JP6346364B2 - ディスペンサーの供給ユニットを自動的に調整する方法 - Google Patents
ディスペンサーの供給ユニットを自動的に調整する方法 Download PDFInfo
- Publication number
- JP6346364B2 JP6346364B2 JP2017175500A JP2017175500A JP6346364B2 JP 6346364 B2 JP6346364 B2 JP 6346364B2 JP 2017175500 A JP2017175500 A JP 2017175500A JP 2017175500 A JP2017175500 A JP 2017175500A JP 6346364 B2 JP6346364 B2 JP 6346364B2
- Authority
- JP
- Japan
- Prior art keywords
- supply
- dispenser
- supply unit
- electronic substrate
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 171
- 230000007246 mechanism Effects 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 41
- 230000033001 locomotion Effects 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 27
- 239000011345 viscous material Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 238000012840 feeding operation Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1021—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to presence or shape of target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Operations Research (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
Description
Claims (5)
- 電子基板上に粘性材料を供給する方法であって、
第1の電子基板パターンを供給位置に送達することと、
第2の電子基板パターンを供給位置に送達することと、
第1のディスペンサー及び第2のディスペンサーをX軸方向及びY軸方向に移動させるように構成されているガントリによって、前記第1のディスペンサー及び前記第2のディスペンサーを前記第1の電子基板パターン及び前記第2の電子基板パターン上方に移動させることと、を含んでおり、前記ガントリは、第1サイドレールと、第2サイドレールと、前記第1サイドレール及び前記第2サイドレールの間に延びるビームとを含んでいて、前記ビームは、Y軸移動を達成するために、前記第1及び第2サイドレールに沿ってY軸方向に移動するように構成されており、前記ガントリは前記ビームに搭載されたキャリッジを更に含んでいて、前記キャリッジは前記ビームの長さに沿ってX軸方向に移動するように構成されており、
該方法は、更に、
前記キャリッジと、前記第2のディスペンサーを前記第1のディスペンサーから所定の距離だけ前記X軸方向及び前記Y軸方向の少なくとも1つの方向に移動させるように構成されている自動調整機構とによって、前記第1の電子基板パターンと前記第1のディスペンサーとを位置合わせするとともに、前記第2の電子基板パターンと前記第2のディスペンサーとを位置合わせすることと、
前記第1のディスペンサーから前記第1の電子基板パターン上の所望の場所に材料を供給することと、
前記第2のディスペンサーから前記第2の電子基板パターン上の所望の場所に材料を供給することと、を含んでおり、
前記自動調整機構は、前記キャリッジに固定されたリニア軸受と、前記リニア軸受上を移動するように構成されて前記第2のディスペンサーに結合されている取付けブロックと、前記取付けブロックを前記リニア軸受に沿って移動させるように構成されている第1のリニア駆動モーター組立体とを含んでおり、
前記第1及び第2の電子基板パターンが適切に位置決めされていない場合、前記第1の電子基板パターンに対する第1の供給動作と、前記第2の電子基板パターンに対する第2の供給動作とを同時に実行し、
第1の供給動作と第2の供給動作とを同時に実行することは、前記自動調整機構によって前記第2のディスペンサーを動的に位置決めすることを含む、方法。 - 前記第1のディスペンサーから前記第1の電子基板パターン上の所望の場所に材料を供給することは、前記第1のディスペンサーを前記第1の電子基板パターンに向かって下降させることを含む、請求項1に記載の方法。
- 前記第2のディスペンサーから前記第2の電子基板パターン上の所望の場所に材料を供給することは、前記第2のディスペンサーを前記第2の電子基板パターンに向かって下降させることを含む、請求項2に記載の方法。
- 前記所定の距離は、前記第1の電子基板パターンに関連付けられる第1の基準点と、前記第2の電子基板パターンに関連付けられる第2の基準点とを特定することによって決定される、請求項1に記載の方法。
- 第1のディスペンサー及び第2のディスペンサーとカメラとの間の距離を較正することを更に含む、請求項4に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/041,300 | 2013-09-30 | ||
US14/041,300 US9374905B2 (en) | 2013-09-30 | 2013-09-30 | Method and apparatus for automatically adjusting dispensing units of a dispenser |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016518747A Division JP6346273B2 (ja) | 2013-09-30 | 2014-07-21 | ディスペンサーの供給ユニットを自動的に調整する方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018001164A JP2018001164A (ja) | 2018-01-11 |
