |
JP5431053B2 (ja) | 粘着テープ貼付け方法および粘着テープ貼付け装置 | |
WO2006051684A1 (ja) | シート切断方法及びマウント方法 | |
JP4371890B2 (ja) | 貼付装置及び貼付方法 | |
JP2008066523A (ja) | 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置 | |
JP2004349435A (ja) | 基板へのダイシング・ダイボンドテープの貼り付け装置 | |
JP2012028591A (ja) | 基板へのシート貼付装置 | |
WO2005101486A1 (ja) | ウエハ処理装置及びウエハ処理方法 | |
JP4886971B2 (ja) | 貼付装置 | |
JP4773063B2 (ja) | 貼付テーブル | |
JP3200938U (ja) | シート剥離装置 | |
JP4922371B2 (ja) | ウエハ処理装置及び処理方法 | |
JP2005297458A (ja) | 貼付装置 | |
JP4689972B2 (ja) | ウエハ処理装置及びウエハ処理方法 | |
JP4057478B2 (ja) | シート剥離装置及び剥離方法 | |
JP4350018B2 (ja) | 粘着テープ貼着装置 | |
JP7075307B2 (ja) | テープ剥離方法 | |
JP2017050364A (ja) | シート剥離装置および剥離方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070409 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100420 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100428 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130514 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4509666 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140514 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |