KR102374333B1 - 가요성 박막 구조의 표시 셀을 취급하는 방법 - Google Patents

가요성 박막 구조의 표시 셀을 취급하는 방법 Download PDF

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Publication number
KR102374333B1
KR102374333B1 KR1020150094173A KR20150094173A KR102374333B1 KR 102374333 B1 KR102374333 B1 KR 102374333B1 KR 1020150094173 A KR1020150094173 A KR 1020150094173A KR 20150094173 A KR20150094173 A KR 20150094173A KR 102374333 B1 KR102374333 B1 KR 102374333B1
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South Korea
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motherboard
cell
display cell
carrier tape
film
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Korean (ko)
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KR20160016592A (ko
Inventor
타다토시 나카니시
서창시
사토루 고시오
나오 무라카미
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닛토덴코 가부시키가이샤
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    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H01L21/67706—
    • H01L21/67715—
    • H01L51/0097—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
KR1020150094173A 2014-08-01 2015-07-01 가요성 박막 구조의 표시 셀을 취급하는 방법 Active KR102374333B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014158102A JP5954549B2 (ja) 2014-08-01 2014-08-01 可撓性薄膜構造の表示セルを取り扱う方法
JPJP-P-2014-158102 2014-08-01

Publications (2)

Publication Number Publication Date
KR20160016592A KR20160016592A (ko) 2016-02-15
KR102374333B1 true KR102374333B1 (ko) 2022-03-15

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ID=55217701

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KR1020150094173A Active KR102374333B1 (ko) 2014-08-01 2015-07-01 가요성 박막 구조의 표시 셀을 취급하는 방법

Country Status (5)

Country Link
JP (1) JP5954549B2 (https=)
KR (1) KR102374333B1 (https=)
CN (1) CN105321862B (https=)
TW (1) TWI632099B (https=)
WO (1) WO2016017807A1 (https=)

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JP2018072689A (ja) * 2016-11-01 2018-05-10 日東電工株式会社 光学的表示装置を製造する方法
CN106735880A (zh) * 2017-01-13 2017-05-31 武汉华星光电技术有限公司 一种柔性显示面板的切割方法及切割装置
JP6888812B2 (ja) * 2017-04-21 2021-06-16 淀川メデック株式会社 フレキシブルデバイスの製造装置及び製造方法
JP6393362B1 (ja) * 2017-04-25 2018-09-19 住友化学株式会社 有機デバイスの製造方法
JP6284670B1 (ja) * 2017-04-25 2018-02-28 住友化学株式会社 有機デバイスの製造方法
TWI669778B (zh) * 2017-08-31 2019-08-21 Industrial Technology Research Institute 分離裝置及分離方法
TWI710288B (zh) * 2020-01-22 2020-11-11 頎邦科技股份有限公司 電路板的散熱片貼合方法及其貼合裝置
CN113334467B (zh) * 2021-05-31 2022-09-30 深圳市聚飞光学材料有限公司 一种光学膜卷材加工方法及光学膜卷材

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WO2013165013A1 (ja) * 2012-05-02 2013-11-07 住友化学株式会社 光学表示デバイスの生産システム及び生産方法
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TWI529101B (zh) * 2012-07-09 2016-04-11 達鴻先進科技股份有限公司 貼合取膜裝置及其方法
KR102060541B1 (ko) * 2012-07-13 2019-12-31 삼성디스플레이 주식회사 표시 패널 제조 방법
JP5946362B2 (ja) * 2012-08-10 2016-07-06 日東電工株式会社 光学表示パネルの製造方法および光学表示パネルの製造システム
JP2014049486A (ja) * 2012-08-29 2014-03-17 Nitto Denko Corp 保護テープ剥離方法および保護テープ剥離装置
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Also Published As

Publication number Publication date
CN105321862A (zh) 2016-02-10
JP5954549B2 (ja) 2016-07-20
CN105321862B (zh) 2018-12-18
WO2016017807A1 (ja) 2016-02-04
KR20160016592A (ko) 2016-02-15
TW201605706A (zh) 2016-02-16
JP2016035507A (ja) 2016-03-17
TWI632099B (zh) 2018-08-11

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