JP6346364B2 true JP6346364B2 (ja) | 2018-06-20 |
Family
ID=51293190
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016518747A Active JP6346273B2 (ja) | 2013-09-30 | 2014-07-21 | ディスペンサーの供給ユニットを自動的に調整する方法及び装置 |
JP2017175500A Active JP6346364B2 (ja) | 2013-09-30 | 2017-09-13 | ディスペンサーの供給ユニットを自動的に調整する方法 |
JP2017175458A Active JP6426808B2 (ja) | 2013-09-30 | 2017-09-13 | ディスペンサーの供給ユニットを自動的に調整する装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016518747A Active JP6346273B2 (ja) | 2013-09-30 | 2014-07-21 | ディスペンサーの供給ユニットを自動的に調整する方法及び装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017175458A Active JP6426808B2 (ja) | 2013-09-30 | 2017-09-13 | ディスペンサーの供給ユニットを自動的に調整する装置 |
Country Status (11)
Country | Link |
---|---|
US (7) | US9374905B2 (ja) |
EP (4) | EP3270679B1 (ja) |
JP (3) | JP6346273B2 (ja) |
KR (6) | KR101901541B1 (ja) |
CN (4) | CN108811330B (ja) |
HU (1) | HUE054968T2 (ja) |
PH (1) | PH12019000165A1 (ja) |
PL (3) | PL3270678T3 (ja) |
PT (1) | PT3557968T (ja) |
TW (3) | TWI624204B (ja) |
WO (1) | WO2015047521A1 (ja) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9374905B2 (en) | 2013-09-30 | 2016-06-21 | Illinois Tool Works Inc. | Method and apparatus for automatically adjusting dispensing units of a dispenser |
KR102405912B1 (ko) * | 2013-12-06 | 2022-06-03 | 무사시 엔지니어링 가부시키가이샤 | 액체 재료 도포 장치 |
US10082417B2 (en) * | 2013-12-30 | 2018-09-25 | Nordson Corporation | Calibration methods for a viscous fluid dispensing system |
US9707584B2 (en) * | 2014-07-09 | 2017-07-18 | Nordson Corporation | Dual applicator fluid dispensing methods and systems |
KR101740146B1 (ko) * | 2015-10-30 | 2017-05-26 | 주식회사 프로텍 | 펌프 위치 피드백 방식 디스펜서 및 디스펜싱 방법 |
TWI558465B (zh) * | 2015-11-18 | 2016-11-21 | 鴻騏新技股份有限公司 | 具可調整點膠角度之點膠機構 |
WO2018006181A1 (en) * | 2016-07-08 | 2018-01-11 | Macdonald, Dettwiler And Associates Inc. | System and method for automated artificial vision guided dispensing viscous fluids for caulking and sealing operations |
KR102484442B1 (ko) * | 2016-12-08 | 2023-01-02 | 한화정밀기계 주식회사 | 부품 실장기 |
CN106890769A (zh) * | 2017-04-26 | 2017-06-27 | 东莞市济通自动化设备有限公司 | 一种视觉定位点胶机 |
CN107350127A (zh) * | 2017-07-26 | 2017-11-17 | 东莞市嘉龙海杰电子科技有限公司 | 多轴可翻转式全自动点胶机 |
JP6949637B2 (ja) * | 2017-09-15 | 2021-10-13 | セイコータイムクリエーション株式会社 | 塗布装置 |
US10434537B2 (en) * | 2017-09-20 | 2019-10-08 | Illinois Tool Works Inc. | Rotation of an array of dispensing pumps to enable simultaneous dispensing with multiple dispensing pumps on multiple electronic substrates |
CN107597503B (zh) * | 2017-10-20 | 2023-05-12 | 东莞市凯格精机股份有限公司 | 一种双点胶阀装置 |
US20200035512A1 (en) * | 2018-07-24 | 2020-01-30 | Illinois Tool Works Inc. | Method of transitioning from synchronous to asynchronous dispensing |
JP7224000B2 (ja) * | 2018-09-03 | 2023-02-17 | パナソニックIpマネジメント株式会社 | 液剤供給装置及び液剤供給方法 |
