KR102350923B1 - 전자 부품 실장 시스템 및 전자 부품 실장 방법 - Google Patents

전자 부품 실장 시스템 및 전자 부품 실장 방법 Download PDF

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Publication number
KR102350923B1
KR102350923B1 KR1020170075811A KR20170075811A KR102350923B1 KR 102350923 B1 KR102350923 B1 KR 102350923B1 KR 1020170075811 A KR1020170075811 A KR 1020170075811A KR 20170075811 A KR20170075811 A KR 20170075811A KR 102350923 B1 KR102350923 B1 KR 102350923B1
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KR
South Korea
Prior art keywords
electronic component
mounting
substrate
electrode
component mounting
Prior art date
Application number
KR1020170075811A
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English (en)
Korean (ko)
Other versions
KR20180055674A (ko
Inventor
히데노리 오타
Original Assignee
한화정밀기계 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 한화정밀기계 주식회사 filed Critical 한화정밀기계 주식회사
Priority to CN201810132785.6A priority Critical patent/CN109152326B/zh
Publication of KR20180055674A publication Critical patent/KR20180055674A/ko
Application granted granted Critical
Publication of KR102350923B1 publication Critical patent/KR102350923B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Operations Research (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Toxicology (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020170075811A 2016-11-17 2017-06-15 전자 부품 실장 시스템 및 전자 부품 실장 방법 KR102350923B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810132785.6A CN109152326B (zh) 2016-11-17 2018-02-09 电子部件贴装系统及电子部件贴装方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-224372 2016-11-17
JP2016224372A JP6915981B2 (ja) 2016-11-17 2016-11-17 電子部品実装システム及び電子部品実装方法

Publications (2)

Publication Number Publication Date
KR20180055674A KR20180055674A (ko) 2018-05-25
KR102350923B1 true KR102350923B1 (ko) 2022-01-13

Family

ID=62197852

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170075811A KR102350923B1 (ko) 2016-11-17 2017-06-15 전자 부품 실장 시스템 및 전자 부품 실장 방법

Country Status (3)

Country Link
JP (1) JP6915981B2 (ja)
KR (1) KR102350923B1 (ja)
CN (1) CN109152326B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6547137B2 (ja) * 2017-01-12 2019-07-24 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置
US10893639B2 (en) * 2017-01-12 2021-01-12 Panasonic Intellectual Property Management Co., Ltd. Component mounting using feedback correction
JP6547136B2 (ja) * 2017-01-12 2019-07-24 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置
JP6706768B2 (ja) * 2019-06-10 2020-06-10 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置
JP6706769B2 (ja) * 2019-06-10 2020-06-10 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110288A (ja) * 2001-07-23 2003-04-11 Fuji Mach Mfg Co Ltd 対回路基板作業システムおよび電子回路製造方法
JP2006080197A (ja) * 2004-09-08 2006-03-23 Juki Corp 電子部品実装装置における吸着ノズルの位置補正方法
JP2008300526A (ja) * 2007-05-30 2008-12-11 Yamaha Motor Co Ltd 実装ライン、実装基板の検査装置および検査方法
JP2010141209A (ja) * 2008-12-12 2010-06-24 Sony Corp 基板検査装置及び基板検査方法
WO2013094098A1 (ja) * 2011-12-22 2013-06-27 パナソニック株式会社 電子部品実装ライン及び電子部品実装方法
JP2015187579A (ja) * 2014-03-27 2015-10-29 富士機械製造株式会社 不良製品の目視検査を実施する作業者を支援する装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08153995A (ja) * 1994-11-28 1996-06-11 Oki Electric Ind Co Ltd 半導体装置の位置合わせ方法
JPH11204934A (ja) * 1998-01-13 1999-07-30 Fuji Photo Film Co Ltd 電子部品の実装方法
JP4289381B2 (ja) * 2006-09-05 2009-07-01 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP2008205424A (ja) * 2007-01-26 2008-09-04 Juki Corp 部品実装方法及び装置
JP4883131B2 (ja) * 2009-04-17 2012-02-22 パナソニック株式会社 電子部品実装方法
US9609760B2 (en) * 2011-06-02 2017-03-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting method
JP5877307B2 (ja) * 2011-11-11 2016-03-08 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法
JP6035937B2 (ja) * 2012-07-20 2016-11-30 日本電気株式会社 部品搭載装置および部品搭載方法
WO2014076969A1 (ja) * 2012-11-19 2014-05-22 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP6118353B2 (ja) * 2013-02-03 2017-04-19 名古屋電機工業株式会社 部品実装基板検査方法及びその検査方法を採用する基板製造システム
JP6413246B2 (ja) * 2014-01-29 2018-10-31 オムロン株式会社 品質管理装置および品質管理装置の制御方法
JP6387620B2 (ja) * 2014-02-06 2018-09-12 オムロン株式会社 品質管理システム
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
JP6264072B2 (ja) * 2014-02-10 2018-01-24 オムロン株式会社 品質管理装置及びその制御方法
JP2016174110A (ja) * 2015-03-17 2016-09-29 東レエンジニアリング株式会社 実装位置補正方法および実装位置補正装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110288A (ja) * 2001-07-23 2003-04-11 Fuji Mach Mfg Co Ltd 対回路基板作業システムおよび電子回路製造方法
JP2006080197A (ja) * 2004-09-08 2006-03-23 Juki Corp 電子部品実装装置における吸着ノズルの位置補正方法
JP2008300526A (ja) * 2007-05-30 2008-12-11 Yamaha Motor Co Ltd 実装ライン、実装基板の検査装置および検査方法
JP2010141209A (ja) * 2008-12-12 2010-06-24 Sony Corp 基板検査装置及び基板検査方法
WO2013094098A1 (ja) * 2011-12-22 2013-06-27 パナソニック株式会社 電子部品実装ライン及び電子部品実装方法
JP2015187579A (ja) * 2014-03-27 2015-10-29 富士機械製造株式会社 不良製品の目視検査を実施する作業者を支援する装置

Also Published As

Publication number Publication date
CN109152326B (zh) 2022-01-28
KR20180055674A (ko) 2018-05-25
JP6915981B2 (ja) 2021-08-11
JP2018082096A (ja) 2018-05-24
CN109152326A (zh) 2019-01-04

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