CN109201413B (zh) * | 2018-09-29 | 2023-12-01 | 苏州华智诚精工科技有限公司 | 一种视觉定位点胶系统及其方法 |
CN109550634B (zh) * | 2018-11-16 | 2020-11-27 | 福州兴创云达新材料科技有限公司 | 一种高性能助焊剂的自动涂覆装置以及控制方法 |
US11772116B2 (en) | 2018-11-28 | 2023-10-03 | Precision Valve & Automation, Inc. | Multiple fourth axis robot |
CN109433523A (zh) * | 2018-12-13 | 2019-03-08 | 广东锐军智能设备有限公司 | 一种自动点胶检测机 |
US11289445B2 (en) * | 2018-12-24 | 2022-03-29 | Asm Technology Singapore Pte Ltd | Die bonder incorporating rotatable adhesive dispenser head |
JP7150629B2 (ja) * | 2019-02-01 | 2022-10-11 | ローランドディー.ジー.株式会社 | 複数の印刷ヘッドの位置合わせを実行するための方法および印刷装置 |
CN110602938B (zh) * | 2019-09-23 | 2020-12-29 | 中电智能卡有限责任公司 | 模块植入装置及模块植入机 |
DE102020000412A1 (de) * | 2020-01-24 | 2021-07-29 | bdtronic GmbH | Dosiervorrichtung sowie Verfahren zur dosierten Abgabe eines Mediums |
US11246249B2 (en) | 2020-04-15 | 2022-02-08 | Illinois Tool Works Inc. | Tilt and rotate dispenser having strain wave gear system |
US11389819B2 (en) * | 2020-06-02 | 2022-07-19 | Illinois Tool Works Inc. | Dispensing unit mass dampener |
CN112044699B (zh) * | 2020-08-11 | 2022-01-14 | 江苏迪飞达电子有限公司 | 一种小型桌面pcb板涂胶机 |
KR20220067416A (ko) | 2020-11-17 | 2022-05-24 | 세메스 주식회사 | 주행 장치 및 이를 이용한 약액 토출 장치 |
CN113289849A (zh) * | 2021-05-18 | 2021-08-24 | 杨万涛 | 一种tft基板制造用框胶涂布装置及基板制造工艺 |
US11805634B2 (en) * | 2021-08-03 | 2023-10-31 | Illinois Tool Works Inc. | Tilt and rotate dispenser having motion control |
US11904337B2 (en) | 2021-08-03 | 2024-02-20 | Illinois Tool Works Inc. | Tilt and rotate dispenser having material flow rate control |
KR102602833B1 (ko) * | 2021-09-30 | 2023-11-16 | 엔젯 주식회사 | 복수의 노즐 헤드를 구비한 프린팅 장치 및 복수의 노즐팁 정렬 방법 |
CN114160366B (zh) * | 2021-10-13 | 2023-05-09 | 惠州市盈旺精密技术股份有限公司 | 保压治具拆装夹设备及手机点胶自动生产线 |
CN114011662B (zh) * | 2021-11-12 | 2022-07-12 | 绍兴奥美电子科技有限公司 | 一种点胶机用基座正位机构及其方法 |
CN114226159A (zh) * | 2021-11-24 | 2022-03-25 | 江苏中车电机有限公司 | 一种螺栓的螺牙槽内涂抹设备 |
CN114769067B (zh) * | 2022-04-29 | 2024-01-05 | 广东安达智能装备股份有限公司 | 一种点胶阀纠偏机构及带有点胶阀纠偏机构的点胶设备 |
TWI825719B (zh) * | 2022-05-13 | 2023-12-11 | 庫力索法高科股份有限公司 | 雙閥自動校正的系統及方法 |
CN114833035B (zh) * | 2022-05-19 | 2024-01-09 | 深圳市昌富祥智能科技有限公司 | 一种多功能点胶机构及其使用方法 |
KR102674351B1 (ko) * | 2022-06-20 | 2024-06-13 | 한국기계연구원 | 하이브리드 디스펜싱 시스템 및 이를 이용한 하이브리드 디스펜싱 방법 |
CN115518838B (zh) * | 2022-11-23 | 2023-05-23 | 苏州佳祺仕科技股份有限公司 | 一种点胶控制方法、装置、设备及存储介质 |
CN117531658B (zh) * | 2024-01-09 | 2024-03-22 | 阳光中科(福建)能源股份有限公司 | 一种太阳能电池片边框涂胶机 |
CN117585437B (zh) * | 2024-01-18 | 2024-03-22 | 内蒙古北科交大机器人有限公司 | 一种磁材上料装置及点胶系统 |
Family Cites Families (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6211570A (ja) * | 1985-07-05 | 1987-01-20 | Honda Motor Co Ltd | 自動塗布装置 |
US5044900A (en) | 1990-03-01 | 1991-09-03 | Knight Tool Company, Inc. | Positive displacement shuttle pump |
US6082289A (en) | 1995-08-24 | 2000-07-04 | Speedline Technologies, Inc. | Liquid dispensing system with controllably movable cartridge |
US5795390A (en) | 1995-08-24 | 1998-08-18 | Camelot Systems, Inc. | Liquid dispensing system with multiple cartridges |
US5747102A (en) | 1995-11-16 | 1998-05-05 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
US5819983A (en) | 1995-11-22 | 1998-10-13 | Camelot Sysems, Inc. | Liquid dispensing system with sealing augering screw and method for dispensing |
US6112588A (en) | 1996-10-25 | 2000-09-05 | Speedline Technologies, Inc. | Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system |
US5837892A (en) | 1996-10-25 | 1998-11-17 | Camelot Systems, Inc. | Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system |
US6412328B1 (en) | 1996-10-25 | 2002-07-02 | Speedline Technologies, Inc. | Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system |
US6258165B1 (en) | 1996-11-01 | 2001-07-10 | Speedline Technologies, Inc. | Heater in a conveyor system |
US5985029A (en) | 1996-11-08 | 1999-11-16 | Speedline Technologies, Inc. | Conveyor system with lifting mechanism |
US5886494A (en) | 1997-02-06 | 1999-03-23 | Camelot Systems, Inc. | Positioning system |
US6641030B1 (en) | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
US6427903B1 (en) | 1997-02-06 | 2002-08-06 | Speedline Technologies, Inc. | Solder ball placement apparatus |
US5903125A (en) | 1997-02-06 | 1999-05-11 | Speedline Technologies, Inc. | Positioning system |
US6056190A (en) | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
US6093251A (en) | 1997-02-21 | 2000-07-25 | Speedline Technologies, Inc. | Apparatus for measuring the height of a substrate in a dispensing system |
US5918648A (en) | 1997-02-21 | 1999-07-06 | Speedline Techologies, Inc. | Method and apparatus for measuring volume |
US6085943A (en) | 1997-06-30 | 2000-07-11 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
US5957343A (en) | 1997-06-30 | 1999-09-28 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
US6119895A (en) | 1997-10-10 | 2000-09-19 | Speedline Technologies, Inc. | Method and apparatus for dispensing materials in a vacuum |
US6206964B1 (en) | 1997-11-10 | 2001-03-27 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
US6007631A (en) | 1997-11-10 | 1999-12-28 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
US6214117B1 (en) | 1998-03-02 | 2001-04-10 | Speedline Technologies, Inc. | Dispensing system and method |
US6866881B2 (en) | 1999-02-19 | 2005-03-15 | Speedline Technologies, Inc. | Dispensing system and method |
US6173864B1 (en) | 1999-04-23 | 2001-01-16 | Nordson Corporation | Viscous material dispensing system and method with feedback control |
US6216917B1 (en) | 1999-07-13 | 2001-04-17 | Speedline Technologies, Inc. | Dispensing system and method |
US6541063B1 (en) | 1999-11-04 | 2003-04-01 | Speedline Technologies, Inc. | Calibration of a dispensing system |
US6514569B1 (en) | 2000-01-14 | 2003-02-04 | Kenneth Crouch | Variable volume positive displacement dispensing system and method |
US6444035B1 (en) | 2000-01-28 | 2002-09-03 | Speedline Technologies, Inc. | Conveyorized vacuum injection system |
US6644238B2 (en) | 2000-01-28 | 2003-11-11 | Speedline Technologies, Inc. | Conveyorized vacuum injection system |
US6689219B2 (en) * | 2001-03-15 | 2004-02-10 | Michael Antoine Birmingham | Apparatus and method for dispensing viscous liquid material |
JP3701882B2 (ja) * | 2001-05-25 | 2005-10-05 | 株式会社 日立インダストリイズ | ペースト塗布機 |
US6688458B2 (en) | 2001-10-09 | 2004-02-10 | Speedline Technologies, Inc. | System and method for controlling a conveyor system configuration to accommodate different size substrates |
US6775879B2 (en) | 2001-10-10 | 2004-08-17 | Speedline Technologies, Inc. | Needle cleaning system |
JP4154882B2 (ja) * | 2001-10-22 | 2008-09-24 | セイコーエプソン株式会社 | 描画装置、並びに液晶表示装置の製造方法、有機el装置の製造方法、電子放出装置の製造方法、pdp装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機elの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
US6991825B2 (en) | 2002-05-10 | 2006-01-31 | Asm Assembly Automation Ltd. | Dispensation of controlled quantities of material onto a substrate |
US20040148763A1 (en) * | 2002-12-11 | 2004-08-05 | Peacock David S. | Dispensing system and method |
JP4481576B2 (ja) * | 2003-02-28 | 2010-06-16 | 芝浦メカトロニクス株式会社 | ペースト塗布装置 |
US20050056215A1 (en) * | 2003-03-11 | 2005-03-17 | Shibaura Mechantronics Corporation | Apparatus for applying paste and method of applying paste |
JP4117793B2 (ja) * | 2003-03-11 | 2008-07-16 | 芝浦メカトロニクス株式会社 | ペースト塗布装置 |
US6932280B2 (en) | 2003-05-02 | 2005-08-23 | Speedline Technologies, Inc. | Adjustable needle foot for dispensing system |
JP2007502697A (ja) * | 2003-08-21 | 2007-02-15 | ミックスパック システムズ アーゲー | 構成成分を移送、混合および分配する装置および方法 |
US7404861B2 (en) | 2004-04-23 | 2008-07-29 | Speedline Technologies, Inc. | Imaging and inspection system for a dispenser and method for same |
US20060093751A1 (en) * | 2004-11-04 | 2006-05-04 | Applied Materials, Inc. | System and methods for inkjet printing for flat panel displays |
US20060193969A1 (en) | 2005-02-25 | 2006-08-31 | Speedline Technologies, Inc. | Method and apparatus for streaming a viscous material on a substrate |
TWI298268B (en) * | 2005-07-08 | 2008-07-01 | Top Eng Co Ltd | Paste dispenser and method of controlling the same |
JP2007105643A (ja) | 2005-10-14 | 2007-04-26 | Hitachi Plant Technologies Ltd | ペースト塗布装置 |
KR100649963B1 (ko) | 2006-05-25 | 2006-11-28 | 주식회사 탑 엔지니어링 | 페이스트 디스펜서의 헤드 유닛 |
JP4973842B2 (ja) * | 2006-08-21 | 2012-07-11 | Tdk株式会社 | 液滴塗布装置及び方法 |
US7980197B2 (en) | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
JP4866715B2 (ja) | 2006-12-20 | 2012-02-01 | 芝浦メカトロニクス株式会社 | ペースト塗布装置 |
US7524015B2 (en) * | 2006-12-20 | 2009-04-28 | Palo Alto Research Center Incorporated | Method of printing smooth micro-scale features |
TWI323189B (en) | 2006-12-29 | 2010-04-11 | Ind Tech Res Inst | Real-time dispenser fault detection and classification method |
CN100563735C (zh) * | 2007-03-29 | 2009-12-02 | 林军华 | 输液器滴斗组件的组装工艺及其装置 |
JP4367524B2 (ja) * | 2007-05-22 | 2009-11-18 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
TWI323190B (en) * | 2007-05-23 | 2010-04-11 | Kromax Internat Corp | Automatic dispensing system with the capability of synchronously loading under-processing article and unloading processed article and the process of using the same |
US7923056B2 (en) | 2007-06-01 | 2011-04-12 | Illinois Tool Works Inc. | Method and apparatus for dispensing material on a substrate |
US7833572B2 (en) * | 2007-06-01 | 2010-11-16 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
TWI369028B (en) * | 2007-09-10 | 2012-07-21 | Hon Hai Prec Ind Co Ltd | Multi-band antenna |
JP5037277B2 (ja) * | 2007-09-18 | 2012-09-26 | パナソニック株式会社 | 粘性流体塗布装置 |
JP4891185B2 (ja) * | 2007-09-18 | 2012-03-07 | パナソニック株式会社 | 粘性流体塗布装置 |
JP4898753B2 (ja) * | 2008-08-26 | 2012-03-21 | ヤマハ発動機株式会社 | 部品実装システム、部品実装方法、基板貼付状態検出装置、動作条件データ作成装置、基板貼付装置、部品搭載装置および検査装置 |
KR101026426B1 (ko) * | 2008-08-27 | 2011-04-07 | 주식회사 탑 엔지니어링 | 디스펜서 및 이를 이용한 실런트 등의 도포 방법 |
JP2010199264A (ja) | 2009-02-25 | 2010-09-09 | Seiko Epson Corp | 配線基板製造装置および配線基板の製造方法 |
US8389057B2 (en) * | 2009-04-06 | 2013-03-05 | Douglas Knox | Systems and methods for printing electronic device assembly |
US8136705B2 (en) | 2009-04-09 | 2012-03-20 | Illinois Tool Works Inc. | Magnetic drive for dispensing apparatus |
KR101115916B1 (ko) * | 2009-10-20 | 2012-02-22 | 주식회사 탑 엔지니어링 | 페이스트 디스펜서 및 그 제어방법 |
JP5275960B2 (ja) * | 2009-11-25 | 2013-08-28 | 大日本スクリーン製造株式会社 | パターン形成方法およびパターン形成装置 |
JP5441644B2 (ja) * | 2009-12-01 | 2014-03-12 | 武蔵エンジニアリング株式会社 | 卓上型作業装置 |
US8714716B2 (en) | 2010-08-25 | 2014-05-06 | Illinois Tool Works Inc. | Pulsed air-actuated micro-droplet on demand ink jet |
US8616042B2 (en) | 2011-03-25 | 2013-12-31 | Illinois Tool Works Inc. | Method and apparatus for calibrating dispensed deposits |
US20130133574A1 (en) | 2011-11-29 | 2013-05-30 | Illinois Tool Works Inc. | Material deposition system for depositing materials on a substrate |
US20130136850A1 (en) | 2011-11-29 | 2013-05-30 | Illinois Tool Works Inc. | Method for depositing materials on a substrate |
US9374905B2 (en) * | 2013-09-30 | 2016-06-21 | Illinois Tool Works Inc. | Method and apparatus for automatically adjusting dispensing units of a dispenser |
-
2013
- 2013-09-30 US US14/041,300 patent/US9374905B2/en active Active
-
2014
- 2014-07-21 EP EP17187660.0A patent/EP3270679B1/en active Active
- 2014-07-21 KR KR1020177023906A patent/KR101901541B1/ko active IP Right Grant
- 2014-07-21 KR KR1020167009661A patent/KR101885010B1/ko active IP Right Grant
- 2014-07-21 JP JP2016518747A patent/JP6346273B2/ja active Active
- 2014-07-21 EP EP19170774.4A patent/EP3557968B1/en active Active
- 2014-07-21 CN CN201810516793.0A patent/CN108811330B/zh active Active
- 2014-07-21 CN CN201710798633.5A patent/CN107670902B/zh active Active
- 2014-07-21 CN CN201710798649.6A patent/CN107466200B/zh active Active
- 2014-07-21 EP EP17187642.8A patent/EP3270678B1/en active Active
- 2014-07-21 PL PL17187642T patent/PL3270678T3/pl unknown
- 2014-07-21 KR KR1020187017521A patent/KR102108664B1/ko active IP Right Grant
- 2014-07-21 EP EP14748071.9A patent/EP3053424B1/en active Active
- 2014-07-21 KR KR1020187017516A patent/KR102026041B1/ko active IP Right Grant
- 2014-07-21 KR KR1020197012554A patent/KR102055106B1/ko active IP Right Grant
- 2014-07-21 WO PCT/US2014/047499 patent/WO2015047521A1/en active Application Filing
- 2014-07-21 PL PL17187660T patent/PL3270679T3/pl unknown
- 2014-07-21 PT PT191707744T patent/PT3557968T/pt unknown
- 2014-07-21 PL PL19170774T patent/PL3557968T3/pl unknown
- 2014-07-21 CN CN201480061755.0A patent/CN105766078B/zh active Active
- 2014-07-21 HU HUE19170774A patent/HUE054968T2/hu unknown
- 2014-07-21 KR KR1020177023899A patent/KR101885047B1/ko active IP Right Grant
- 2014-08-07 TW TW103127096A patent/TWI624204B/zh active
- 2014-08-07 TW TW106128373A patent/TWI641302B/zh active
- 2014-08-07 TW TW106128372A patent/TWI627887B/zh active
-
2016
- 2016-05-26 US US15/165,120 patent/US9775250B2/en active Active
-
2017
- 2017-06-21 US US15/628,987 patent/US9936585B2/en active Active
- 2017-09-13 JP JP2017175500A patent/JP6346364B2/ja active Active
- 2017-09-13 JP JP2017175458A patent/JP6426808B2/ja active Active
-
2018
- 2018-02-06 US US15/890,016 patent/US10244634B2/en active Active
-
2019
- 2019-03-21 US US16/360,746 patent/US10966323B2/en active Active
- 2019-04-12 PH PH12019000165A patent/PH12019000165A1/en unknown
-
2021
- 2021-02-26 US US17/186,203 patent/US11395410B2/en active Active
- 2021-02-26 US US17/186,182 patent/US20210185824A1/en not_active Abandoned
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6346364B2 (ja) | ディスペンサーの供給ユニットを自動的に調整する方法 | |
US8230805B2 (en) | Method and apparatus for dispensing material on a substrate | |
KR101452844B1 (ko) | 점성 물질을 기판 상에 분배하기 위한 방법 및 장치 | |
JP7369177B2 (ja) | 同期供給から非同期供給に移行するシステム及び方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171005 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171005 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20171005 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20171025 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180109 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180405 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180424 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180524 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6346364 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |